Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF1212IRGZTG3 by Texas Instruments is a RF down converter with 2400-3550 MHz output frequency range, 90 dB gain, and 4.7 dB noise figure. It is ideal for applications requiring high-performance RF signal conversion in wireless communication systems.
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$1.959
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$1.763
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$2.157
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ChromeModa Solutions
$2.201
$1.805
IDEA Electronic Components Group
$1.981
Advanced Electronics
$2.804
$2.776
$2.663
One Stop Electronics
$7.000
Semicontronic
$16.000
$15.600
$15.520
AZTECH Wire
$17.813
Ampacity Inc.
$24.000
Corphita
Corohmni
The use of plastic/epoxy material makes the product lightweight and easy to handle, while also providing durability and protection to the internal components.
The high maximum RF output frequency allows for a wide range of applications and versatility in signal processing.
The component-based construction ensures reliability and ease of maintenance, as individual components can be easily accessed and replaced if needed.
The low minimum RF output frequency ensures compatibility with a wide range of input signals, making the product suitable for various RF applications.
The use of a standard 5V power supply simplifies the power requirements and makes integration into existing systems straightforward.
The high number of terminals allows for flexibility in connectivity options and enables the product to be used in complex RF systems that require multiple connections.
The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions, making the product suitable for outdoor or harsh environments.
The high minimum down conversion gain indicates efficient signal conversion and amplification, resulting in improved signal quality and accuracy.
The low minimum operating temperature allows the product to be used in cold temperature environments without compromising performance or reliability.
The matte tin finish provides corrosion resistance and ensures stable electrical contact, promoting long-term reliability and signal integrity.
The ability to tune the local oscillator (LO) allows for precise frequency control and optimization, making the product suitable for applications that require fine-tuning of RF signals.
As a down converter, the product can efficiently convert high-frequency RF signals to a lower intermediate frequency, making it ideal for systems that require signal processing or demodulation.
The standard 50 ohm characteristic impedance ensures compatibility with a wide range of RF components and enables seamless integration into existing RF systems.
The low minimum intermediate frequency enables efficient signal processing and filtering, making the product suitable for applications that require precise frequency control.
The low maximum noise figure indicates minimal signal degradation and noise interference, ensuring high signal fidelity and accuracy in signal processing applications.
The high minimum input power handling capability allows the product to handle high-power RF signals without distortion or damage, ensuring reliable performance in demanding RF environments.
The high maximum intermediate frequency capability enables the product to process a wide range of signal frequencies, making it versatile and suitable for various RF applications.
The surface mounting feature simplifies installation and integration into existing systems, saving time and effort during setup and deployment.
RF/Microwave Up/Down Converters TRF1212IRGZTG3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments
Characteristic Impedance:
Construction:
Minimum Down Conversion Gain:
Maximum Intermediate Frequency (IF):
Minimum Intermediate Frequency (IF):
Minimum Input Power (CW):
JESD-609 Code:
LO Tunable:
Mounting Feature:
Maximum Noise Figure:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
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RF or Microwave Device Type:
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TRF1212IRGZTG3 RF & Microwave trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Fairchild Semiconductor
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Comset Semiconductors
Microsemi
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
Semitronics
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
Gec Plessey Semiconductors
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
General Instrument
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
MAX9986ETP+D
Maxim Integrated
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Characteristic Impedance: 50 ohm;
MAX2721EUP+
UP CONVERTER; Maximum Voltage Standing Wave Ratio: 2; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm; Maximum RF Output Frequency: 2500 MHz; Maximum Output Power: -2.5 dBm;
MAX9984ETP+TD
Analog Devices' MAX9984ETP+TD is a BICMOS RF Down Converter with 5V supply, 265mA current, LO tunability, and 400-1000MHz RF input range. It operates b/w -40 to 85 °C, has 20 terminals in PLASTIC/EPOXY package for SURFACE MOUNT applications at 50 ohm impedance.
HMC6146BLC5ATR
Analog Devices' HMC6146BLC5ATR is a RF up converter with 40-44 GHz output frequency range, 7 dB min gain, and GaAs technology. Ideal for applications requiring high-frequency conversion in RF/microwave systems. Features include ceramic package, gold over nickel terminal finish, and LO tunability.
LTC5555IUFD#PBF
LTC5555IUFD#PBF by Analog Devices is a RF/Microwave Down Converter with 3.3V power supply, 28 terminals, and -40 to 105°C operating temperature range. It offers a min down conversion gain of 4.4 dB, LO tunable feature, and max noise figure of 24 dB. Ideal for applications requiring RF signal processing in the frequency range of 1500-7000 MHz with a characteristic impedance of 50 ohm.
MAX2671EUT+T
Analog Devices' MAX2671EUT+T is a RF up converter with 400-2500 MHz output range, 6.7 dB min gain, and 11.3 dB max noise figure. Ideal for applications requiring high frequency conversion in RF/microwave systems with 50 ohm impedance.
MAX2660
Analog Devices' MAX2660 is an RF up converter with a 40-2500 MHz output range and 8 dB gain. Ideal for applications requiring LO tunability, it offers a noise figure of 8 dB and supports IF frequencies from 10 to 500 MHz.
