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TFF1004HN/N1/T3

NXP Semiconductors

TFF1004HN/N1/T3 by NXP Semiconductors

TFF1004HN/N1/T3 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C, requires a 3.3V supply, and features 24 terminals with a max current of 125mA. Ideal for communication systems and signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,632 parts In-Stock

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Anansix

USA . 2,824 parts In-Stock

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Digiode

USA . 2,236 parts In-Stock

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2,236

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Distributors (Availability)

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One Stop Electronics

USA . 1,031 parts In-Stock

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$28.000

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UNI Independent Distributors

Spain . 7,088 parts In-Stock

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Corphita

USA . 1,878 parts In-Stock

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Overview

Unlock the potential of your RF applications with the TFF1004HN/N1/T3 from NXP Semiconductors. Renowned for their innovation and reliability, NXP delivers a top-tier solution that ensures optimal performance in diverse environments, from automotive to industrial. This versatile converter enhances signal integrity while simplifying design efforts. Experience superior quality, unmatched efficiency, and the peace of mind that comes from partnering with a trusted leader in semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this product suitable for various applications in challenging conditions.

Power Supplies: 3.3V

Operating at 3.3V allows for compatibility with a wide range of electronic systems, making integration easier with existing designs.

Number of Terminals: 24

A 24-terminal configuration provides versatility in connectivity and allows for more complex circuit designs, enhancing functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in environments where heat may be a concern, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is ideal for use in extreme conditions, which is particularly beneficial for outdoor and military applications.

Maximum Supply Current: 125 mA

A maximum supply current of 125 mA allows for efficient power consumption, making it suitable for battery-operated devices and applications where power efficiency is critical.

Mounting Feature: SURFACE MOUNT

Surface mount technology enables compact designs and efficient assembly processes, making this product ideal for modern, space-constrained applications.

Technical Specifications

RF/Microwave Up/Down Converters TFF1004HN/N1/T3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC24,.16SQ,20

Power Supplies (V):

3.3

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

125 mA

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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