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TFF1012HN/N1,135

NXP Semiconductors

TFF1012HN/N1,135 by NXP Semiconductors

TFF1012HN/N1,135 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,394 parts In-Stock

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6,394

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Digiode

USA . 3,629 parts In-Stock

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3,629

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Anansix

USA . 131 parts In-Stock

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131

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Distributors (Availability)

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AZTECH Wire

Italy . 809 parts In-Stock

1+ parts

$15.830

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809

$15.830

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One Stop Electronics

USA . 1,547 parts In-Stock

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$19.000

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1,547

$19.000

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Corphita

USA . 3,005 parts In-Stock

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UNI Independent Distributors

Spain . 1,077 parts In-Stock

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Overview

Unlock superior performance with the TFF1012HN/N1,135 from NXP Semiconductors, a leader in innovation and reliability. This RF/Microwave Up/Down Converter is crafted for seamless integration and exceptional durability across various applications, ensuring consistent operation in demanding environments. Elevate your designs with its robust features, while benefiting from NXP’s renowned quality and support—experience clarity, efficiency, and unmatched value in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and compact design, which is essential for RF/Microwave applications where space and weight are critical.

Power Supplies (V): 5

Operating at a low power supply of 5V makes this converter energy-efficient, suitable for battery-operated devices and minimizing heat generation.

No. of Terminals: 16

With 16 terminals, this product allows for versatile connections, enhancing design flexibility for integrating with various systems.

Maximum Operating Temperature: 85 °C

The capability to operate at temperatures as high as 85 °C ensures reliable performance in a wide range of environments, making it suitable for outdoor and industrial applications.

Minimum Operating Temperature: -40 °C

This converter's operation down to -40 °C allows it to function in extreme cold conditions, making it ideal for applications in harsh environments.

Mounting Feature: SURFACE MOUNT

Surface mount technology provides a compact footprint and facilitates automated assembly, leading to lower production costs and improved reliability.

Technical Specifications

RF/Microwave Up/Down Converters TFF1012HN/N1,135 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC16,.1X.14,20

Power Supplies (V):

5

Sub-Category:

RF/Microwave Up/Down Converters

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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