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MAX2106CCM

Analog Devices

MAX2106CCM by Analog Devices

Analog Devices' MAX2106CCM is a RF down converter with 925-2175MHz input frequency range, 50 ohm impedance, and -40 to +85 °C operating temperature. Ideal for RF/Microwave applications requiring high-performance signal conversion in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,216 parts In-Stock

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Anansix

USA . 2,404 parts In-Stock

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Digiode

USA . 2,091 parts In-Stock

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MARBEL Systems

Belgium . 5,324 parts In-Stock

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$2.557

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$2.557

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Texas Native Microelectronics

USA . 5,402 parts In-Stock

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$2.939

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$2.821

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$2.733

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$2.586

5,402

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$2.821

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$2.586

Kenton Components

USA . 1,000 parts In-Stock

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$3.527

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$3.104

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$3.527

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One Stop Electronics

USA . 419 parts In-Stock

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$5.000

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Qasali Group International

UK . 2,105 parts In-Stock

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$7.935

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$7.380

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$6.983

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AZTECH Wire

Italy . 240 parts In-Stock

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$17.123

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Semicontronic

India . 1,358 parts In-Stock

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$27.000

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$26.325

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$26.190

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Corphita

USA . 2,173 parts In-Stock

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Overview

The MAX2106CCM by Analog Devices is a high-quality RF/Microwave Down Converter that offers exceptional performance and reliability. As a leading manufacturer in the industry, Analog Devices ensures superior quality and cutting-edge technology in all their products. The MAX2106CCM is ideal for a wide range of applications, providing seamless signal conversion with ease. Customers can trust in the value and benefits this converter brings, from its efficient operation to its versatility in various settings. Elevate your projects with the MAX2106CCM and experience the advantages it offers firsthand.

Feature Benefit Bullets

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures that the converter can reliably function in a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this converter can also operate in colder temperatures without any issues.

Terminal Finish: TIN LEAD

The TIN LEAD terminal finish provides a reliable and durable connection, ensuring long-term performance of the converter.

RF or Microwave Device Type: DOWN CONVERTER

Being a down converter, this product allows for converting higher frequency signals to lower frequency signals, which is essential for various applications.

Minimum RF Input Frequency: 925 MHz

With a low minimum RF input frequency, this converter can effectively handle a wide range of input signals for conversion.

Characteristic Impedance: 50 ohm

The 50 ohm characteristic impedance ensures efficient signal transfer and compatibility with standard RF equipment, making this converter versatile in its applications.

Maximum RF Input Frequency: 2175 MHz

The high maximum RF input frequency allows for processing of a wide range of input signals, making this converter suitable for a variety of RF and microwave applications.

Technical Specifications

RF/Microwave Up/Down Converters MAX2106CCM attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Analog Devices

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

JESD-609 Code:

e0

LO Tunable:

NO

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Maximum RF Input Frequency:

2175 MHz

Minimum RF Input Frequency:

925 MHz

RF or Microwave Device Type:

Terminal Finish:

TIN LEAD

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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