Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF1121IRGZRG3 by Texas Instruments is an RF up converter with a frequency range of 1500-2500 MHz. It operates on a 5V power supply, has 48 terminals, and can handle temperatures from -40 to 85°C. This component is ideal for applications requiring high-frequency conversion in RF/microwave systems.
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The plastic/epoxy material used for the package body provides durability and reliability to the product, making it suitable for various environments.
The high maximum RF output frequency allows for versatile and flexible use in a wide range of applications.
The component construction ensures high performance and reliability of the product.
The low minimum RF output frequency ensures compatibility with a range of input signals.
The 5V power supply requirement makes it easy to integrate the product into existing systems.
The high number of terminals allows for versatile connectivity options and integration with other components.
The high maximum operating temperature range ensures reliability even in harsh environmental conditions.
The low minimum operating temperature range allows for operation in extreme cold environments.
The matte tin terminal finish provides excellent conductivity and corrosion resistance.
The LO tunable feature allows for precise frequency tuning and customization.
The up converter design ensures efficient conversion of RF signals for optimal performance.
The low minimum intermediate frequency allows for signal processing with high accuracy and resolution.
The maximum output power of 0 dBm ensures strong and reliable signal transmission.
The high minimum input power requirement ensures compatibility with a wide range of input signals.
The high maximum intermediate frequency allows for processing of a wide range of signals with high frequency resolution.
The surface mount feature allows for easy and secure installation of the product onto circuit boards.
RF/Microwave Up/Down Converters TRF1121IRGZRG3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments
Construction:
Maximum Intermediate Frequency (IF):
Minimum Intermediate Frequency (IF):
Minimum Input Power (CW):
JESD-609 Code:
LO Tunable:
Mounting Feature:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Output Power:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
Maximum RF Output Frequency:
Minimum RF Output Frequency:
RF or Microwave Device Type:
Sub-Category:
Terminal Finish:
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
Diodes Incorporated
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
LL4148
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WS
Jiangsu Changjiang Electronics Technology
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MAX2681EUT+
Maxim Integrated
DOWN CONVERTER; Minimum Intermediate Frequency (IF): 10 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Minimum Down Conversion Gain: 6.7 dB; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm;
UPC1686G-E1
Renesas Electronics
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e0;
CLC5903SM/NOPB
DOWN CONVERTER; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1;
F1192BNLGK
DOWN CONVERTER; JESD-609 Code: e3; Terminal Finish: Tin (Sn);
UPB1003GS-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 30; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;
HMC904LC5TR
Analog Devices
Analog Devices' HMC904LC5TR is a GaAs RF down converter with 32 terminals, operating from -55 °C to 85°C. It requires a 3.5V power supply, drawing a max current of 190mA. Ideal for RF/Microwave applications, it features a ceramic package and gold over nickel terminal finish for surface mount installation.
MAX2116UTL+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 40; Package Body Material: PLASTIC/EPOXY; Minimum RF Input Frequency: 925 MHz; Maximum Supply Current: 265 mA;
HMC951ALP4ETR
HMC951ALP4ETR by Analog Devices is a RF/Microwave DOWN CONVERTER with 24 terminals, operating at 5V. It features a min Down Conversion Gain of 10 dB and LO Tunable technology. Ideal for applications requiring RF input frequencies b/w 5600-8600 MHz and intermediate frequencies up to 3500 MHz.
MAX2680AUT+
MAX2680AUT+ by Analog Devices is a RF/Microwave DOWN CONVERTER with 1.5 VSWR, LO Tunable, and 11.7 dB Noise Figure. It operates from -40 to 85 °C and has a max supply current of 7.7 mA. Ideal for applications requiring RF signal conversion in the frequency range of 400 MHz to 2500 MHz.
