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TFF1017HN/N1,135

NXP Semiconductors

TFF1017HN/N1,135 by NXP Semiconductors

TFF1017HN/N1,135 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,197 parts In-Stock

1+ parts

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4,197

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Digiode

USA . 2,875 parts In-Stock

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2,875

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Anansix

USA . 2,615 parts In-Stock

1+ parts

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2,615

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 690 parts In-Stock

1+ parts

$10.810

100+ parts

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690

$10.810

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One Stop Electronics

USA . 344 parts In-Stock

1+ parts

$30.000

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344

$30.000

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Ampacity Inc.

Singapore . 1,161 parts In-Stock

1+ parts

$36.000

100+ parts

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1,161

$36.000

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Kepictronics

USA . 200,000 parts In-Stock

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200,000

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QUARKTWIN TECHNOLOGY LTD

USA . 5,017 parts In-Stock

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5,017

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UNI Independent Distributors

Spain . 2,215 parts In-Stock

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2,215

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Corphita

USA . 1,362 parts In-Stock

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1,362

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Overview

Elevate your designs with the TFF1017HN/N1,135 RF/Microwave Up/Down Converter from NXP Semiconductors—a leader in innovation and quality. This reliable solution effortlessly transforms signals across diverse applications, ensuring optimal performance even in extreme conditions. With superior durability and energy efficiency, it empowers your projects with enhanced functionality and faster time-to-market. Choose NXP for unmatched reliability and support as you push boundaries!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides excellent protection against environmental factors while ensuring durability and reliability in RF/microwave applications.

Power Supplies: 5 V

Operating at a low 5V power supply makes the product energy-efficient and compatible with various power management systems, making it ideal for battery-powered applications.

Number of Terminals: 16

With 16 terminals, this converter offers multiple connectivity options, facilitating integration into complex RF systems and enhancing versatility in design.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance even in high-temperature environments, making it suitable for industrial and outdoor applications.

Minimum Operating Temperature: -40 °C

The product's capability to operate at -40 °C makes it reliable in extreme cold conditions, ensuring functionality in diverse environments.

Mounting Feature: Surface Mount

The surface mount feature allows for easy integration into compact circuit designs, optimizing space usage on PCBs and enhancing overall system performance.

Technical Specifications

RF/Microwave Up/Down Converters TFF1017HN/N1,135 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC16,.1X.14,20

Power Supplies (V):

5

Sub-Category:

RF/Microwave Up/Down Converters

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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