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UC2714DTRG4

Texas Instruments

UC2714DTRG4 by Texas Instruments

UC2714DTRG4 by Texas Instruments is a MOSFET Gate Driver with 20V max supply voltage, 15V power supplies, and 0.2A max output current. Ideal for industrial applications requiring high side drivers with fast turn-on/off times of 0.1us. Package style is small outline, making it suitable for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,127 parts In-Stock

1+ parts

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8,127

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Digiode

USA . 723 parts In-Stock

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723

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,272 parts In-Stock

1+ parts

$8.346

100+ parts

-

1k+ parts

$8.974

10k+ parts

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2,272

$8.346

-

$8.974

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DigiPath Technology Company

USA . 1,895 parts In-Stock

1+ parts

$9.189

100+ parts

$8.454

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-

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1,895

$9.189

$8.454

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ChromeModa Solutions

Germany . 6,893 parts In-Stock

1+ parts

$9.377

100+ parts

$7.689

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6,893

$9.377

$7.689

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IDEA Electronic Components Group

UK . 1,912 parts In-Stock

1+ parts

$9.377

100+ parts

$8.908

1k+ parts

$8.439

10k+ parts

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1,912

$9.377

$8.908

$8.439

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AZTECH Wire

Italy . 349 parts In-Stock

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$17.555

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349

$17.555

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Ampacity Inc.

Singapore . 987 parts In-Stock

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$33.500

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987

$33.500

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One Stop Electronics

USA . 761 parts In-Stock

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$44.500

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761

$44.500

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Continental Prestige Electronics

USA . 6,496 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

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Corphita

USA . 4,376 parts In-Stock

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4,376

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Argo Parts USA

USA . 1,676 parts In-Stock

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1,676

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Experience superior performance and reliability with the Texas Instruments UC2714DTRG4 MOSFET Gate Driver. Manufactured by a trusted industry leader, this small outline package driver offers high side drive capability, dual terminal position, and a wide operating temperature range. Ideal for industrial applications, this buffer or inverter-based driver provides fast turn-on and turn-off times, ensuring efficient operation. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs for quality and innovation. Elevate your designs with the UC2714DTRG4 and unlock new possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the PCB.

Maximum Supply Voltage: 20 V

Can handle higher supply voltages, providing flexibility in design and application.

Power Supplies (V): 15

Optimal power supply voltage for efficient performance.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without compromising performance.

Maximum Output Current: 0.2 A

Capable of delivering high output current for driving MOSFETs effectively.

Technology: BIPOLAR

Utilizes bipolar technology for efficient and reliable operation.

Nominal Output Peak Current Limit: 2 A

Has a high peak current limit for handling surge currents during operation.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Offers flexibility in interfacing with MOSFETs, allowing for versatile applications.

Technical Specifications

MOSFET Gate Drivers UC2714DTRG4 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.2 A

Nominal Output Peak Current Limit:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.1 us

Turn-on Time:

.1 us

Width:

3.9 mm

Trade Compliance

UC2714DTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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