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TSB43AB22APDT

Texas Instruments

TSB43AB22APDT by Texas Instruments

TSB43AB22APDT by Texas Instruments is a Serial Communication Controller with 32-bit Address Bus, operating at 3-3.6V. It supports IEEE1394 protocol for data transfer up to 50MBps. Ideal for PCI bus compatibility and low power applications in commercial temperature range.

Median Price

$6.025

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 183 parts In-Stock

1+ parts

$9.230

100+ parts

$6.740

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183

$9.230

$6.740

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Rochester

USA . 76,181 parts In-Stock

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$4.820

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$4.310

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$4.060

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$4.820

$4.310

$4.060

DigiKey

USA . 76,181 parts In-Stock

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$6.340

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$6.340

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Verical

USA . 40,321 parts In-Stock

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$6.025

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$5.388

10k+ parts

$5.075

40,321

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$6.025

$5.388

$5.075

RS (Exports)

UK . 33 parts In-Stock

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$5.390

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33

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$5.390

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Distributors (In-Stock)

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Digiode

USA . 4,102 parts In-Stock

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$5.073

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$5.073

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DigiKey Marketplace

USA . 77,351 parts In-Stock

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Vyrian

USA . 7,636 parts In-Stock

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7,636

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Cyclops Electronics Ltd

UK . 510 parts In-Stock

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510

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Prism Electronics

USA . 415 parts In-Stock

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415

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Fibra_Brandt Electronic GMBH

Germany . 5 parts In-Stock

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5

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LWI Electronics Inc

India . 5 parts In-Stock

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SPM Sales

USA . 5 parts In-Stock

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5

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Connector Distribution Corp

USA . 5 parts In-Stock

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5

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Right Parts Inc.

USA . 5 parts In-Stock

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Resion

USA . 1 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 131,766 parts In-Stock

1+ parts

$1.250

100+ parts

$1.190

1k+ parts

$1.150

10k+ parts

$4.630

131,766

$1.250

$1.190

$1.150

$4.630

Corphita

USA . 1,408 parts In-Stock

1+ parts

$4.806

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$4.806

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Parana Technologies

USA . 1,576 parts In-Stock

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$42.956

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1,576

$42.956

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ChromeModa Solutions

Germany . 1,418 parts In-Stock

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$48.265

100+ parts

$39.577

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1,418

$48.265

$39.577

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IDEA Electronic Components Group

UK . 499 parts In-Stock

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$48.265

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$45.852

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$43.438

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499

$48.265

$45.852

$43.438

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Microchip USA

USA . 2,666 parts In-Stock

1+ parts

$127.790

100+ parts

$125.570

1k+ parts

$124.460

10k+ parts

$123.350

2,666

$127.790

$125.570

$124.460

$123.350

Lixinc

USA . 16,167 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,060 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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DigiPath Technology Company

USA . 1,952 parts In-Stock

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$43.516

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Authorized Procurement Solutions

USA . 1,200 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Enhance your communication systems with the TSB43AB22APDT by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a leading product in the Serial Communication Controllers category, this device offers seamless data transfer at a blazing 50 MBps rate, making it ideal for applications requiring high-speed connectivity. With a wide range of power supplies and compatibility with PCI bus, this versatile component ensures optimal performance in various settings. Elevate your projects with the value and efficiency that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and cost.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in different power supply configurations.

No. of Terminals: 128

High number of terminals allow for versatile connectivity options and interfaces.

Maximum Data Transfer Rate: 50 MBps

High data transfer rate ensures fast and reliable communication between devices.

Communication Protocol: IEEE1394

Supports IEEE1394 communication protocol for reliable and standardized data exchange.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Bus Compatibility: PCI

Compatible with PCI bus interface for seamless integration with existing systems.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or standby periods, enhancing energy efficiency.

Technical Specifications

Serial Communication Controllers TSB43AB22APDT attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

24.576 MHz

Communication Protocol:

IEEE1394

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

2

No. of Serial I/Os:

1

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3,3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TSB43AB22APDT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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