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TSB14C01AMHVR

Texas Instruments

TSB14C01AMHVR by Texas Instruments

TSB14C01AMHVR by Texas Instruments is a Line Driver & Receiver IC with 2 functions. It operates b/w -55 to 125 °C and supports IEEE 1394 interface standard. Ideal for military-grade applications requiring CMOS technology and flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,287 parts In-Stock

1+ parts

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4,287

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Vyrian

USA . 3,668 parts In-Stock

1+ parts

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3,668

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,908 parts In-Stock

1+ parts

$2.170

100+ parts

-

1k+ parts

$2.682

10k+ parts

-

1,908

$2.170

-

$2.682

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DigiPath Technology Company

USA . 1,281 parts In-Stock

1+ parts

$2.389

100+ parts

$2.198

1k+ parts

-

10k+ parts

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1,281

$2.389

$2.198

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IDEA Electronic Components Group

UK . 616 parts In-Stock

1+ parts

$2.438

100+ parts

-

1k+ parts

$2.194

10k+ parts

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616

$2.438

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$2.194

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ChromeModa Solutions

Germany . 301 parts In-Stock

1+ parts

$2.438

100+ parts

$1.999

1k+ parts

-

10k+ parts

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301

$2.438

$1.999

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$8.140

100+ parts

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306

$8.140

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One Stop Electronics

USA . 1,349 parts In-Stock

1+ parts

$20.500

100+ parts

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1,349

$20.500

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Corphita

USA . 3,611 parts In-Stock

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3,611

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Overview

Experience seamless communication and superior performance with the TSB14C01AMHVR by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that are perfect for a wide range of applications. With its advanced technology and military-grade specifications, this product ensures reliability and efficiency. Say goodbye to communication breakdowns and hello to smooth operations with the TSB14C01AMHVR - the perfect solution for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort in the assembly process.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs without risk of damage, making it suitable for a variety of applications.

No. of Functions: 2

Provides versatility and flexibility in usage, allowing for multiple functions to be performed by the product.

Package Shape: SQUARE

Optimal shape for efficient use of space on a circuit board, maximizing the available area for other components.

No. of Terminals: 68

Offers a wide range of connectivity options for different systems and devices, enhancing compatibility.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperature environments, making it suitable for industrial and outdoor applications.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity, improving overall performance and efficiency.

Interface Standard: IEEE 1394

Complies with industry standards for data communication, ensuring compatibility with a wide range of devices and systems.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, making it easy to integrate into existing systems without the need for additional power supplies.

Technical Specifications

Line Drivers & Receivers TSB14C01AMHVR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-GQFP-F68

Length:

12.51 mm

No. of Functions:

2

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

3.912 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

12.51 mm

Trade Compliance

TSB14C01AMHVR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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