Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF1015DB by Texas Instruments is a 20-terminal RF down converter with LO tunability. It operates b/w -40°C to 85°C, offering a min gain of 9 dB and supporting RF input frequencies from 869 MHz to 894 MHz. Ideal for applications requiring surface mount components in the RF/Microwave domain.
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DigiKey
$1.390
Verical
$1.027
Digiode
$0.864
Vyrian
$0.910
Ampacity Inc.
$0.770
Semicontronic
$0.751
$0.747
Corphita
$0.819
Corohmni
Parana Technologies
$2.127
$2.639
DigiPath Technology Company
$2.342
$2.155
ChromeModa Solutions
$2.390
$1.960
IDEA Electronic Components Group
$2.151
Plastic/epoxy material provides durability and protects the internal components, making the converter suitable for various environments.
Low power supply requirement of 3.75V results in energy efficiency and lower operating costs.
Having 20 terminals allows for multiple connections and configurations, providing flexibility in setup.
High maximum operating temperature of 85°C ensures reliable performance even in demanding conditions.
A minimum down conversion gain of 9 dB indicates strong signal amplification capabilities, improving overall performance.
The Local Oscillator (LO) is tunable, allowing for precise frequency adjustments and signal processing.
A low minimum RF input frequency of 869 MHz enables compatibility with a wide range of RF signals.
Having a characteristic impedance of 50 ohm ensures efficient signal transfer and reduces signal loss.
A high maximum RF input frequency of 894 MHz allows for the conversion of a broad spectrum of RF signals.
Surface mounting feature simplifies installation and integration into existing systems, saving time and effort.
RF/Microwave Up/Down Converters TRF1015DB attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments
Additional Features:
Characteristic Impedance:
Construction:
Minimum Down Conversion Gain:
LO Tunable:
Mounting Feature:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
Maximum RF Input Frequency:
Minimum RF Input Frequency:
RF or Microwave Device Type:
Sub-Category:
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Nte Electronics
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
MURS160T3G
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
MAX9996ETP+T
Analog Devices
Analog Devices' MAX9996ETP+T is a BICMOS RF Down Converter with 5V supply, 20 terminals, and -40 to 85 °C operating range. It offers 7dB min gain, LO tunability, and 9.7dB max noise figure. Ideal for RF applications from 1700-2200MHz requiring surface mount packaging and 50Ω impedance.
MAX2320EUP+
Maxim Integrated
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum RF Input Frequency: 800 MHz; Characteristic Impedance: 50 ohm;
MAX2321EUP-T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Maximum RF Input Frequency: 2500 MHz; JESD-609 Code: e0;
MAX2721EUP+T
UP CONVERTER; Construction: COMPONENT; LO Tunable: YES; JESD-609 Code: e3; Maximum Voltage Standing Wave Ratio: 2; Minimum RF Output Frequency: 2100 MHz;
MAX2673
UP CONVERTER; JESD-609 Code: e0; Minimum Up Conversion Gain: 12 dB; Maximum Intermediate Frequency (IF): 500 MHz; Minimum RF Output Frequency: 40 MHz; Maximum Noise Figure: 8 dB;
HPMX-7103-TR1
Broadcom
DOWN CONVERTER; Minimum RF Input Frequency: 400 MHz; Maximum Intermediate Frequency (IF): 400 MHz; Terminal Finish: Tin/Lead (Sn/Pb); Construction: COMPONENT; Maximum Noise Figure: 10 dB;
ADMV7320BCEZ
Analog Devices' ADMV7320BCEZ is an RF up converter with a frequency range of 81-86 GHz. It features a VSWR of 1.43, LO tunability, and operates in temperatures from -40 to 85 °C. Ideal for applications requiring high-frequency conversion in RF/microwave systems.
IAM-82008-STR
Hewlett Packard
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Down Conversion Gain: 13 dB;
TFF1015HN/N1,115
TFF1015HN/N1,115 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C and requires a 5V power supply with 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.
MAX2681EUT-T
MAX2681EUT-T by Maxim Integrated is a RF down converter with LO tunable feature. It operates at 3/5V, has 6 terminals, and offers a min down conversion gain of 6.7 dB. Ideal for applications requiring RF signal conversion from 400 MHz to 2500 MHz with an IF range of 10-500 MHz.