HMC951BLP4E
Analog Devices' HMC951BLP4E is a RF/Microwave DOWN CONVERTER with 24 terminals, operating at -40 to 85°C. It features a min Down Conversion Gain of 10 dB, LO Tunable technology, and max Noise Figure of 2.5 dB. Ideal for applications requiring RF signal conversion in the frequency range of 5600-8600 MHz with GAAS construction and surface mounting feature.
SA9504BE
NXP Semiconductors
DOWN CONVERTER; Minimum Intermediate Frequency (IF): 50 MHz; Maximum Intermediate Frequency (IF): 300 MHz; Minimum Operating Temperature: -40 Cel; Minimum RF Input Frequency: 869 MHz; Maximum Noise Figure: 11 dB;
MAX2680AUT+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;
ADMV4530ACCZ
Analog Devices' ADMV4530ACCZ is a RF/Microwave UP CONVERTER with 27-31 GHz output frequency range, 17 dB min up conversion gain, and LO tunable feature. It operates in -40 to 85°C temperature range and supports multiple power supplies (1.8V, 3.3V, 4V). Ideal for applications requiring high-frequency conversions in wireless communication systems.
ADMV1014ACCZ
Analog Devices' ADMV1014ACCZ is a RF/Microwave DOWN CONVERTER with 32 terminals, LO tunable, and 50 ohm impedance. It operates b/w -40 to 85 °C, with RF input frequency ranging from 24-44 GHz. Ideal for applications requiring min noise figure of 8.5 dB and intermediate frequency up to 6 GHz.
HMC6147ALC5ATR
Analog Devices' HMC6147ALC5ATR is a GAAS technology RF down converter with 10 dB min. gain, LO tunable, and 37-44 GHz RF input range. It operates from -40 to 85 °C, has 16 terminals, and uses ceramic package for surface mount applications in RF/microwave systems.
ADRF6780ACPZN
Analog Devices' ADRF6780ACPZN is a RF/Microwave Up/Down Converter with 23600 MHz max RF output, 5900 MHz min RF output, and 7 dB min up conversion gain. Ideal for applications requiring high-frequency signal processing in environments ranging from -40 to 85 °C.
F1792NLGI
Renesas Electronics
DOWN CONVERTER; Terminal Finish: TIN; JESD-609 Code: e3;
UPC2721GR-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Terminal Finish: Tin/Lead (Sn/Pb);
TRF1212IRGZR
Texas Instruments
TRF1212IRGZR by Texas Instruments is a RF/Microwave DOWN CONVERTER with freq range 2400-3550 MHz, LO tunable, and 90 dB min down conversion gain. It operates at -40 to 85 °C, has max noise figure of 4.7 dB, and requires 5V power supply. Ideal for applications requiring high-performance RF signal processing in communication systems.
PMB2110
Infineon Technologies
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 10; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 2.8; JESD-609 Code: e0;
IAM-82008-TR1
Hewlett Packard
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;
HMC7911LP5ETR
Analog Devices' HMC7911LP5ETR is a GAAS technology RF up converter with 17-20 GHz output frequency range, 13.5 dB min gain, and LO tunability. It operates from -40 to 85 °C, requires 5V power supply, and has a surface mount package suitable for RF/microwave applications.
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DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TRF1122IRTMR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Maximum RF Output Frequency: 2700 MHz; Power Supplies (V): 5;
TRF1115IRGPTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Maximum Noise Figure: 7 dB;
TRF1112IRGZRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Minimum RF Output Frequency: 1700 MHz;
TRF1121IRGZTG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Maximum Intermediate Frequency (IF): 350 MHz;
TRF1121IRGZ
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
TRF1115IRGPRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Maximum Noise Figure: 7 dB; Maximum Supply Current: 180 mA;
TRF1122IRTMRG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Additional Features: TTL COMPATIBLE; Characteristic Impedance: 50 ohm;
TRF1015DB-00
DOWN CONVERTER; Maximum RF Input Frequency: 894 MHz; Additional Features: LOW NOISE; Maximum Operating Temperature: 85 Cel; Minimum Down Conversion Gain: 9 dB; Minimum RF Input Frequency: 869 MHz;
TRF1121
UP CONVERTER; Maximum Output Power: 0 dBm; LO Tunable: YES; Minimum Operating Temperature: -40 Cel; Maximum Intermediate Frequency (IF): 400 MHz; Minimum RF Output Frequency: 1500 MHz;
TRF1112IRGZT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1121IRGZT
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel;
TRF1121IRGZR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; LO Tunable: YES;
TRF1115IRGPR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 16 dB; Maximum Noise Figure: 7 dB;
TRF1122
UP CONVERTER; Minimum RF Output Frequency: 2100 MHz; Minimum Up Conversion Gain: 20 dB; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;
TRF1112IRGZR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC48,.27SQ,20; Minimum Intermediate Frequency (IF): 400 MHz;
TRF1115IRGPT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Input Power (CW): 5 dBm; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1015DB
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Additional Features: LOW NOISE;
TRF1112
DOWN CONVERTER; LO Tunable: YES; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Maximum Noise Figure: 4.7 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1112IRGZTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Minimum Input Power (CW): 20 dBm;
TRF1121IRGZRG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Construction: COMPONENT; Power Supplies (V): 5;
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