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UC2706DWTR

Texas Instruments

UC2706DWTR by Texas Instruments

UC2706DWTR by Texas Instruments is a MOSFET Gate Driver with 2 functions, operating voltage range of 5-40V. It has a turn-on time of 0.14us and turn-off time of 0.13us, suitable for push-pull based MOSFET driver applications in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,293 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,293

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Digiode

USA . 3,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,830

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 231 parts In-Stock

1+ parts

$4.631

100+ parts

-

1k+ parts

$5.105

10k+ parts

-

231

$4.631

-

$5.105

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DigiPath Technology Company

USA . 1,507 parts In-Stock

1+ parts

$5.099

100+ parts

-

1k+ parts

-

10k+ parts

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1,507

$5.099

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-

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ChromeModa Solutions

Germany . 4,255 parts In-Stock

1+ parts

$5.203

100+ parts

$4.266

1k+ parts

-

10k+ parts

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4,255

$5.203

$4.266

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IDEA Electronic Components Group

UK . 140 parts In-Stock

1+ parts

$5.203

100+ parts

-

1k+ parts

$4.683

10k+ parts

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140

$5.203

-

$4.683

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AZTECH Wire

Italy . 335 parts In-Stock

1+ parts

$18.928

100+ parts

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10k+ parts

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335

$18.928

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One Stop Electronics

USA . 1,376 parts In-Stock

1+ parts

$33.500

100+ parts

-

1k+ parts

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10k+ parts

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1,376

$33.500

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A-Z Elektronik GmbH

Germany . 7,855 parts In-Stock

1+ parts

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100+ parts

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7,855

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Corphita

USA . 4,660 parts In-Stock

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4,660

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Overview

Enhance the performance of your electronic devices with the UC2706DWTR by Texas Instruments, a top-tier manufacturer known for delivering high-quality MOSFET Gate Drivers. This versatile component is designed to maximize efficiency and reliability in various applications, offering customers unparalleled value and benefits. With its innovative technology and precise engineering, the UC2706DWTR ensures seamless operation and optimal functionality, making it an essential choice for professionals seeking superior performance in their projects. Elevate your designs with this exceptional product and experience the difference that Texas Instruments can bring to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for applications where weight and reliability are important factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 40 V

High maximum supply voltage of 40 V provides flexibility in various power supply designs, making it suitable for a wide range of applications.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, simplifying the circuit design and saving space on the PCB.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, enabling compact and streamlined designs.

No. of Terminals: 16

Multiple terminals provide connectivity options and allow for versatile integration into different circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for applications where board real estate is limited.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables the device to withstand harsh environmental conditions, ensuring reliable performance in a variety of applications.

Minimum Operating Temperature: -25 °C

Wide temperature range allows the device to operate efficiently in both hot and cold climates, enhancing its versatility and usability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting electrical connections.

Nominal Supply Voltage: 20 V

Nominal supply voltage of 20 V is ideal for many power supply applications, providing a balance between power and efficiency.

Turn-on Time: 0.14 us

Fast turn-on time of 0.14 us ensures quick and efficient switching of the MOSFET, improving overall performance and response time.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm allows for high-density mounting on the PCB, enabling a compact and space-efficient design.

Nominal Output Peak Current Limit: 1.5 A

High output peak current limit of 1.5 A supports various load requirements and ensures reliable operation under different operating conditions.

Interface IC Type: PUSH-PULL BASED MOSFET DRIVER

Push-pull based interface IC type offers efficient and reliable control of the MOSFET, enabling precise switching and optimal performance.

Turn-off Time: 0.13 us

Short turn-off time of 0.13 us ensures fast switching of the MOSFET, reducing power losses and improving overall efficiency of the system.

Technical Specifications

MOSFET Gate Drivers UC2706DWTR attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Nominal Output Peak Current Limit:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.13 us

Turn-on Time:

.14 us

Width:

7.5 mm

Trade Compliance

UC2706DWTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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