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TSB14C01PM

Texas Instruments

TSB14C01PM by Texas Instruments

TSB14C01PM by Texas Instruments is a Line Transceiver IC with 64 terminals in a low profile, fine pitch flatpack package. It features Gull Wing terminals on a square body measuring 10mm x 10mm, suitable for surface mount applications. Ideal for commercial-grade temperature environments, this device offers high performance in data transmission and reception.

Median Price

$4.125

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$3.300

1k+ parts

$2.950

10k+ parts

$2.780

160

-

$3.300

$2.950

$2.780

DigiKey

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$4.340

1k+ parts

-

10k+ parts

-

160

-

$4.340

-

-

Verical

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$4.125

1k+ parts

$3.688

10k+ parts

$3.475

160

-

$4.125

$3.688

$3.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,845 parts In-Stock

1+ parts

$3.477

100+ parts

-

1k+ parts

-

10k+ parts

-

4,845

$3.477

-

-

-

Vyrian

USA . 5,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,955

-

-

-

-

DigiKey Marketplace

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Bristol Electronics

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,878 parts In-Stock

1+ parts

$3.294

100+ parts

-

1k+ parts

-

10k+ parts

-

3,878

$3.294

-

-

-

Vigor

Singapore . 160 parts In-Stock

1+ parts

$3.520

100+ parts

-

1k+ parts

-

10k+ parts

-

160

$3.520

-

-

-

Parana Technologies

USA . 131 parts In-Stock

1+ parts

$8.313

100+ parts

-

1k+ parts

$8.934

10k+ parts

-

131

$8.313

-

$8.934

-

DigiPath Technology Company

USA . 2,128 parts In-Stock

1+ parts

$9.153

100+ parts

$8.421

1k+ parts

-

10k+ parts

-

2,128

$9.153

$8.421

-

-

ChromeModa Solutions

Germany . 3,442 parts In-Stock

1+ parts

$9.340

100+ parts

$7.659

1k+ parts

-

10k+ parts

-

3,442

$9.340

$7.659

-

-

IDEA Electronic Components Group

UK . 1,111 parts In-Stock

1+ parts

$9.340

100+ parts

$8.873

1k+ parts

$8.406

10k+ parts

-

1,111

$9.340

$8.873

$8.406

-

Overview

Upgrade your communication systems with the TSB14C01PM by Texas Instruments. Designed with precision and quality in mind, this line driver and receiver offers unparalleled reliability and performance. Whether you're looking to enhance data transmission or improve signal integrity, this product is the perfect solution. With its compact design and advanced features, the TSB14C01PM is ideal for a wide range of applications. Trust Texas Instruments to deliver cutting-edge technology that meets your needs. Upgrade to the TSB14C01PM today and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and is resistant to damage, ensuring longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, fitting well within the layout design.

No. of Terminals: 64

With 64 terminals, this product can handle a large amount of data transfer, making it suitable for high-performance applications.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch design ensures precise connectivity and minimal signal interference, enhancing overall performance.

Terminal Position: QUAD

Quad terminal position allows for multiple connections in a compact area, maximizing efficiency in circuit design.

Maximum Seated Height: 1.6 mm

Low seated height saves space within the device enclosure, making it suitable for slim or compact designs.

Width: 10 mm

Compact width dimension saves space on the PCB, enabling more components to be integrated into the system.

Length: 10 mm

Compact length dimension saves space on the PCB, facilitating efficient design layout and maximizing use of available board space.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard environmental conditions, making it suitable for a wide range of applications.

Terminal Form: GULL WING

Gull Wing terminal form offers secure soldering connections and easy PCB mounting, enhancing reliability and simplifying assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling intricate circuit designs and efficient use of PCB real estate.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type ensures reliable and efficient data transmission between connected devices, making it suitable for communication applications.

Technical Specifications

Line Drivers & Receivers TSB14C01PM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TSB14C01PM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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