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TVP3026-270BPCE

Texas Instruments

TVP3026-270BPCE by Texas Instruments

TVP3026-270BPCE by Texas Instruments is a Display Controller with 1280x1024 resolution, 8-bit data bus, and 14.31818 MHz clock frequency. It is used in commercial applications for driving displays with a supply voltage range of 4.75V to 5.25V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,803 parts In-Stock

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5,803

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Digiode

USA . 615 parts In-Stock

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615

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One Stop Electronics

USA . 1,347 parts In-Stock

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$3.000

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1,347

$3.000

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Parana Technologies

USA . 130 parts In-Stock

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$18.286

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$18.418

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130

$18.286

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$18.418

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AZTECH Wire

Italy . 835 parts In-Stock

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$19.705

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835

$19.705

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DigiPath Technology Company

USA . 836 parts In-Stock

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$20.135

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836

$20.135

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ChromeModa Solutions

Germany . 2,095 parts In-Stock

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$20.546

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$16.848

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2,095

$20.546

$16.848

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IDEA Electronic Components Group

UK . 1,286 parts In-Stock

1+ parts

$20.546

100+ parts

$19.519

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$18.491

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1,286

$20.546

$19.519

$18.491

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Corohmni

South Africa . 2,617 parts In-Stock

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$38.133

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Corphita

USA . 2,131 parts In-Stock

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Overview

Elevate your display experience with the TVP3026-270BPCE by Texas Instruments. Crafted with precision and quality, this display controller offers seamless performance and versatility for a wide range of applications. From vibrant digital signage to immersive gaming displays, this product delivers unrivaled value and benefits to customers looking for reliability and top-notch performance. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and elevates your visual experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the display controller lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance ensures stable and reliable performance even under fluctuating voltage conditions.

Address Bus Width: 4

The 4-bit address bus width allows for efficient communication and control of the display controller.

Package Shape: SQUARE

The square package shape provides compact and space-saving design integration options.

No. of Terminals: 160

The high number of terminals enable versatile connectivity and functionality for the display controller.

Package Style (Meter): FLATPACK

The flatpack package style offers easy installation and maintenance for the display controller.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement ensures efficient power usage and compatibility with various devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for the display controller to function even in cold environments.

Terminal Position: QUAD

The quad terminal position provides stable connectivity and easy installation of the display controller.

Display Config: 1280 X 1024 PIXELS

The high-resolution display configuration of 1280 x 1024 pixels offers clear and crisp image quality.

Maximum Seated Height: 4.1 mm

The low maximum seated height enables slim and sleek design integration of the display controller.

Width: 28 mm

The moderate width of 28mm allows for flexible installation and placement options in electronic devices.

External Data Bus Width: 8

The 8-bit external data bus width allows for efficient data transfer and processing for the display controller.

Maximum Clock Frequency: 14.31818 MHz

The high maximum clock frequency enables fast data processing and smooth operation of the display controller.

Length: 28 mm

The moderate length of 28mm offers balance in size and footprint for the display controller.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility and performance in standard operating environments.

Peripheral IC Type: DISPLAY CONTROLLER, PALETTE DAC

The inclusion of display controller and palette DAC peripheral IC types enhances the functionality and versatility of the product.

Technology: CMOS

The CMOS technology used in the display controller offers low power consumption and high reliability in operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure connectivity and ease of installation for the display controller.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources and devices.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for compact terminal layout and efficient space utilization.

Technical Specifications

Display Controllers TVP3026-270BPCE attributes and parameters. Explore more Display Controllers devices from Texas Instruments

Specs

Address Bus Width:

4

Maximum Clock Frequency:

14.31818 MHz

Display Config:

1280 X 1024 PIXELS

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G160

Length:

28 mm

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TVP3026-270BPCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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