Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MAX2671EUT-T by Maxim Integrated is an RF up converter with 400-2500 MHz frequency range, 6.7 dB min gain, and 11.3 dB max noise figure. It operates at -40 to 85°C and is ideal for RF/Microwave applications requiring high performance in a compact package.
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The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.
High maximum RF output frequency allows for versatile use in a wide range of RF applications.
Low VSWR ensures efficient transmission of RF signals with minimal loss.
Low minimum RF output frequency enables signal processing for a wide range of frequency bands.
Compatibility with multiple power supply voltages provides flexibility in system integration.
Sufficient number of terminals for connectivity and signal transmission in complex RF systems.
High minimum up conversion gain ensures strong signal amplification for improved performance.
Wide operating temperature range allows for reliable performance in different environmental conditions.
Ability to operate at low temperatures expands the range of applications in various environments.
Tin/Lead terminal finish provides good conductivity and solderability for reliable connections.
Bipolar technology offers high performance and reliability for RF signal processing.
Low maximum supply current consumption minimizes power usage and heat dissipation.
Specifically designed as an up converter for efficient frequency conversion in RF systems.
Standard 50 ohm impedance for easy integration with common RF components and systems.
Low minimum IF frequency allows for processing signals at various intermediate frequencies.
Low maximum noise figure ensures minimal noise interference in signal processing.
High maximum IF frequency provides flexibility in signal processing and frequency conversion.
Surface mount design for easy and secure installation on PCBs or other surfaces.
RF/Microwave Up/Down Converters MAX2671EUT-T attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Maxim Integrated
Characteristic Impedance:
Construction:
Maximum Intermediate Frequency (IF):
Minimum Intermediate Frequency (IF):
JESD-609 Code:
LO Tunable:
Mounting Feature:
Maximum Noise Figure:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
Maximum RF Output Frequency:
Minimum RF Output Frequency:
RF or Microwave Device Type:
Sub-Category:
Maximum Supply Current:
Technology:
Terminal Finish:
Minimum Up Conversion Gain:
Maximum Voltage Standing Wave Ratio:
MAX2671EUT-T RF & Microwave trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev OBS 15/Jul/2015
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
President & CEO
Tunc Doluca
Senior VP & CFO
Brian C. White
Senior VP, Technology & Manufacturing Group
Vivek Jain
Fabrication
Fab Initiation
Philippines
Cavite
Wafer Capacity
489,000
USA
Beaverton
312,000
Thailand
Chon Buri
194,000
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Eic Semiconductor
Promax-johnton
LM317D2TG
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
B340A-13-F
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AH180-WG-7
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
HMC815LC5TR
Analog Devices
Analog Devices' HMC815LC5TR is a GaAs RF up converter with 32 terminals, operating from -55 °C to 85°C. It requires a 4.5V power supply and draws a max current of 300mA. Ideal for RF/microwave applications, this surface-mount device offers high performance in communication systems.
MAX2114UGH-TD
Maxim Integrated
DOWN CONVERTER; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Minimum RF Input Frequency: 925 MHz; Maximum RF Input Frequency: 2175 MHz;
MAX2681EUT+
MAX2681EUT+ by Analog Devices is an RF down converter with 1.5 VSWR, 6.7 dB gain, and LO tunability. It operates from -40 to 85 °C, supports RF input frequencies from 400 MHz to 2500 MHz, and has a min IF of 10 MHz. Ideal for RF/Microwave applications requiring high performance in compact designs.
UPC2799GR-E1
Renesas Electronics
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 5;
UPC2757TB-E3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Terminal Finish: Tin/Lead (Sn/Pb); Package Equivalence Code: SOLCC6,.05,25; Minimum Down Conversion Gain: 10 dB;
MAX2700ECM
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Supply Current: 230 mA; Package Equivalence Code: TQFP48,.35SQ;
MAX2701ECM
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Supply Current: 235 mA; Maximum Voltage Standing Wave Ratio: 1.2;
UPC8108T-E3
DOWN CONVERTER; Minimum Input Power (CW): -25 dBm; Characteristic Impedance: 50 ohm; Minimum Operating Temperature: -25 Cel; Minimum Down Conversion Gain: 12 dB; Minimum RF Input Frequency: 150 MHz;
UPC2758TB
DOWN CONVERTER; JESD-609 Code: e0; LO Tunable: YES; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm; Maximum Noise Figure: 15 dB;
HMC951BLP4ETR
Analog Devices' HMC951BLP4ETR is a GAAS technology RF down converter with 24 terminals, operating at -40 to 85°C. It features a min gain of 10 dB, noise figure of 2.5 dB, LO tunability, and operates on a 3.5V supply with max current draw of 200 mA. Ideal for RF/Microwave applications in the frequency range of 5600-8600 MHz with IF up to 3500 MHz.