UPC2721GV-E1-A
DOWN CONVERTER; Minimum RF Input Frequency: 900 MHz; Maximum RF Input Frequency: 2000 MHz; Minimum Down Conversion Gain: 18 dB; Maximum Noise Figure: 15 dB; JESD-609 Code: e6;
UPB1007K-E1
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 35 mA;
F1150NBGI8
DOWN CONVERTER; Terminal Finish: Matte Tin (Sn); JESD-609 Code: e3;
MAX2684EUE+
DOWN CONVERTER; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm; Minimum RF Input Frequency: 3400 MHz; JESD-609 Code: e3; Construction: COMPONENT;
HMC925LC5TR
Analog Devices' HMC925LC5TR is a GaAs RF up converter with 32 terminals, operating b/w -40 °C to 85°C. It requires a 5V power supply and features a ceramic package body material. Ideal for RF/microwave applications, it is designed for surface mounting.
MAX2673EUA+
Analog Devices' MAX2673EUA+ is an RF up converter with 400-2500 MHz output range, 7.8 dB gain, and 10.4 dB noise figure. Ideal for applications requiring high frequency conversion in RF/Microwave systems with a VSWR of 2.2 and operating temperature range of -40 to 85°C.
MAX2116UGL
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 40; Package Body Material: CERAMIC; Minimum RF Input Frequency: 925 MHz; Maximum RF Input Frequency: 2175 MHz;
MAX9986ETP+D
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Characteristic Impedance: 50 ohm;
TRF1015DB-00
TRF1015DB-00 by Texas Instruments is an RF/Microwave DOWN CONVERTER with 9 dB Min. Down Conversion Gain, LO Tunable feature, and 869-894 MHz RF Input Frequency range. It operates b/w -40 to +85 °C and has a 50 ohm Impedance. Ideal for wireless communication systems requiring frequency conversion.
HMC112
RF/Microwave Up/Down Converters; Technology: GAAS; Package Equivalence Code: DIE OR CHIP; Power Supplies (V): 5; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -55 Cel;
UPB1005GS-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 30; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Package Equivalence Code: SSOP30,.3;
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TRF1122IRTMR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Maximum RF Output Frequency: 2700 MHz; Power Supplies (V): 5;
TRF1115IRGPTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Maximum Noise Figure: 7 dB;
TRF1112IRGZRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Minimum RF Output Frequency: 1700 MHz;
TRF1121IRGZTG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Maximum Intermediate Frequency (IF): 350 MHz;
TRF1121IRGZ
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
TRF1115IRGPRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Maximum Noise Figure: 7 dB; Maximum Supply Current: 180 mA;
TRF1122IRTMRG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Additional Features: TTL COMPATIBLE; Characteristic Impedance: 50 ohm;
DOWN CONVERTER; Maximum RF Input Frequency: 894 MHz; Additional Features: LOW NOISE; Maximum Operating Temperature: 85 Cel; Minimum Down Conversion Gain: 9 dB; Minimum RF Input Frequency: 869 MHz;
TRF1121
UP CONVERTER; Maximum Output Power: 0 dBm; LO Tunable: YES; Minimum Operating Temperature: -40 Cel; Maximum Intermediate Frequency (IF): 400 MHz; Minimum RF Output Frequency: 1500 MHz;
TRF1112IRGZT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1121IRGZT
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel;
TRF1121IRGZR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; LO Tunable: YES;
TRF1115IRGPR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 16 dB; Maximum Noise Figure: 7 dB;
TRF1122
UP CONVERTER; Minimum RF Output Frequency: 2100 MHz; Minimum Up Conversion Gain: 20 dB; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;
TRF1112IRGZR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC48,.27SQ,20; Minimum Intermediate Frequency (IF): 400 MHz;
TRF1115IRGPT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Input Power (CW): 5 dBm; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1015DB
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Additional Features: LOW NOISE;
TRF1112
DOWN CONVERTER; LO Tunable: YES; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Maximum Noise Figure: 4.7 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1112IRGZTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Minimum Input Power (CW): 20 dBm;
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