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TS3DDR32611ZQCR

Texas Instruments

TS3DDR32611ZQCR by Texas Instruments

TS3DDR32611ZQCR by Texas Instruments is a 26-channel SPST multiplexer with separate outputs. It operates at input voltages b/w 1.2V to 1.5V, drawing a max supply current of 0.22mA. This grid array package with very thin profile and fine pitch is ideal for applications requiring high channel count and low power consumption.

Median Price

$0.861

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,530 parts In-Stock

1+ parts

-

100+ parts

$0.861

1k+ parts

$0.715

10k+ parts

$0.637

12,530

-

$0.861

$0.715

$0.637

DigiKey

USA . 12,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.730

10k+ parts

-

12,530

-

-

$0.730

-

Verical

USA . 7,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.893

10k+ parts

$0.796

7,530

-

-

$0.893

$0.796

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,317 parts In-Stock

1+ parts

$0.669

100+ parts

-

1k+ parts

-

10k+ parts

-

1,317

$0.669

-

-

-

Vyrian

USA . 3,640 parts In-Stock

1+ parts

$0.704

100+ parts

-

1k+ parts

-

10k+ parts

-

3,640

$0.704

-

-

-

DigiKey Marketplace

USA . 12,530 parts In-Stock

1+ parts

-

100+ parts

$0.730

1k+ parts

-

10k+ parts

-

12,530

-

$0.730

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,031 parts In-Stock

1+ parts

$0.634

100+ parts

-

1k+ parts

-

10k+ parts

-

3,031

$0.634

-

-

-

Vigor

Singapore . 12,530 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

-

12,530

$0.680

-

-

-

Parana Technologies

USA . 2,103 parts In-Stock

1+ parts

$4.804

100+ parts

-

1k+ parts

$5.315

10k+ parts

-

2,103

$4.804

-

$5.315

-

DigiPath Technology Company

USA . 1,783 parts In-Stock

1+ parts

$5.290

100+ parts

$4.867

1k+ parts

-

10k+ parts

-

1,783

$5.290

$4.867

-

-

ChromeModa Solutions

Germany . 6,927 parts In-Stock

1+ parts

$5.398

100+ parts

$4.426

1k+ parts

-

10k+ parts

-

6,927

$5.398

$4.426

-

-

IDEA Electronic Components Group

UK . 1,986 parts In-Stock

1+ parts

$5.398

100+ parts

-

1k+ parts

$4.858

10k+ parts

-

1,986

$5.398

-

$4.858

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$7.747

100+ parts

$7.050

1k+ parts

$6.353

10k+ parts

-

3,000

$7.747

$7.050

$6.353

-

Microchip USA

USA . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

499

-

-

-

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the TS3DDR32611ZQCR multiplexer. This innovative product offers 26 channels for seamless switching, making it ideal for a wide range of applications. With a sleek square package body and advanced terminal finish, this multiplexer delivers exceptional performance and durability. Improve your systems with the value and benefits this product provides, offering customers unmatched advantages for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and quick installation onto circuit boards, saving time and effort during the manufacturing process.

Package Shape: SQUARE

The square shape helps optimize space on a circuit board, making the overall design more compact and efficient.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style enhances the overall performance and reliability of the multiplexer, making it suitable for high-frequency applications.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity, ensures a strong connection, and prevents oxidation, leading to reliable signal transmission.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and routing, allowing for easier integration into existing circuit designs.

Output (V): SEPARATE OUTPUT

Each channel has a separate output, providing independent control and monitoring capabilities for multiple input signals.

Other IC type: SPST

The SPST configuration offers simplicity and reliability in switching between two states, making it ideal for basic signal routing applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the multiplexer can be quickly and efficiently soldered onto the PCB, reducing manufacturing costs and production time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and strong mechanical connections, resulting in a robust and reliable product.

Maximum Supply Current (Isup): 0.22 mA

The low supply current consumption results in energy efficiency and minimizes power losses, making the multiplexer cost-effective to operate.

No. of Channels: 26

With 26 channels, this multiplexer offers versatility and flexibility in routing multiple input signals to different outputs, catering to complex signal processing needs.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, ensuring stable signal transmission and preventing signal loss or interference.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates a moderate level of moisture sensitivity, making the multiplexer suitable for various environmental conditions and applications.

Minimum Input Voltage: 1.2 V

Supports low input voltage requirements, allowing for compatibility with a wide range of signal sources and ensuring accurate signal processing at lower power levels.

Maximum Input Voltage: 1.5 V

With a maximum input voltage of 1.5 V, the multiplexer can handle higher signal voltages without damage, providing versatility and flexibility in signal routing.

Technical Specifications

Multiplexers & Switches TS3DDR32611ZQCR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

1.5 V

Minimum Input Voltage:

1.2 V

JESD-30 Code:

S-PBGA-B48

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

2

Normal Position (V):

NO

No. of Channels:

26

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Supply Current (Isup):

.22 mA

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TS3DDR32611ZQCR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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