Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TFF1004HN/N1/T3 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C, requires a 3.3V supply, and features 24 terminals with a max current of 125mA. Ideal for communication systems and signal processing.
Median Price
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Vyrian
1+ parts
100+ parts
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Anansix
Digiode
One Stop Electronics
$28.000
UNI Independent Distributors
Corphita
The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this product suitable for various applications in challenging conditions.
Operating at 3.3V allows for compatibility with a wide range of electronic systems, making integration easier with existing designs.
A 24-terminal configuration provides versatility in connectivity and allows for more complex circuit designs, enhancing functionality.
The high maximum operating temperature ensures reliability and performance in environments where heat may be a concern, making it suitable for industrial applications.
With a low minimum operating temperature, this product is ideal for use in extreme conditions, which is particularly beneficial for outdoor and military applications.
A maximum supply current of 125 mA allows for efficient power consumption, making it suitable for battery-operated devices and applications where power efficiency is critical.
Surface mount technology enables compact designs and efficient assembly processes, making this product ideal for modern, space-constrained applications.
RF/Microwave Up/Down Converters TFF1004HN/N1/T3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from NXP Semiconductors
Mounting Feature:
No. of Terminals:
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NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
1N4148
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
LM2931AZ-5.0RPG
Onsemi
LM2931AZ-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage and 0.1A max output current. It features a low dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature range from -40 to 125°C. The package style is cylindrical with matte tin terminal finish, ideal for various electronic devices needing precise voltage regulation.
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Microsemi
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Fairchild Semiconductor
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
BAV99
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317TG
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
MAX2683EUE+
Maxim Integrated
DOWN CONVERTER; Minimum Input Power (CW): 10 dBm; Minimum Intermediate Frequency (IF): 100 MHz; JESD-609 Code: e3; Maximum Intermediate Frequency (IF): 400 MHz; Characteristic Impedance: 50 ohm;
UPC8104GR
Renesas Electronics
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;
TRF1122IRTMRG3
TRF1122IRTMRG3 by Texas Instruments is an RF up converter with 2100-2700 MHz output frequency range, 20 dB min gain, and 185 mA max supply current. Ideal for applications requiring high-frequency conversion in wireless communication systems.
MAX2116UTL+
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 40; Package Body Material: PLASTIC/EPOXY; LO Tunable: YES; Construction: COMPONENT;
MAX2106UCM
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum RF Input Frequency: 2175 MHz; Construction: COMPONENT;
LA7784-TLM-E
LA7784-TLM-E by Onsemi is a RF/Microwave Up/Down Converter with 34 terminals, operating at -20 to 70 °C. It has a supply voltage of 5V and current of 130mA. This bipolar technology device is ideal for surface mount applications in various electronic systems.
F1701NBGI8
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; LO Tunable: YES; Maximum Supply Current: 210 mA;
TRF1115IRGPRG3
TRF1115IRGPRG3 by Texas Instruments is a RF/Microwave DOWN CONVERTER with 16 dB Min. Down Conversion Gain, 2300-2700 MHz RF Input Frequency range, and 400-500 MHz IF. It operates at -40 to 85°C, requires 5V supply, and has a Max. Supply Current of 180 mA. Ideal for applications requiring high-performance RF signal conversion in compact setups.
MAX2684EUE-T
DOWN CONVERTER; Characteristic Impedance: 50 ohm; Minimum Input Power (CW): 10 dBm; Minimum Intermediate Frequency (IF): 800 MHz; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn);
HMC334LP4ETR
Analog Devices
Analog Devices' HMC334LP4ETR is a 24-terminal RF down converter with a plastic/epoxy package. Operating at temperatures from -40 to 85 °C, it requires a 5V power supply and draws a max current of 225mA. Ideal for surface mount applications in RF/Microwave systems.
MAX2682EUT
MAX2682EUT by Maxim Integrated is a RF/Microwave DOWN CONVERTER with 1.5 VSWR, 8.7 dB Down Conversion Gain, and 50 ohm Impedance. It operates at -40 to 85°C, consumes 21.8 mA current, and supports RF input frequencies from 400 MHz to 2500 MHz. Ideal for applications requiring high-performance RF signal conversion in compact setups.
UPC2721GV-A
DOWN CONVERTER; Minimum Down Conversion Gain: 18 dB; Maximum Operating Temperature: 85 Cel; Minimum RF Input Frequency: 900 MHz; Characteristic Impedance: 50 ohm; Minimum Intermediate Frequency (IF): 50 MHz;
TRF1121IRGZ
TRF1121IRGZ by Texas Instruments is a 48-terminal RF/Microwave Up/Down Converter with 5V power supply. It operates b/w -40°C to 85°C, suitable for surface mount applications in various electronic devices. The package body material is made of plastic/epoxy, ensuring durability and reliability in diverse environments.
MAX9984ETP+D
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Construction: COMPONENT;
HMC571LC5RTR
Analog Devices' HMC571LC5RTR is a RF/Microwave Up/Down Converter with 32 terminals, operating at -55 to 85°C. It utilizes GaAs technology, requires 3.5V power supply, and draws a max current of 150mA. Ideal for applications requiring surface mount packages in ceramic material.
HMC265LM3TR
Analog Devices' HMC265LM3TR is a GAAS technology RF down converter with 6 terminals, operating at -40 to 85 °C. It features a min down conversion gain of -2 dB, LO tunable capability, and supports RF input frequencies from 20-31 GHz. Ideal for surface mount applications in RF/Microwave systems.
MAX2680AUT+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;
TRF1221
TRF1221 by Texas Instruments is an RF up converter with a frequency range of 1700-2450 MHz. It offers LO tunability, 270-400 MHz IF, and 0 dBm max output power. Ideal for applications requiring high-frequency RF conversion in temperatures ranging from -40 to 85°C.
TRF1221IRGZRG3
TRF1221IRGZRG3 by Texas Instruments is an RF up converter with a frequency range of 1700-3600 MHz. It operates on 5V power supply, has 48 terminals, and can handle temperatures from -40 to 85°C. Ideal for applications requiring high-frequency conversion in RF/microwave systems.
HMC7584LG
Analog Devices' HMC7584LG is an RF up converter with a frequency range of 71-76 GHz. It operates in temperatures from -40 °C to 85°C and has a tunable LO. With characteristic impedance of 50 ohm, it's ideal for microwave applications requiring IF frequencies up to 2 GHz.
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TFF1012HN/N1,115
NXP Semiconductors
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 5;
TFF1012HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 5;
TFF1013HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Maximum Operating Temperature: 85 Cel;
TFF1014HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Package Equivalence Code: LCC16,.1X.14,20;
TFF1014HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
TFF1015HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
TFF1015HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Package Equivalence Code: LCC16,.1X.14,20;
TFF1017HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC16,.1X.14,20; Minimum Operating Temperature: -40 Cel;
TFF1017HN/N1,135
TFF1018HN/N1,115
TFF1018HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Package Equivalence Code: LCC16,.1X.14,20;
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