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ST3485EBD

STMicroelectronics

ST3485EBD by STMicroelectronics

ST3485EBD by STMicroelectronics is a line driver with 3.3V power supply, 30ns max transmit delay, and EIA-422/EIA-485 interface standard. Ideal for industrial applications requiring differential output and Schmitt trigger input characteristics in a compact small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 72,441 parts In-Stock

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Digiode

USA . 3,580 parts In-Stock

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3,580

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Anansix

USA . 2,143 parts In-Stock

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2,143

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Vyrian

USA . 804 parts In-Stock

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804

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Martec Srl

Italy . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$4.152

100+ parts

$3.944

1k+ parts

$3.944

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350

$4.152

$3.944

$3.944

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IDEA Electronic Components Group

UK . 1,978 parts In-Stock

1+ parts

$7.011

100+ parts

-

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$6.310

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1,978

$7.011

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$6.310

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AZTECH Wire

Italy . 376 parts In-Stock

1+ parts

$7.468

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-

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376

$7.468

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Corohmni

South Africa . 414 parts In-Stock

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$11.810

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414

$11.810

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Aztec Data Supply Inc.

USA . 2,190 parts In-Stock

1+ parts

$12.511

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-

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2,190

$12.511

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MKK Technologies

India . 902 parts In-Stock

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$13.184

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902

$13.184

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DigiPath Technology Company

USA . 902 parts In-Stock

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$13.184

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902

$13.184

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Semicontronic

India . 1,442 parts In-Stock

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$14.500

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$14.138

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$14.065

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1,442

$14.500

$14.138

$14.065

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Ampacity Inc.

Singapore . 842 parts In-Stock

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$38.500

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842

$38.500

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Lixinc

USA . 7,980 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,205 parts In-Stock

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Argo Parts USA

USA . 3,499 parts In-Stock

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Corphita

USA . 3,035 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,809 parts In-Stock

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$8.383

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1,809

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$8.383

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Continental Prestige Electronics

USA . 1,676 parts In-Stock

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1,676

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Bastille Electronics

Australia . 38 parts In-Stock

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Overview

Enhance your electronic designs with the ST3485EBD Line Driver & Receiver from STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics delivers cutting-edge solutions for a wide range of applications. Offering fast transmit and receive speeds, low power consumption, and industrial-grade temperature tolerance, this versatile component is a must-have for your next project. Trust STMicroelectronics to provide innovative technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Wide supply voltage range for flexibility in various applications.

Package Shape: RECTANGULAR

Standard shape for easy integration into existing designs.

Maximum Transmit Delay: 30 ns

Low transmit delay ensures fast and efficient data transmission.

Power Supplies (V): 3.3

Common power supply voltage for compatibility with different systems.

No. of Terminals: 8

Sufficient terminals for connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the circuit board.

Minimum Supply Voltage: 3 V

Low minimum supply voltage for efficient power usage.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, ideal for harsh conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for reliable connections.

Terminal Position: DUAL

Dual terminal position for flexibility in PCB layout.

Maximum Seated Height: 1.75 mm

Low profile design for compact setups.

Width: 3.9 mm

Narrow width for space-saving installation.

Maximum Output Low Current: 4 Amp

High output current capacity for driving loads.

Differential Output: YES

Differential output for noise immunity and signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time to prevent damage during soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature for lead-free soldering processes.

Length: 4.9 mm

Compact length for space-constrained applications.

Minimum Out Swing: 1.5 V

Low output swing for compatibility with various circuits.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Maximum Receive Delay: 50 ns

Low receive delay for quick response to incoming signals.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and mechanical stability.

Interface Standard: EIA-422; EIA-485

Compliant with industry standards for seamless integration.

Maximum Supply Current: 2.2 mA

Low supply current consumption for energy-efficient operation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input for noise immunity and signal conditioning.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and assembly.

Interface IC Type: LINE TRANSCEIVER

Designed as a line transceiver for efficient data transmission.

Technical Specifications

Line Drivers & Receivers ST3485EBD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

50 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

30 ns

Width:

3.9 mm

Trade Compliance

ST3485EBD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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