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TSB14C01MHVB

Texas Instruments

TSB14C01MHVB by Texas Instruments

TSB14C01MHVB by Texas Instruments is a MIL-STD-883 compliant LINE TRANSCEIVER with 68 terminals in a FLATPACK package. It features CERAMIC, GLASS-SEALED body material and is suitable for military-grade applications requiring high reliability and performance in compact spaces. With a terminal pitch of 0.635 mm, it offers robust communication capabilities in a small form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,345

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-

-

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Digiode

USA . 3,798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,798

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 789 parts In-Stock

1+ parts

$3.949

100+ parts

-

1k+ parts

$4.421

10k+ parts

-

789

$3.949

-

$4.421

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DigiPath Technology Company

USA . 1,174 parts In-Stock

1+ parts

$4.348

100+ parts

$4.000

1k+ parts

-

10k+ parts

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1,174

$4.348

$4.000

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IDEA Electronic Components Group

UK . 1,223 parts In-Stock

1+ parts

$4.437

100+ parts

-

1k+ parts

$3.993

10k+ parts

-

1,223

$4.437

-

$3.993

-

ChromeModa Solutions

Germany . 983 parts In-Stock

1+ parts

$4.437

100+ parts

$3.638

1k+ parts

-

10k+ parts

-

983

$4.437

$3.638

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-

AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$16.054

100+ parts

-

1k+ parts

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10k+ parts

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873

$16.054

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One Stop Electronics

USA . 380 parts In-Stock

1+ parts

$30.500

100+ parts

-

1k+ parts

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10k+ parts

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380

$30.500

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-

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Corphita

USA . 4,272 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,272

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Overview

Elevate your electronic designs with the TSB14C01MHVB by Texas Instruments. Crafted with precision and expertise, this line driver and receiver offers unparalleled quality and reliability. Ideal for military-grade applications, this product ensures seamless communication and robust performance. Experience the value of Texas Instruments' superior technology, and elevate your projects to new heights with the TSB14C01MHVB.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material ensures durability and reliability, making this product suitable for various industrial applications.

Surface Mount: YES

The ability to surface mount this product makes it easy to integrate into PCBs, saving space and facilitating efficient assembly processes.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level ensures high quality and performance consistency, meeting stringent standards for reliability.

Package Shape: SQUARE

The square package shape provides a compact design, ideal for applications where space is limited.

No. of Terminals: 68

Having 68 terminals allows for complex communication and data transmission, making this product suitable for high-end applications.

Package Style (Meter): FLATPACK

The flatpack style offers easy integration and enhances heat dissipation, ensuring optimal performance and reliability.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and maintenance, simplifying installation and troubleshooting processes.

Maximum Seated Height: 3.912 mm

The low maximum seated height enables a slim profile, making this product suitable for applications where space constraints are a concern.

Width: 12.51 mm

The compact width of 12.51 mm allows for efficient use of board space, ideal for densely populated PCB designs.

Length: 12.51 mm

The length of 12.51 mm offers a balanced form factor, allowing for versatile placement in various system configurations.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environmental conditions, suitable for mission-critical applications.

Terminal Form: FLAT

The flat terminal form simplifies soldering and connection processes, ensuring secure and stable electrical connections.

Terminal Pitch: 0.635 mm

The fine terminal pitch of 0.635 mm enables high-density packaging, making this product suitable for applications requiring a compact design.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type ensures efficient data transmission and reliable communication, making this product suitable for demanding networking applications.

Technical Specifications

Line Drivers & Receivers TSB14C01MHVB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-GQFP-F68

Length:

12.51 mm

No. of Functions:

1

No. of Terminals:

68

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

3.912 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

12.51 mm

Trade Compliance

TSB14C01MHVB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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