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TSB14C01MHV

Texas Instruments

TSB14C01MHV by Texas Instruments

TSB14C01MHV by Texas Instruments is a MIL-STD-883 compliant LINE TRANSCEIVER with 68 terminals in a FLATPACK package. It features CERAMIC, GLASS-SEALED body material and is suitable for military-grade applications requiring high reliability and robust performance in harsh environments. The compact SQUARE shape with a terminal pitch of 0.635 mm makes it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,853 parts In-Stock

1+ parts

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2,853

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Digiode

USA . 1,992 parts In-Stock

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1,992

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$10.506

100+ parts

-

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329

$10.506

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Parana Technologies

USA . 1,474 parts In-Stock

1+ parts

$10.826

100+ parts

-

1k+ parts

$11.305

10k+ parts

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1,474

$10.826

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$11.305

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DigiPath Technology Company

USA . 2,041 parts In-Stock

1+ parts

$11.921

100+ parts

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2,041

$11.921

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IDEA Electronic Components Group

UK . 1,939 parts In-Stock

1+ parts

$12.164

100+ parts

$11.556

1k+ parts

$10.948

10k+ parts

-

1,939

$12.164

$11.556

$10.948

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ChromeModa Solutions

Germany . 235 parts In-Stock

1+ parts

$12.164

100+ parts

$9.974

1k+ parts

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235

$12.164

$9.974

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One Stop Electronics

USA . 1,582 parts In-Stock

1+ parts

$41.500

100+ parts

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1,582

$41.500

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Corphita

USA . 107 parts In-Stock

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107

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Overview

Enhance your electronic designs with the TSB14C01MHV from Texas Instruments, a top-tier manufacturer known for delivering high-quality components. As a MILITARY-grade Line Driver & Receiver, this IC offers unmatched reliability and performance in a compact, flatpack package. Perfect for demanding applications, the TSB14C01MHV ensures seamless communication between devices, making it an essential tool for engineers and hobbyists alike. Experience the superior value and benefits of Texas Instruments products with the TSB14C01MHV.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort.

Screening Level: MIL-STD-883

Conformance to MIL-STD-883 ensures high quality and reliability standards for military applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 68

With 68 terminals, this product offers comprehensive connectivity options for complex circuit configurations.

Package Style (Meter): FLATPACK

Flatpack package style provides a compact and sleek design, saving space and improving overall aesthetics.

Terminal Position: QUAD

Quad terminal position enables easy connection and integration with other components, simplifying the installation process.

Maximum Seated Height: 3.912 mm

Low maximum seated height allows for a slim profile, making this product suitable for applications with space constraints.

Width: 12.51 mm

Compact width dimension enables flexibility in placement and mounting options on the circuit board.

Length: 12.51 mm

The optimal length of 12.51 mm offers a balanced size for efficient use of space in electronic assemblies.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable performance under extreme temperature conditions, making it suitable for rugged environments.

Terminal Form: FLAT

Flat terminal form provides a secure and stable connection, reducing the risk of signal loss or interference.

Terminal Pitch: 0.635 mm

Fine terminal pitch of 0.635 mm allows for precise connections and high-density layouts, ideal for compact circuit designs.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type ensures efficient signal transmission and reception, enhancing the overall performance of the product.

Technical Specifications

Line Drivers & Receivers TSB14C01MHV attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-GQFP-F68

Length:

12.51 mm

No. of Functions:

1

No. of Terminals:

68

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

3.912 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12.51 mm

Trade Compliance

TSB14C01MHV Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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