Loading...

TSB14C01APMG4

Texas Instruments

TSB14C01APMG4 by Texas Instruments

TSB14C01APMG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 5V. It features a max supply voltage of 5.25V, suitable for IEEE 1394 interface applications. With a low profile flatpack package style and quad terminal position, it offers high performance in commercial-grade environments.

Median Price

$9.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 160 parts In-Stock

1+ parts

$9.000

100+ parts

$5.400

1k+ parts

$5.175

10k+ parts

-

160

$9.000

$5.400

$5.175

-

Vyrian

USA . 4,678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,678

-

-

-

-

Digiode

USA . 1,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,317

-

-

-

-

Dan-Mar Components

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,105 parts In-Stock

1+ parts

$7.091

100+ parts

-

1k+ parts

$7.617

10k+ parts

-

1,105

$7.091

-

$7.617

-

DigiPath Technology Company

USA . 789 parts In-Stock

1+ parts

$7.808

100+ parts

$7.183

1k+ parts

-

10k+ parts

-

789

$7.808

$7.183

-

-

IDEA Electronic Components Group

UK . 990 parts In-Stock

1+ parts

$7.967

100+ parts

-

1k+ parts

$7.170

10k+ parts

-

990

$7.967

-

$7.170

-

ChromeModa Solutions

Germany . 913 parts In-Stock

1+ parts

$7.967

100+ parts

$6.533

1k+ parts

-

10k+ parts

-

913

$7.967

$6.533

-

-

AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$19.779

100+ parts

-

1k+ parts

-

10k+ parts

-

614

$19.779

-

-

-

One Stop Electronics

USA . 983 parts In-Stock

1+ parts

$39.500

100+ parts

-

1k+ parts

-

10k+ parts

-

983

$39.500

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Corphita

USA . 4,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,284

-

-

-

-

Overview

Enhance your electronic projects with the TSB14C01APMG4 by Texas Instruments, a high-quality line driver and receiver designed to deliver reliable performance. Proudly manufactured by Texas Instruments, this product offers exceptional value and benefits for a wide range of applications. With its advanced technology and durable package body material, this line driver and receiver ensures seamless operation and superior functionality. Trust Texas Instruments for top-notch products that exceed expectations in both quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 5.25 V

Can handle high voltage inputs, ensuring reliable performance in various applications.

No. of Functions: 2

Provides multiple functions in a single package, saving space and simplifying design.

Package Shape: SQUARE

Square shape allows for efficient placement on circuit boards, optimizing space utilization.

Power Supplies (V): 5

Operates on standard 5V power supply, compatible with many existing systems.

No. of Terminals: 64

Provides ample connection points for integrating with other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch enables compact and high-density mounting.

Minimum Supply Voltage: 4.5 V

Can operate efficiently with low voltage inputs, offering flexibility in power requirements.

Maximum Operating Temperature: 70 °C

Withstands high operating temperatures, suitable for demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature environments, ensuring reliable performance in various settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable signal transmission.

Terminal Position: QUAD

Quad terminal layout facilitates easy connection and installation on circuit boards.

Maximum Seated Height: 1.6 mm

Low-profile design minimizes space requirements and allows for flexible board layout.

Width: 10 mm

Compact width enables easy integration into circuit board designs with limited space.

Maximum Output Low Current: 24 Amp

High output current capability ensures compatibility with a wide range of devices and systems.

Receiver No. of Bits: 2

Dual-bit receiver provides precise signal reception and transmission for accurate data communication.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for peak reflow temperature ensures proper soldering and reliable connection during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance enables reliable soldering for robust circuit assembly.

Length: 10 mm

Compact length allows for flexibility in board layout and space-saving installation.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard operating temperature range for reliable performance.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time communication and fast data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable solder connections for stable electrical connectivity.

Interface Standard: IEEE 1394

Compliance with IEEE 1394 standard ensures compatibility with industry-standard communication protocols.

Input Characteristics: STANDARD

Standard input characteristics ensure seamless integration with various systems and devices.

Nominal Supply Voltage: 5 V

Operates at standard 5V supply voltage, compatible with common power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact design.

Driver No. of Bits: 2

Dual-bit driver facilitates precise signal transmission and control for accurate data communication.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, suitable for controlled environments.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type provides efficient signal conversion and communication between different systems.

Technical Specifications

Line Drivers & Receivers TSB14C01APMG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

24 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.6 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TSB14C01APMG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 16