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TSB14AA1PFB

Texas Instruments

TSB14AA1PFB by Texas Instruments

TSB14AA1PFB by Texas Instruments is a Serial Communication Controller with 48 terminals, supporting data rates up to 12.5 MBps at a max clock frequency of 100 MHz. Ideal for PCI bus applications, it operates b/w 0-70°C with low power mode and thin profile packaging.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,840 parts In-Stock

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Digiode

USA . 4,049 parts In-Stock

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4,049

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Distributors (Availability)

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AZTECH Wire

Italy . 839 parts In-Stock

1+ parts

$9.790

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839

$9.790

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One Stop Electronics

USA . 501 parts In-Stock

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$20.000

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501

$20.000

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Modulus Dynamics

Lithuania . 300 parts In-Stock

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$26.598

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$26.598

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$26.598

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300

$26.598

$26.598

$26.598

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Parana Technologies

USA . 1,428 parts In-Stock

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$35.687

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$35.687

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DigiPath Technology Company

USA . 775 parts In-Stock

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$39.296

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775

$39.296

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IDEA Electronic Components Group

UK . 2,035 parts In-Stock

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$40.098

100+ parts

$38.093

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$36.088

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2,035

$40.098

$38.093

$36.088

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ChromeModa Solutions

Germany . 81 parts In-Stock

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$40.098

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$32.880

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81

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$32.880

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Lixinc

USA . 18,770 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,209 parts In-Stock

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Corphita

USA . 3,790 parts In-Stock

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Kepictronics

USA . 1,409 parts In-Stock

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Microchip USA

USA . 138 parts In-Stock

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Overview

Unlock seamless communication with the TSB14AA1PFB by Texas Instruments. Crafted with precision and expertise, this serial communication controller is designed to elevate your connectivity experience. Whether you're in need of high-speed data transfer or reliable encoding/decoding methods, this product delivers. Compact yet powerful, it offers a wide range of applications while ensuring top-notch performance. Trust Texas Instruments to bring you quality and innovation, all in one sleek package. Elevate your communication game today with the TSB14AA1PFB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, making it suitable for compact electronic designs.

No. of Terminals: 48

With a higher number of terminals, the product can support more connections, enabling complex communication systems.

Maximum Data Transfer Rate: 12.5 MBps

The high data transfer rate enables quick and efficient communication, essential for high-speed applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stability and reliability even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in cold environments, increasing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency allows for fast data processing, making the product suitable for time-sensitive applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The product's peripheral IC type indicates its function as a serial communication controller, making it ideal for data transfer and communication tasks.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, enhancing overall efficiency and reliability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage specification indicates the standard operating voltage, ensuring compatibility with common power sources.

Technical Specifications

Serial Communication Controllers TSB14AA1PFB attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

100 MHz

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TSB14AA1PFB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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