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ST34C86BDR

STMicroelectronics

ST34C86BDR by STMicroelectronics

ST34C86BDR from STMicroelectronics is a CMOS line receiver with 4 functions, operating b/w -40 °C to 85°C. It supports EIA-422/423 standards and features a max supply voltage of 5.5V and output current of 6A. Ideal for industrial applications requiring reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,259 parts In-Stock

1+ parts

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2,259

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Vyrian

USA . 2,250 parts In-Stock

1+ parts

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2,250

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Anansix

USA . 1,984 parts In-Stock

1+ parts

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1,984

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,002 parts In-Stock

1+ parts

$6.261

100+ parts

-

1k+ parts

$5.635

10k+ parts

-

2,002

$6.261

-

$5.635

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MKK Technologies

India . 721 parts In-Stock

1+ parts

$11.773

100+ parts

-

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721

$11.773

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DigiPath Technology Company

USA . 721 parts In-Stock

1+ parts

$11.773

100+ parts

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721

$11.773

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Corphita

USA . 3,448 parts In-Stock

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3,448

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Parana Technologies

USA . 1,017 parts In-Stock

1+ parts

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100+ parts

$7.486

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1,017

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$7.486

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Overview

Elevate your designs with the ST34C86BDR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This versatile line driver and receiver excels in delivering robust performance across various applications, ensuring reliable data transmission even in harsh conditions. With its compact design, low power consumption, and exceptional temperature range, the ST34C86BDR provides unmatched value, empowering your projects with efficiency and durability that stand out in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight construction enhances long-term reliability and reduces the weight of the application.

Surface Mount: YES

Allows for efficient PCB space utilization and automated assembly processes, making it suitable for modern electronic designs.

Maximum Supply Voltage: 5.5 V

Provides flexibility for various applications while maintaining safe operating conditions, ensuring device longevity.

No. of Functions: 4

Supports multiple functionalities in a single component, reducing component count and saving on PCB space.

Package Shape: RECTANGULAR

Compact and efficient design ideal for high-density applications, facilitating better layout options on PCBs.

Power Supplies (V): 5

Standard voltage supply compatibility, minimizing the need for specialized power supply circuits.

No. of Terminals: 16

Offers ample I/O connections for various configurations and enhances design flexibility.

Package Style (Meter): SMALL OUTLINE

Space-saving design makes it suitable for compact applications, optimizing overall device size.

Minimum Supply Voltage: 4.5 V

Ensures compatibility with a wide range of power sources, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

Operational stability at higher temperatures ensures reliability in industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range support makes it ideal for harsh environments and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and electrical conductivity, ensuring reliable connections over time.

Terminal Position: DUAL

Allows for multiple mounting configurations, enhancing design versatility and ease of integration.

Maximum Seated Height: 1.75 mm

Low profile design suits space-constrained applications while maintaining compatibility with high-density layouts.

Width: 3.9 mm

Compact width contributes to effective space management on PCB, ideal for miniaturized devices.

Maximum Output Low Current: 6 Amp

Capable of providing high current for downstream devices, making it suitable for power-intensive applications.

Receiver No. of Bits: 4

Supports multi-bit data transmission, improving overall data handling and processing capabilities.

Length: 9.9 mm

Compact length aids in fitting complex circuits into smaller designs without compromising performance.

Temperature Grade: INDUSTRIAL

Designed for robust performance in industrial settings, making it reliable for demanding applications.

Maximum Receive Delay: 30 ns

Fast response time ensures high-speed data processing, suitable for time-critical applications.

Technology: CMOS

Low power consumption and high speed make this device efficient and effective for modern applications.

Terminal Form: GULL WING

Standard gull wing leads facilitate straightforward soldering and assembly processes.

Interface Standard: EIA-422; EIA-423

Compliance with standard communication protocols ensures interoperability with existing systems.

Maximum Supply Current: 23 mA

Power-efficient operation reduces overall system power consumption, making it more environmentally friendly.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides improved noise immunity and signal integrity, ideal for reliable data transmission.

Nominal Supply Voltage: 5 V

Common voltage level that aligns with many standard power supplies, enhancing design convenience.

Terminal Pitch: 1.27 mm

Standard pitch ensures compatibility with most PCB layouts, easing the design process.

Moisture Sensitivity Level (MSL): 3

Adequate handling precautions ensure product reliability and longevity when used in varying environments.

Interface IC Type: LINE RECEIVER

Specialized for line receiving applications, ensuring optimal performance in communication systems.

Technical Specifications

Line Drivers & Receivers ST34C86BDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-423

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

23 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

ST34C86BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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