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TS3DV520RHURG4

Texas Instruments

TS3DV520RHURG4 by Texas Instruments

TS3DV520RHURG4 by Texas Instruments is a 5-channel audio/video switch with CMOS technology. It operates at a supply voltage range of 3-3.6V, offering low on-state resistance of 6 ohm and fast switching times of 15ns on and 9ns off. Ideal for industrial applications requiring high signal current capacity and excellent isolation performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,872 parts In-Stock

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6,872

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Digiode

USA . 4,344 parts In-Stock

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4,344

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Semi Source

USA . 2,000 parts In-Stock

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2,000

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Nova Conductors

Japan . 91 parts In-Stock

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91

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 748 parts In-Stock

1+ parts

$1.500

100+ parts

-

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748

$1.500

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One Stop Electronics

USA . 703 parts In-Stock

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$6.500

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703

$6.500

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AZTECH Wire

Italy . 610 parts In-Stock

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$13.108

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610

$13.108

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Parana Technologies

USA . 360 parts In-Stock

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$22.146

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$22.771

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360

$22.146

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$22.771

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DigiPath Technology Company

USA . 1,062 parts In-Stock

1+ parts

$24.385

100+ parts

$22.435

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1,062

$24.385

$22.435

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ChromeModa Solutions

Germany . 3,876 parts In-Stock

1+ parts

$24.883

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$20.404

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3,876

$24.883

$20.404

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IDEA Electronic Components Group

UK . 1,989 parts In-Stock

1+ parts

$24.883

100+ parts

$23.639

1k+ parts

$22.395

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1,989

$24.883

$23.639

$22.395

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A-Z Elektronik GmbH

Germany . 6,252 parts In-Stock

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Corphita

USA . 3,484 parts In-Stock

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Kepictronics

USA . 82 parts In-Stock

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82

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience unparalleled performance and reliability with the TS3DV520RHURG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality multiplexers & switches designed for a wide range of applications. With a package body material made of durable PLASTIC/EPOXY and a compact rectangular shape, this product offers a seamless integration into any project. Benefit from its nominal supply voltage of 3.3 V, low on-state resistance, and fast switch-on time to optimize your system's efficiency. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations. Elevate your projects with the TS3DV520RHURG4 today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and reliability for long-term use.

Surface Mount

YES - Allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage (Vsup)

3.3 V - Compatible with common voltage requirements in various applications.

No. of Terminals

56 - Offers versatility and flexibility for connecting multiple components.

Maximum Operating Temperature

85 °C - Ensures stable performance even under high temperature conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - Provides excellent conductivity and corrosion resistance for long-lasting use.

Technology

CMOS - Utilizes efficient and low-power consumption technology for energy-efficient operation.

No. of Channels

5 - Allows for multiple input/output connections for enhanced functionality.

Peak Reflow Temperature °C

260 - Withstands high temperatures during the soldering process for reliable assembly.

Maximum On-state Resistance (Ron)

6 ohm - Offers low resistance for efficient signal transmission.

Temperature Grade

INDUSTRIAL - Suitable for industrial settings with reliable operation under harsh conditions.

Technical Specifications

Multiplexers & Switches TS3DV520RHURG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N56

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

56

Nominal Off-state Isolation:

39 dB

Nominal On-state Resistance Match:

.4 ohm

Maximum On-state Resistance (Ron):

6 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.19X.43,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

9 ns

Maximum Switch-on Time:

15 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

TS3DV520RHURG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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