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TS3DV421DGVRG4

Texas Instruments

TS3DV421DGVRG4 by Texas Instruments

TS3DV421DGVRG4 by Texas Instruments is a 48-terminal audio/video switch with 4 channels. It operates at industrial temperature grade, with a max supply voltage of 2.1V and an off-state isolation of 50dB. This multiplexer has a low on-state resistance of 20 ohm and fast switching times of 9ns on and 5ns off, making it ideal for high-speed signal routing applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,331 parts In-Stock

1+ parts

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5,331

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Digiode

USA . 3,206 parts In-Stock

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3,206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 378 parts In-Stock

1+ parts

$0.500

100+ parts

-

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378

$0.500

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Semicontronic

India . 1,166 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,166

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 879 parts In-Stock

1+ parts

$2.500

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879

$2.500

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Parana Technologies

USA . 960 parts In-Stock

1+ parts

$3.634

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$4.144

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960

$3.634

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$4.144

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DigiPath Technology Company

USA . 762 parts In-Stock

1+ parts

$4.001

100+ parts

$3.681

1k+ parts

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762

$4.001

$3.681

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ChromeModa Solutions

Germany . 5,990 parts In-Stock

1+ parts

$4.083

100+ parts

$3.348

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5,990

$4.083

$3.348

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IDEA Electronic Components Group

UK . 856 parts In-Stock

1+ parts

$4.083

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$3.675

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856

$4.083

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$3.675

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AZTECH Wire

Italy . 649 parts In-Stock

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$15.614

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649

$15.614

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Corphita

USA . 2,169 parts In-Stock

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2,169

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Corohmni

South Africa . 335 parts In-Stock

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Overview

Elevate your audio and video experience with the TS3DV421DGVRG4 multiplexer switch from Texas Instruments. Crafted with precision and quality, this versatile component offers seamless switching capabilities for a wide range of applications. From enhancing the performance of your home entertainment system to optimizing signal routing in professional audio setups, this switch delivers unparalleled reliability and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that elevates your sound and visual experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to damage, making the product long-lasting and reliable.

Nominal Supply Voltage (Vsup): 1.8 V

Operates at a low nominal supply voltage, making it energy efficient and suitable for applications where power consumption is a concern.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without affecting performance, making it suitable for industrial applications where temperature fluctuation is common.

No. of Channels: 4

Offers multiple channels for switching, providing flexibility and versatility in connecting and controlling different audio/video sources.

Technical Specifications

Multiplexers & Switches TS3DV421DGVRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

48

Nominal Off-state Isolation:

50 dB

Maximum On-state Resistance (Ron):

20 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

2.1 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

5 ns

Maximum Switch-on Time:

9 ns

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

TS3DV421DGVRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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