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CD74HCT4067ME4

Texas Instruments

CD74HCT4067ME4 by Texas Instruments

CD74HCT4067ME4 by Texas Instruments is a 24-terminal CMOS multiplexer with 5V supply voltage. It offers separate output, 270 ohm on-state resistance, and 89 kHz nominal bandwidth. Ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

$0.496

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 750 parts In-Stock

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$0.496

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Vyrian

USA . 5,604 parts In-Stock

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Digiode

USA . 4,013 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 72 parts In-Stock

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Argo Parts USA

USA . 2,747 parts In-Stock

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$0.496

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$0.481

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Continental Prestige Electronics

USA . 2,218 parts In-Stock

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$0.496

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$0.486

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Netroflash

USA . 1,000 parts In-Stock

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$0.496

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$0.486

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Corohmni

South Africa . 1,212 parts In-Stock

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Modulus Dynamics

Lithuania . 500 parts In-Stock

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$0.551

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$0.545

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$0.529

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One Stop Electronics

USA . 985 parts In-Stock

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$1.500

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Ampacity Inc.

Singapore . 366 parts In-Stock

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$3.500

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Semicontronic

India . 342 parts In-Stock

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$5.500

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$5.335

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AZTECH Wire

Italy . 678 parts In-Stock

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$8.854

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Parana Technologies

USA . 1,763 parts In-Stock

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$19.664

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DigiPath Technology Company

USA . 977 parts In-Stock

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$21.652

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ChromeModa Solutions

Germany . 3,310 parts In-Stock

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$18.117

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IDEA Electronic Components Group

UK . 2,038 parts In-Stock

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Microchip USA

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Corphita

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Elevate your circuit design with the CD74HCT4067ME4 by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. As a part of the Multiplexers & Switches category, this product offers unparalleled performance and versatility, making it an essential component for a wide range of applications. With its advanced technology and military-grade temperature grade, this single-ended multiplexer delivers seamless operation and precise control. Experience the value and benefits of this product, from its compact package style to its exceptional on-state resistance match, providing customers with unmatched efficiency and functionality in their projects. Step up your game with the CD74HCT4067ME4 and unlock endless possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it suitable for compact electronic devices.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5 V provides stable power delivery, ensuring consistent performance in different operating conditions.

Power Supplies (V): 5

With support for up to 5 power supplies, this multiplexer offers flexibility in powering the device for efficient operation.

No. of Terminals: 24

The 24 terminals provide ample connectivity options, making it ideal for complex circuit configurations and signal routing.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-efficient integration, making it suitable for applications with limited board space.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows for use in extreme cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, prolonging the product's lifespan.

Output (V): SEPARATE OUTPUT

The separate output feature allows for independent signal routing, minimizing signal interference and ensuring accurate data transmission.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm enables compact device design and seamless integration into tight spaces.

Width (mm): 7.5 mm

With a width of 7.5 mm, this multiplexer offers a slim profile for efficient board layout and high-density applications.

Technical Specifications

Multiplexers & Switches CD74HCT4067ME4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

89 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Nominal Off-state Isolation:

75 dB

Nominal On-state Resistance Match:

10 ohm

Maximum On-state Resistance (Ron):

270 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

58 ns

Maximum Switch-on Time:

60 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

CD74HCT4067ME4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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