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TSB14C01AIPM

Texas Instruments

TSB14C01AIPM by Texas Instruments

TSB14C01AIPM by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 4.5-5.25V. It features a flatpack package style, quad terminal position, and Gull Wing form. Ideal for IEEE 1394 interface applications in industrial settings due to its low profile design and CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,726 parts In-Stock

1+ parts

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5,726

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Digiode

USA . 2,030 parts In-Stock

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2,030

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,070 parts In-Stock

1+ parts

$3.984

100+ parts

-

1k+ parts

$4.452

10k+ parts

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1,070

$3.984

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$4.452

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DigiPath Technology Company

USA . 1,431 parts In-Stock

1+ parts

$4.386

100+ parts

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1,431

$4.386

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ChromeModa Solutions

Germany . 6,043 parts In-Stock

1+ parts

$4.476

100+ parts

$3.670

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6,043

$4.476

$3.670

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IDEA Electronic Components Group

UK . 197 parts In-Stock

1+ parts

$4.476

100+ parts

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1k+ parts

$4.028

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197

$4.476

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$4.028

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AZTECH Wire

Italy . 658 parts In-Stock

1+ parts

$14.015

100+ parts

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658

$14.015

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One Stop Electronics

USA . 298 parts In-Stock

1+ parts

$48.500

100+ parts

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298

$48.500

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Corphita

USA . 4,963 parts In-Stock

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4,963

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Overview

Enhance your electronic designs with the TSB14C01AIPM from Texas Instruments, a leading manufacturer known for exceptional quality. As part of the Line Drivers & Receivers category, this product offers unparalleled reliability and performance for a wide range of applications. With advanced technology and precision engineering, customers can expect seamless integration and optimal functionality. Trust Texas Instruments to deliver value, benefits, and advantages that exceed expectations. Elevate your projects with the TSB14C01AIPM and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making it ideal for electronic components that need to be portable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage allows for versatility in different power supply configurations.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Package Shape: SQUARE

Square package shape is efficient for layout and placement on a circuit board.

Power Supplies (V): 5

Standard power supply voltage of 5V for compatibility with many systems.

No. of Terminals: 64

Having 64 terminals allows for connectivity to multiple components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style saves space and allows for dense circuit board designs.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage provides flexibility in power requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without performance degradation.

Terminal Position: QUAD

Quad terminal position enables easy connection to other components in a compact space.

Maximum Seated Height: 1.6 mm

Low seated height saves vertical space on the circuit board.

Width: 10 mm

Compact width for efficient use of space on the circuit board.

Maximum Output Low Current: 24 Amp

High maximum output low current capability ensures reliable signal transmission.

Receiver No. of Bits: 2

Having 2 bits in the receiver allows for accurate data transmission and reception.

Length: 10 mm

Compact length for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stability and performance in harsh environments.

Maximum Receive Delay: 0 ns

Zero maximum receive delay ensures real-time data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connection.

Interface Standard: IEEE 1394

Compliance with IEEE 1394 standard ensures compatibility with various devices and systems.

Input Characteristics: STANDARD

Standard input characteristics simplify the design and implementation process.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with many systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and connectivity.

Driver No. of Bits: 2

Having 2 bits in the driver ensures accurate and reliable signal transmission.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type is suitable for transmitting and receiving data signals over communication lines.

Technical Specifications

Line Drivers & Receivers TSB14C01AIPM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

24 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.6 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TSB14C01AIPM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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