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IR2104S

Infineon Technologies

IR2104S by Infineon Technologies

IR2104S by Infineon Technologies is a MOSFET Gate Driver with a max supply voltage of 20V and max operating temperature of 125°C. It features a totem-pole output configuration and is suitable for automotive applications due to its high side driver capability. With a turn-on time of 0.82us, it offers efficient switching performance in compact dimensions.

Median Price

$2.730

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Voyager Components

USA . 39 parts In-Stock

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American Microsemiconductor Inc.

USA . 57 parts In-Stock

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$2.380

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Component Electronics Inc.

Canada . 70 parts In-Stock

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$2.310

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Freelance Electronics

USA . 74 parts In-Stock

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$22.738

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$23.874

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Q Components

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Vyrian

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ComSIT Distribution GmbH

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Digiode

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LIBRA Elektronik GmbH

Germany . 241 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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Connector Distribution Corp

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Right Parts Inc.

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Nova Conductors

Japan . 50 parts In-Stock

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Electronic Expediters

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Sunrise Surplus Inc.

USA . 44 parts In-Stock

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NAC Semi

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LittleDiode

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Distributors (Availability)

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Ampacity Inc.

Singapore . 984 parts In-Stock

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$1.500

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$1.500

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Benley Electronics

USA . 6 parts In-Stock

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$1.500

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$1.500

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Modulus Dynamics

Lithuania . 2,874 parts In-Stock

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$2.342

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$2.248

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$2.155

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2,874

$2.342

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$3.328

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$3.162

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$3.162

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$3.328

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Aztec Data Supply Inc.

USA . 1,871 parts In-Stock

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$3.474

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Corohmni

South Africa . 166 parts In-Stock

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Semicontronic

India . 1,580 parts In-Stock

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$9.500

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$9.262

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$9.215

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AZTECH Wire

Italy . 362 parts In-Stock

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Kepictronics

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RC Electronics

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Metaverse IC Inc.

Canada . 17,845 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Microchip USA

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Alle Elektronik GmbH

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Continental Prestige Electronics

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Glotronic Ltd.

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Argo Parts USA

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Corphita

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Bastille Electronics

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Overview

Unlock the full potential of your power electronics with the IR2104S by Infineon Technologies. Designed with precision and expertise, this MOSFET gate driver offers unparalleled quality and reliability for a wide range of applications. Whether you're in automotive, industrial, or consumer electronics, this small outline package delivers true output polarity and totem-pole output characteristics for superior performance. With a nominal supply voltage of 15V and maximum operating temperature of 125°C, the IR2104S ensures efficient and precise control of your power systems. Elevate your projects with the industry-leading technology of Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the package robust for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 20 V

With a high maximum supply voltage, this gate driver can handle a wide range of power requirements.

Package Shape: RECTANGULAR

Rectangular shape is a common and practical design for easy integration into existing systems.

Output Polarity: TRUE

True output polarity ensures accurate and consistent signal transmission.

High Side Driver: YES

Having a high-side driver allows for control of power transistors in both low-side and high-side configurations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability in harsh environments.

Turn-on Time: 0.82 us

Fast turn-on time ensures quick response and efficient operation.

Turn-off Time: 0.22 us

Short turn-off time helps in reducing switching losses and improving efficiency.

Technical Specifications

MOSFET Gate Drivers IR2104S attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

YES

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Nominal Output Peak Current Limit:

.36 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

15 V

Maximum Supply Voltage-1:

620 V

Minimum Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.22 us

Turn-on Time:

.82 us

Width:

3.9 mm

Trade Compliance

IR2104S Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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