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TS3DDR4000ZBAR

Texas Instruments

TS3DDR4000ZBAR by Texas Instruments

TS3DDR4000ZBAR by Texas Instruments is a 48-terminal single-ended multiplexer with 12 channels. It operates in industrial temperature range (-40 to 85°C) and has a max supply voltage of 3.6V. With a nominal bandwidth of 6000 kHz, it offers low on-state resistance (11.2 ohm) and high off-state isolation (34 dB), making it ideal for various switching applications.

Median Price

$2.610

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,493 parts In-Stock

1+ parts

$1.926

100+ parts

$1.591

1k+ parts

$0.860

10k+ parts

-

19,493

$1.926

$1.591

$0.860

-

DigiKey

USA . 4,707 parts In-Stock

1+ parts

$2.610

100+ parts

$1.591

1k+ parts

$1.408

10k+ parts

$1.328

4,707

$2.610

$1.591

$1.408

$1.328

Mouser Electronics

USA . 1,948 parts In-Stock

1+ parts

$2.610

100+ parts

$1.600

1k+ parts

$1.510

10k+ parts

-

1,948

$2.610

$1.600

$1.510

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$1.336

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-

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85

$1.336

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Digiode

USA . 3,258 parts In-Stock

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$1.830

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3,258

$1.830

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Chip Stock

USA . 21,500 parts In-Stock

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21,500

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Vyrian

USA . 8,581 parts In-Stock

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8,581

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Sensible Micro Corp

USA . 1,326 parts In-Stock

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1,326

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Semi Source

USA . 730 parts In-Stock

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730

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$1.309

100+ parts

-

1k+ parts

$1.257

10k+ parts

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500

$1.309

-

$1.257

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Argo Parts USA

USA . 3,850 parts In-Stock

1+ parts

$1.336

100+ parts

-

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3,850

$1.336

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Continental Prestige Electronics

USA . 419 parts In-Stock

1+ parts

$1.336

100+ parts

-

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$1.309

419

$1.336

-

-

$1.309

Ampacity Inc.

Singapore . 7,953 parts In-Stock

1+ parts

$1.640

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7,953

$1.640

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Corphita

USA . 2,580 parts In-Stock

1+ parts

$1.733

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2,580

$1.733

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Parana Technologies

USA . 545 parts In-Stock

1+ parts

$20.715

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$20.844

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545

$20.715

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$20.844

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DigiPath Technology Company

USA . 339 parts In-Stock

1+ parts

$22.810

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339

$22.810

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ChromeModa Solutions

Germany . 5,130 parts In-Stock

1+ parts

$23.275

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$19.086

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5,130

$23.275

$19.086

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IDEA Electronic Components Group

UK . 763 parts In-Stock

1+ parts

$23.275

100+ parts

$22.111

1k+ parts

$20.948

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763

$23.275

$22.111

$20.948

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Corohmni

South Africa . 93 parts In-Stock

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$24.514

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93

$24.514

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QUARKTWIN TECHNOLOGY LTD

USA . 22,016 parts In-Stock

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Lixinc

USA . 11,793 parts In-Stock

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Futuretech Components

Singapore . 9,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,363 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Metaverse IC Inc.

Canada . 2,033 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Elevate your projects with the TS3DDR4000ZBAR by Texas Instruments, a high-quality multiplexer that combines precision engineering with reliable performance. Designed for industrial-grade applications, this versatile component offers 12 channels with separate outputs and a nominal bandwidth of 6000 kHz. With a compact design and superior thermal management, this multiplexer delivers seamless functionality in a wide range of settings. Trust Texas Instruments for cutting-edge technology that enhances your work while maximizing efficiency and accuracy. Experience the value and benefits of the TS3DDR4000ZBAR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and space in the design.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for various input and output configurations, making the product versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments, increasing its usability range.

Output (V): SEPARATE OUTPUT

Having separate output channels allows for independent signal routing, enabling more flexible signal processing and routing capabilities.

Width (mm): 3 mm

The compact width of 3mm makes the product space-efficient, suitable for designs with limited space constraints.

No. of Channels: 12

Having 12 channels provides sufficient capacity for multi-channel signal processing, making the product ideal for complex circuit designs.

Nominal Bandwidth: 6000 kHz

With a high nominal bandwidth of 6000 kHz, the product can handle high-frequency signals without distortion, ensuring signal integrity.

Technical Specifications

Multiplexers & Switches TS3DDR4000ZBAR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

6000 kHz

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

Normal Position (V):

NO

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

48

Nominal Off-state Isolation:

34 dB

Nominal On-state Resistance Match:

1 ohm

Maximum On-state Resistance (Ron):

11.2 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.05 mm

Maximum Supply Current (Isup):

.048 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.375 V

Surface Mount:

YES

Maximum Switch-off Time:

65 ns

Maximum Switch-on Time:

65 ns

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TS3DDR4000ZBAR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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