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ST34C86BTR

STMicroelectronics

ST34C86BTR by STMicroelectronics

ST34C86BTR by STMicroelectronics is a CMOS line receiver with a max supply voltage of 5.5V and operates in industrial temperatures from -40 °C to 85°C. It features 4 functions, supports EIA-422/423 standards, and has a max output low current of 6A. Ideal for high-speed data transmission in compact applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,080

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-

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Vyrian

USA . 1,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,560

-

-

-

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Digiode

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,234

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,423 parts In-Stock

1+ parts

$11.510

100+ parts

-

1k+ parts

$10.359

10k+ parts

-

1,423

$11.510

-

$10.359

-

MKK Technologies

India . 657 parts In-Stock

1+ parts

$21.644

100+ parts

-

1k+ parts

-

10k+ parts

-

657

$21.644

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-

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DigiPath Technology Company

USA . 657 parts In-Stock

1+ parts

$21.644

100+ parts

-

1k+ parts

-

10k+ parts

-

657

$21.644

-

-

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Corphita

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

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-

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Parana Technologies

USA . 1,306 parts In-Stock

1+ parts

-

100+ parts

$13.762

1k+ parts

-

10k+ parts

-

1,306

-

$13.762

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Overview

Unlock exceptional performance with the ST34C86BTR from STMicroelectronics, a leader in innovative semiconductor solutions. This line driver and receiver promises reliability across diverse applications, ensuring seamless communication even in challenging environments. Its compact design and low power consumption deliver efficiency without compromising quality. Trust in STMicroelectronics to elevate your projects with unmatched durability and superior technology that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and adequate protection against environmental factors, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, ideal for high-density applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product ensures compatibility with a wide range of logic levels while safeguarding against over-voltage conditions.

No. of Functions: 4

Offering four functions enhances versatility, enabling integration into complex systems without the need for multiple components.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient utilization of PCB space and simplifies layout design.

Power Supplies (V): 5

Operating at a nominal voltage of 5 V aligns with standard logic levels, facilitating easy interfacing with other components.

No. of Terminals: 16

Sixteen terminals allow for multiple connections, supporting complex signaling while maintaining a streamlined design.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space on PCBs, making it perfect for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable performance in systems with fluctuating power levels.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C enables use in high-temperature environments, ensuring durability and reliability in various applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for extreme conditions, making it ideal for industrial and automotive applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish enhances solderability and ensures good electrical connections during assembly.

Terminal Position: DUAL

The dual terminal position simplifies layout and can provide redundant connections for increased reliability.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm ensures compatibility with low-profile designs, important for compact electronic devices.

Width: 4.4 mm

The width of 4.4 mm allows for easy integration into tight spaces on PCBs without compromising performance.

Maximum Output Low Current: 6 Amp

The ability to handle up to 6 amps of maximum output low current makes this device suitable for driving heavy loads without overheating.

Receiver No. of Bits: 4

With a 4-bit receiver, this product is able to process multiple data streams, enhancing its utility for complex applications.

Length: 5 mm

A compact length of 5 mm fits well in tight layouts, adding to design flexibility.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product ensures reliability in demanding environments.

Maximum Receive Delay: 30 ns

A low maximum receive delay of 30 ns allows for high-speed data communication, ensuring efficient system performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this device energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and are well-suited for automated assembly processes.

Interface Standard: EIA-422; EIA-423

Compliance with EIA-422 and EIA-423 standards ensures compatibility with a wide range of communication devices, enhancing its application range.

Maximum Supply Current: 23 mA

A maximum supply current of just 23 mA helps minimize power consumption, making this device energy-efficient.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics improve noise immunity and signal integrity, making it suitable for long-distance communication.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard, simplifying integration into existing systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm ensures compatibility with standard PCB layouts while maximizing space efficiency.

Interface IC Type: LINE RECEIVER

As a line receiver, this IC effectively transmits data over long distances, making it an essential component in reliable communication systems.

Technical Specifications

Line Drivers & Receivers ST34C86BTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-423

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

23 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

ST34C86BTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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