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TSB11C01DLR

Texas Instruments

TSB11C01DLR by Texas Instruments

TSB11C01DLR by Texas Instruments is a Line Driver & Receiver with 56 terminals, operating at 5V. It features IEEE 1394 interface standard, differential input characteristics, and max supply voltage of 5.25V. Ideal for commercial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,610 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,610

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Digiode

USA . 721 parts In-Stock

1+ parts

-

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-

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721

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 688 parts In-Stock

1+ parts

$11.541

100+ parts

-

1k+ parts

$11.950

10k+ parts

-

688

$11.541

-

$11.950

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DigiPath Technology Company

USA . 1,077 parts In-Stock

1+ parts

$12.708

100+ parts

$11.691

1k+ parts

-

10k+ parts

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1,077

$12.708

$11.691

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ChromeModa Solutions

Germany . 3,570 parts In-Stock

1+ parts

$12.967

100+ parts

$10.633

1k+ parts

-

10k+ parts

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3,570

$12.967

$10.633

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IDEA Electronic Components Group

UK . 132 parts In-Stock

1+ parts

$12.967

100+ parts

$12.319

1k+ parts

$11.670

10k+ parts

-

132

$12.967

$12.319

$11.670

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AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$15.608

100+ parts

-

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696

$15.608

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One Stop Electronics

USA . 1,569 parts In-Stock

1+ parts

$17.500

100+ parts

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1,569

$17.500

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Corphita

USA . 4,844 parts In-Stock

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4,844

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Overview

Elevate your communication systems with the TSB11C01DLR by Texas Instruments, a top-tier manufacturer known for their superior quality products. This Line Driver & Receiver offers unmatched reliability and performance, making it ideal for various applications. From industrial automation to consumer electronics, this product provides seamless connectivity and enhanced signal transmission. Experience the value of streamlined operations and improved efficiency with the TSB11C01DLR, setting new standards in communication technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Easy to install and saves space on the PCB, making it ideal for compact electronic devices.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs without getting damaged, offering flexibility in power supply options.

Power Supplies (V): 5

Operates efficiently at the standard voltage level, ensuring compatibility with most electronic systems.

No. of Terminals: 56

Provides ample connectivity options for various input and output connections, making it versatile for different applications.

Maximum Output Low Current: 12 Amp

Capable of delivering high current outputs, making it suitable for driving demanding loads without overheating.

Temperature Grade: COMMERCIAL

Designed to operate effectively within a commercial temperature range, making it suitable for typical indoor environments.

Interface Standard: IEEE 1394

Complies with a widely recognized interface standard, ensuring compatibility with a range of devices and systems.

Driver No. of Bits: 6

Provides ample data transmission capabilities with 6-bit drivers, allowing for efficient and reliable communication.

Technical Specifications

Line Drivers & Receivers TSB11C01DLR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

12 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

2.79 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TSB11C01DLR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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