MAX2320EUP
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: TSSOP20,.25; LO Tunable: YES;
MAX2261EUT-T
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
HMC7056
UP CONVERTER;
F1192NLGI8
DOWN CONVERTER; JESD-609 Code: e3; Terminal Finish: Tin (Sn);
MAX2326EUP+
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; LO Tunable: YES; Package Equivalence Code: TSSOP20,.25;
UPC8187TB-E3-A
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;
CMY200
Infineon Technologies
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 5; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Intermediate Frequency (IF): 40 MHz;
TA4302F
Toshiba
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Terminal Finish: Tin/Lead (Sn/Pb);
HMC966LP4ETR
Analog Devices' HMC966LP4ETR is a GAAS technology RF down converter with 24 terminals, operating b/w -55 °C to 85°C. It requires a 4.5V power supply and draws a max current of 200mA. Ideal for RF/Microwave applications, it features a surface mount package body made of plastic/epoxy with matte tin terminal finish.
HMC966LP4E
HMC966LP4E by Analog Devices is an RF/Microwave Down Converter with a min down conversion gain of 10 dB. It operates in temperatures ranging from -55 to 85°C and supports RF input frequencies b/w 17-20 GHz. Ideal for applications requiring high-performance RF signal processing in various industries.
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MAX2671EUT+T
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Construction: COMPONENT;
MAX2682EUT+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;
MAX2682EUT-T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Construction: COMPONENT;
MAX2660EUT+T
Analog Devices' MAX2660EUT+T is an RF up converter with 400-2500 MHz output range, 3.9 dB gain, and 11.9 dB noise figure. Ideal for applications requiring high-frequency conversion in RF/Microwave systems with impedance of 50 ohm and IF range of 40-500 MHz.
MAX2660EUT-T
MAX2660EUT-T by Maxim Integrated is a RF/Microwave Up/Down Converter with a max RF output frequency of 2500 MHz and a max voltage standing wave ratio of 2.2. It is commonly used in applications such as wireless communication systems and satellite receivers.
UP CONVERTER; Construction: COMPONENT; Maximum Noise Figure: 11.9 dB; Maximum Operating Temperature: 85 Cel; LO Tunable: NO; Minimum Operating Temperature: -40 Cel;
MAX2681EUT+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum RF Input Frequency: 400 MHz;
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 3/5;
MAX2681EUT-T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Down Conversion Gain: 6.7 dB;
MAX2682EUT+
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e3;
MAX2682EUT
MAX2682EUT by Maxim Integrated is a RF/Microwave DOWN CONVERTER with 1.5 VSWR, 8.7 dB Down Conversion Gain, and 50 ohm Impedance. It operates at -40 to 85°C, consumes 21.8 mA current, and supports RF input frequencies from 400 MHz to 2500 MHz. Ideal for applications requiring high-performance RF signal conversion in compact setups.
MAX2661
UP CONVERTER; Minimum Up Conversion Gain: 11 dB; Minimum Intermediate Frequency (IF): 10 MHz; Maximum RF Output Frequency: 2500 MHz; Terminal Finish: TIN LEAD; Maximum Noise Figure: 8 dB;
MAX2661EUT+T
UP CONVERTER; Maximum Noise Figure: 11.8 dB; Maximum Voltage Standing Wave Ratio: 2.2; Characteristic Impedance: 50 ohm; Maximum RF Output Frequency: 2500 MHz; Maximum Operating Temperature: 85 Cel;
MAX2661EUT+
UP CONVERTER; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3;
MAX2106CCM
DOWN CONVERTER; JESD-609 Code: e0; Minimum RF Input Frequency: 925 MHz; Minimum Operating Temperature: 0 Cel; Maximum RF Input Frequency: 2175 MHz; Terminal Finish: TIN LEAD;
MAX2660
UP CONVERTER; Maximum Intermediate Frequency (IF): 500 MHz; JESD-609 Code: e0; Minimum Up Conversion Gain: 8 dB; LO Tunable: YES; Minimum Intermediate Frequency (IF): 10 MHz;
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