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TS3DV520TQFNR

Texas Instruments

TS3DV520TQFNR by Texas Instruments

TS3DV520TQFNR by Texas Instruments is a 56-terminal audio/video switch with 5 channels. It operates at a supply voltage range of 3-3.6V, offering low on-state resistance of 6 ohm and fast switching times of 15ns on and 9ns off. Ideal for industrial applications requiring high-speed signal routing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,932 parts In-Stock

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Digiode

USA . 1,999 parts In-Stock

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1,999

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 713 parts In-Stock

1+ parts

$0.500

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713

$0.500

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Semicontronic

India . 325 parts In-Stock

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$1.500

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$1.462

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$1.455

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325

$1.500

$1.462

$1.455

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Parana Technologies

USA . 1,638 parts In-Stock

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$11.031

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$11.492

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1,638

$11.031

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$11.492

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AZTECH Wire

Italy . 292 parts In-Stock

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$12.018

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292

$12.018

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ChromeModa Solutions

Germany . 5,865 parts In-Stock

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$12.394

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$10.163

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5,865

$12.394

$10.163

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IDEA Electronic Components Group

UK . 578 parts In-Stock

1+ parts

$12.394

100+ parts

$11.774

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$11.155

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578

$12.394

$11.774

$11.155

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DigiPath Technology Company

USA . 1,430 parts In-Stock

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$11.174

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$11.174

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Corohmni

South Africa . 458 parts In-Stock

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Corphita

USA . 240 parts In-Stock

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Overview

Elevate your audio and video switching experience with the TS3DV520TQFNR by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers yet again with this versatile multiplexer switch. Perfect for a wide range of applications, this product offers seamless performance and precise control over your audio/video components. With its industrial-grade temperature rating and low on-state resistance, customers can trust in the value and benefits that this chip carrier package brings to their projects. Upgrade your system today with the TS3DV520TQFNR and experience the difference Texas Instruments makes in technology innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is commonly used in electronic devices, making this product compatible with a wide range of applications.

No. of Terminals: 56

Having 56 terminals allows for multiple connections and configurations, making it versatile for various circuit designs.

Maximum Operating Temperature: 85°C

The high maximum operating temperature ensures reliability and stability in harsh environments, increasing the product's lifespan.

Minimum Operating Temperature: -40°C

The low minimum operating temperature allows for operation in cold conditions without compromising performance.

Maximum Switch-on Time: 15 ns

The fast switch-on time of 15 nanoseconds ensures quick and efficient signal routing, ideal for high-speed data transmission.

No. of Channels: 5

With 5 channels, this multiplexer or switch can handle multiple input/output signals simultaneously, enhancing its functionality.

Technical Specifications

Multiplexers & Switches TS3DV520TQFNR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N56

Length:

10.675 mm

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

56

Nominal On-state Resistance Match:

.4 ohm

Maximum On-state Resistance (Ron):

6 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

9 ns

Maximum Switch-on Time:

15 ns

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

TS3DV520TQFNR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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