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74LVC1G3157GW

NXP Semiconductors

74LVC1G3157GW by NXP Semiconductors

74LVC1G3157GW by NXP Semiconductors is a CMOS single-ended multiplexer with 2 channels. It operates at a supply voltage range of 1.65V to 5.5V and has a max on-state resistance of 38 ohm. With a small outline package style, it is ideal for automotive applications requiring fast switching times and high off-state isolation levels.

Median Price

$0.143

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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RS (Exports)

UK . 1,200 parts In-Stock

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Maritex

Poland . 125 parts In-Stock

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$0.066

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$0.060

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Chip Stock

USA . 486,500 parts In-Stock

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Bristol Electronics

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Speed Components Ltd

Israel . 2,430 parts In-Stock

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Semtec, LLC

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ComSIT Distribution GmbH

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Nova Conductors

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Semicontronic

India . 929 parts In-Stock

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$0.119

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Ampacity Inc.

Singapore . 792 parts In-Stock

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AZTECH Wire

Italy . 9,213 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,057 parts In-Stock

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Corohmni

South Africa . 931 parts In-Stock

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Lixinc

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Lucentia Tech

USA . 900 parts In-Stock

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Overview

Elevate your electronic projects with the 74LVC1G3157GW by NXP Semiconductors, a top-tier manufacturer known for its quality and reliability. This multiplexer/switch offers unmatched performance in a compact package, making it ideal for a wide range of applications. With fast switching times and low on-state resistance, this product provides excellent value and efficiency to customers seeking precision and speed in their designs. Upgrade your projects today with the NXP 74LVC1G3157GW and experience seamless functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance

Surface Mount: YES

Easy to install and saves space on PCB

Nominal Supply Voltage (Vsup): 2.7 V

Optimal voltage for efficient operation

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments like automotive applications

No. of Channels: 2

Allows for multiple input/output connections

Maximum On-state Resistance (Ron): 38 ohm

Low resistance for minimal signal loss

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity

Maximum Switch-off Time: 5 ns

Fast switching speed for responsive performance

Technical Specifications

Multiplexers & Switches 74LVC1G3157GW attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

42 dB

Maximum On-state Resistance (Ron):

38 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Signal Current:

.05 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Maximum Switch-off Time:

5 ns

Maximum Switch-on Time:

6 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

74LVC1G3157GW Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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