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TS3DV642RUATQ1

Texas Instruments

TS3DV642RUATQ1 by Texas Instruments

TS3DV642RUATQ1 by Texas Instruments is a 12-channel differential multiplexer with 3.3V nominal voltage and 15dB off-state isolation. It operates b/w -40 to 105°C, has a max on-state resistance of 12 ohm, and is suitable for AEC-Q100 screening level automotive applications.

Median Price

$3.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,744 parts In-Stock

1+ parts

$2.230

100+ parts

$1.954

1k+ parts

$1.104

10k+ parts

-

11,744

$2.230

$1.954

$1.104

-

DigiKey

USA . 677 parts In-Stock

1+ parts

$3.260

100+ parts

$2.019

1k+ parts

$1.816

10k+ parts

$1.739

677

$3.260

$2.019

$1.816

$1.739

Mouser Electronics

USA . 79 parts In-Stock

1+ parts

$3.260

100+ parts

$2.250

1k+ parts

-

10k+ parts

-

79

$3.260

$2.250

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,579 parts In-Stock

1+ parts

$2.118

100+ parts

-

1k+ parts

-

10k+ parts

-

2,579

$2.118

-

-

-

Vyrian

USA . 7,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,011

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,152 parts In-Stock

1+ parts

$1.900

100+ parts

$1.852

1k+ parts

$1.843

10k+ parts

-

4,152

$1.900

$1.852

$1.843

-

Ampacity Inc.

Singapore . 3,945 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

-

3,945

$1.900

-

-

-

Corphita

USA . 598 parts In-Stock

1+ parts

$2.007

100+ parts

-

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-

10k+ parts

-

598

$2.007

-

-

-

Corohmni

South Africa . 400 parts In-Stock

1+ parts

$2.230

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$2.230

-

-

-

Parana Technologies

USA . 1,330 parts In-Stock

1+ parts

$2.591

100+ parts

-

1k+ parts

$3.082

10k+ parts

-

1,330

$2.591

-

$3.082

-

DigiPath Technology Company

USA . 1,796 parts In-Stock

1+ parts

$2.853

100+ parts

$2.625

1k+ parts

-

10k+ parts

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1,796

$2.853

$2.625

-

-

IDEA Electronic Components Group

UK . 573 parts In-Stock

1+ parts

$2.911

100+ parts

-

1k+ parts

$2.620

10k+ parts

-

573

$2.911

-

$2.620

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ChromeModa Solutions

Germany . 313 parts In-Stock

1+ parts

$2.911

100+ parts

$2.387

1k+ parts

-

10k+ parts

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313

$2.911

$2.387

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-

Microchip USA

USA . 9,640 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,640

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QUARKTWIN TECHNOLOGY LTD

USA . 7,931 parts In-Stock

1+ parts

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100+ parts

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7,931

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Overview

Discover the TS3DV642RUATQ1 by Texas Instruments, a high-quality multiplexer switch designed for various applications. With Texas Instruments' reputation for excellence, this chip carrier offers seamless switching capabilities with separate outputs and a low on-state resistance of 12 ohms. Ideal for differential multiplexing, this very thin profile switch features 12 channels and a wide operating temperature range. Experience reliable performance and precision with the TS3DV642RUATQ1, providing customers with unmatched value and flexibility in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and enabling efficient PCB design.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with standard power sources, making integration into existing systems straightforward.

No. of Terminals: 42

Provides ample connectivity options for multiple input and output channels, increasing versatility and functionality.

Maximum Operating Temperature: 105 °C

Ensures stable performance in high-temperature environments, making it suitable for a wide range of applications.

Width (mm): 3.5 mm

Compact size enables space-saving installation in smaller electronic devices or densely packed PCBs.

No. of Channels: 12

Offers multiple channel options for input and output signals, increasing the flexibility and capability of the multiplexer.

Technical Specifications

Multiplexers & Switches TS3DV642RUATQ1 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PQCC-N42

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

2

Normal Position (V):

NC

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

42

Nominal Off-state Isolation:

15 dB

Maximum On-state Resistance (Ron):

12 ohm

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC42,.14X.35,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-on Time:

100000 ns

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

TS3DV642RUATQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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