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TS3DS26227YZPR

Texas Instruments

TS3DS26227YZPR by Texas Instruments

TS3DS26227YZPR by Texas Instruments is a SPDT switch with 12 terminals in a grid array package. It is surface mountable and has ball terminal form. Ideal for applications requiring high-speed signal switching in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,805 parts In-Stock

1+ parts

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2,805

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Vyrian

USA . 2,500 parts In-Stock

1+ parts

-

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-

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2,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,539 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

1,539

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 200 parts In-Stock

1+ parts

$4.500

100+ parts

-

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-

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200

$4.500

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-

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Ampacity Inc.

Singapore . 354 parts In-Stock

1+ parts

$7.500

100+ parts

-

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354

$7.500

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-

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AZTECH Wire

Italy . 539 parts In-Stock

1+ parts

$8.862

100+ parts

-

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539

$8.862

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Parana Technologies

USA . 1,056 parts In-Stock

1+ parts

$15.125

100+ parts

-

1k+ parts

$15.529

10k+ parts

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1,056

$15.125

-

$15.529

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IDEA Electronic Components Group

UK . 1,388 parts In-Stock

1+ parts

$16.994

100+ parts

$16.144

1k+ parts

$15.295

10k+ parts

-

1,388

$16.994

$16.144

$15.295

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ChromeModa Solutions

Germany . 108 parts In-Stock

1+ parts

$16.994

100+ parts

$13.935

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-

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108

$16.994

$13.935

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DigiPath Technology Company

USA . 2,374 parts In-Stock

1+ parts

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$15.322

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2,374

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$15.322

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Corphita

USA . 1,110 parts In-Stock

1+ parts

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1,110

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Corohmni

South Africa . 149 parts In-Stock

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149

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Overview

Discover the unparalleled quality and reliability of the TS3DS26227YZPR by Texas Instruments! As a leading manufacturer in the industry, Texas Instruments delivers top-notch multiplexers & switches for a variety of applications. With surface mount capability and a grid array package style, this SPDT switch offers 12 terminals with a ball terminal form. Experience seamless switching with this high-performance product that provides unmatched value and benefits to customers across different industries.

Feature Benefit Bullets

Surface Mount: YES

This product is designed for surface mounting, allowing for easy installation on circuit boards and saving space.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, making it suitable for applications where space is limited.

No. of Terminals: 12

With 12 terminals, this multiplexer offers versatility and the ability to connect multiple input and output channels.

Package Style (Meter): GRID ARRAY

The grid array package style provides a precise arrangement of terminals, ensuring reliable connections and efficient signal processing.

Terminal Position: BOTTOM

The terminals positioned at the bottom of the package facilitate easy soldering and connection to the circuit board.

Other IC type: SPDT

This multiplexer features Single-Pole Double-Throw (SPDT) switches, offering a versatile signal routing capability for different applications.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections to the circuit board, enhancing the overall performance of the product.

Technical Specifications

Multiplexers & Switches TS3DS26227YZPR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-XBGA-B12

No. of Terminals:

12

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

BALL

Terminal Position:

BOTTOM

Trade Compliance

TS3DS26227YZPR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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