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TSB14C01AMHV

Texas Instruments

TSB14C01AMHV by Texas Instruments

TSB14C01AMHV by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -55 to 125 °C. It has a max supply voltage of 5.25 V and min of 4.5 V, suitable for MILITARY applications requiring IEEE 1394 interface standard and CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,792 parts In-Stock

1+ parts

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1,792

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Vyrian

USA . 1,441 parts In-Stock

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1,441

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 854 parts In-Stock

1+ parts

$6.643

100+ parts

-

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854

$6.643

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Parana Technologies

USA . 738 parts In-Stock

1+ parts

$11.378

100+ parts

-

1k+ parts

$11.802

10k+ parts

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738

$11.378

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$11.802

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DigiPath Technology Company

USA . 143 parts In-Stock

1+ parts

$12.528

100+ parts

$11.526

1k+ parts

-

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143

$12.528

$11.526

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ChromeModa Solutions

Germany . 3,085 parts In-Stock

1+ parts

$12.784

100+ parts

$10.483

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-

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3,085

$12.784

$10.483

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IDEA Electronic Components Group

UK . 233 parts In-Stock

1+ parts

$12.784

100+ parts

$12.145

1k+ parts

$11.506

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233

$12.784

$12.145

$11.506

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One Stop Electronics

USA . 570 parts In-Stock

1+ parts

$44.500

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570

$44.500

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Corphita

USA . 2,897 parts In-Stock

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2,897

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Overview

Enhance your electronic designs with the TSB14C01AMHV by Texas Instruments, a top-quality line driver and receiver that offers unparalleled reliability and performance. Manufactured by industry leader Texas Instruments, this versatile component is perfect for a wide range of applications. Whether you're working on consumer electronics, industrial automation or telecommunications projects, this product delivers incredible value, benefits, and advantages to meet your needs. Upgrade your designs today with the TSB14C01AMHV and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability, making this product suitable for harsh environments.

Surface Mount: YES

The surface mount capability allows for easier installation and space-saving on PCBs.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in different power supply setups.

Maximum Operating Temperature: 125°C

The high maximum operating temperature range indicates that this product can withstand high temperature environments without compromising performance.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Line Drivers & Receivers TSB14C01AMHV attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-GQFP-F68

Length:

12.51 mm

No. of Functions:

2

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Low Current:

24 Amp

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFF

Package Equivalence Code:

QFL68,.5SQ,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

3.912 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

12.51 mm

Trade Compliance

TSB14C01AMHV Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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