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TS3DV520ERHURG4

Texas Instruments

TS3DV520ERHURG4 by Texas Instruments

TS3DV520ERHURG4 by Texas Instruments is a 10-channel audio/video switch with CMOS technology. It operates at a supply voltage range of 3-3.6V and offers low on-state resistance of 0.4 ohm. With a compact chip carrier package, it is ideal for industrial applications requiring fast switching times and high isolation levels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,871 parts In-Stock

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4,871

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Vyrian

USA . 3,634 parts In-Stock

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3,634

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Nova Conductors

Japan . 55 parts In-Stock

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55

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Inventory MP

USA . 48 parts In-Stock

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48

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Bristol Electronics

USA . 48 parts In-Stock

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 227 parts In-Stock

1+ parts

$2.008

100+ parts

-

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$2.534

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227

$2.008

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$2.534

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DigiPath Technology Company

USA . 1,114 parts In-Stock

1+ parts

$2.211

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$2.034

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1,114

$2.211

$2.034

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ChromeModa Solutions

Germany . 3,260 parts In-Stock

1+ parts

$2.256

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$1.850

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3,260

$2.256

$1.850

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IDEA Electronic Components Group

UK . 2,137 parts In-Stock

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$2.256

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$2.030

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$2.256

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$2.030

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One Stop Electronics

USA . 1,103 parts In-Stock

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$5.500

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1,103

$5.500

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Ampacity Inc.

Singapore . 706 parts In-Stock

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$7.500

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706

$7.500

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AZTECH Wire

Italy . 435 parts In-Stock

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$14.028

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435

$14.028

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A-Z Elektronik GmbH

Germany . 4,674 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Microchip USA

USA . 1,793 parts In-Stock

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Corphita

USA . 758 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Upgrade your audio/video systems with the TS3DV520ERHURG4 by Texas Instruments, a top-of-the-line multiplexer/switch designed to deliver unmatched performance and reliability. Manufactured with high-quality materials and cutting-edge technology, this product is ideal for a wide range of applications in various industries. Enjoy seamless switching capabilities, low on-state resistance, and superior isolation for optimal signal integrity. Trust Texas Instruments to provide you with the best-in-class solutions that offer value, benefits, and advantages that exceed expectations. Elevate your projects with the TS3DV520ERHURG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and time during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage ensures compatibility with a wide range of electronic devices, making it versatile in various applications.

No. of Terminals: 56

With 56 terminals, this multiplexer/switch provides ample connectivity options for complex electronic systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability even in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance for long-term performance.

Output (V): SEPARATE OUTPUT

The separate output feature allows for signal isolation and minimizes crosstalk, ensuring clean and reliable signal transmission.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for slim and compact design, perfect for space-constrained applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that this product is resistant to moisture, ensuring long-term performance in humid environments.

Technical Specifications

Multiplexers & Switches TS3DV520ERHURG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N56

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

2

Normal Position (V):

NO

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

56

Nominal Off-state Isolation:

39 dB

Nominal On-state Resistance Match:

.4 ohm

Maximum On-state Resistance (Ron):

6 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.19X.43,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

9 ns

Maximum Switch-on Time:

15 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

TS3DV520ERHURG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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