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TFF1018HN/N1,135

NXP Semiconductors

TFF1018HN/N1,135 by NXP Semiconductors

TFF1018HN/N1,135 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,330 parts In-Stock

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4,330

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Vyrian

USA . 3,449 parts In-Stock

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3,449

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Anansix

USA . 168 parts In-Stock

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168

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$11.800

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601

$11.800

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One Stop Electronics

USA . 825 parts In-Stock

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$19.000

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825

$19.000

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UNI Independent Distributors

Spain . 5,288 parts In-Stock

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5,288

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Corphita

USA . 765 parts In-Stock

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765

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Overview

Unlock the potential of your RF applications with the TFF1018HN/N1,135 from NXP Semiconductors. Renowned for their innovative solutions, NXP delivers unparalleled quality and reliability in every component. This versatile up/down converter operates seamlessly across a wide temperature range, ensuring consistent performance even in challenging environments. Elevate your designs with enhanced efficiency and superior signal integrity—experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability while reducing weight, making it suitable for various RF/Microwave applications.

Power Supplies (V): 5

With a standard power supply requirement of 5V, this product is easily compatible with a wide range of systems, simplifying integration.

No. of Terminals: 16

The 16-terminal configuration allows for flexible connectivity options, providing ample space for various signal routing needs.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures (up to 85 °C) ensures reliability and performance in demanding environments.

Minimum Operating Temperature: -40 °C

This product's capability to function in extreme cold conditions (-40 °C) makes it ideal for outdoor applications and harsh environments.

Mounting Feature: SURFACE MOUNT

Surface mount technology allows for a compact design and easy integration into high-density circuits, making it a practical choice for modern electronics.

Technical Specifications

RF/Microwave Up/Down Converters TFF1018HN/N1,135 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC16,.1X.14,20

Power Supplies (V):

5

Sub-Category:

RF/Microwave Up/Down Converters

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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