MAX2325EGI
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 28; Package Body Material: CERAMIC; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT;
MAX2683EUE+
DOWN CONVERTER; Minimum Input Power (CW): 10 dBm; Minimum Intermediate Frequency (IF): 100 MHz; JESD-609 Code: e3; Maximum Intermediate Frequency (IF): 400 MHz; Characteristic Impedance: 50 ohm;
UPC2744GS
Renesas Electronics
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 70 Cel;
ADMV1012AEZ
Analog Devices' ADMV1012AEZ is a GAAS technology DOWN CONVERTER with 32 terminals and CERAMIC package. It operates b/w -40 to 85 °C, offering RF input frequency range of 17-24 GHz for applications requiring min noise figure of 4 dB in RF/Microwave systems.
LA7784FN
LA7784FN by Onsemi is a 32-terminal RF/Microwave Up/Down Converter with 5V power supply. It operates b/w -20 °C to 70°C, suitable for surface mount applications in various electronic devices. The package body material is plastic/epoxy, ensuring durability and reliability in diverse environments.
MAX2324EUP
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 11.3 dB; Minimum RF Input Frequency: 800 MHz;
DRR1-2312
DOWN CONVERTER; Minimum RF Input Frequency: 21200 MHz; Maximum Output Power: 0 dBm; Minimum Down Conversion Gain: 18 dB; LO Tunable: YES; Minimum Intermediate Frequency (IF): 610 MHz;
MAX2680
DOWN CONVERTER; Maximum Noise Figure: 6.3 dB; JESD-609 Code: e0; Minimum Intermediate Frequency (IF): 10 MHz; Minimum Down Conversion Gain: 11.6 dB; Maximum RF Input Frequency: 2500 MHz;
TFF1012HN/N1,135
TFF1012HN/N1,135 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.
MAX2671
UP CONVERTER; JESD-609 Code: e0; Maximum Noise Figure: 8 dB; LO Tunable: YES; Minimum Up Conversion Gain: 11 dB; Maximum RF Output Frequency: 2500 MHz;
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LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TRF1122IRTMR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Maximum RF Output Frequency: 2700 MHz; Power Supplies (V): 5;
TRF1115IRGPTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Maximum Noise Figure: 7 dB;
TRF1112IRGZRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Minimum RF Output Frequency: 1700 MHz;
TRF1121IRGZTG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Maximum Intermediate Frequency (IF): 350 MHz;
TRF1121IRGZ
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
TRF1115IRGPRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Maximum Noise Figure: 7 dB; Maximum Supply Current: 180 mA;
TRF1122IRTMRG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Additional Features: TTL COMPATIBLE; Characteristic Impedance: 50 ohm;
TRF1015DB-00
DOWN CONVERTER; Maximum RF Input Frequency: 894 MHz; Additional Features: LOW NOISE; Maximum Operating Temperature: 85 Cel; Minimum Down Conversion Gain: 9 dB; Minimum RF Input Frequency: 869 MHz;
TRF1121
UP CONVERTER; Maximum Output Power: 0 dBm; LO Tunable: YES; Minimum Operating Temperature: -40 Cel; Maximum Intermediate Frequency (IF): 400 MHz; Minimum RF Output Frequency: 1500 MHz;
TRF1112IRGZT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1121IRGZT
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel;
TRF1121IRGZR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; LO Tunable: YES;
TRF1115IRGPR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 16 dB; Maximum Noise Figure: 7 dB;
TRF1122
UP CONVERTER; Minimum RF Output Frequency: 2100 MHz; Minimum Up Conversion Gain: 20 dB; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;
TRF1112IRGZR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC48,.27SQ,20; Minimum Intermediate Frequency (IF): 400 MHz;
TRF1115IRGPT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Input Power (CW): 5 dBm; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1112
DOWN CONVERTER; LO Tunable: YES; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Maximum Noise Figure: 4.7 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1112IRGZTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Minimum Input Power (CW): 20 dBm;
TRF1121IRGZRG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Construction: COMPONENT; Power Supplies (V): 5;
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