Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TFF1013HN/N1,135 by NXP Semiconductors is an RF/Microwave Up/Down Converter with a 5V power supply and operates b/w -40 °C to 85 °C. It features a surface mount design with 16 terminals, ideal for compact applications in communication systems. This versatile component enhances signal processing efficiency in various electronic devices.
Median Price
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1k+
Vyrian
1+ parts
100+ parts
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Digiode
Anansix
One Stop Electronics
$10.000
AZTECH Wire
$20.300
QUARKTWIN TECHNOLOGY LTD
UNI Independent Distributors
Corphita
The use of plastic/epoxy for the package body ensures durability while maintaining a lightweight design, making installation and integration into various systems easier.
With a low power supply requirement of only 5V, this converter is energy-efficient and can easily be powered by standard components, reducing overall system complexity.
A total of 16 terminals provides flexibility for connections, which can accommodate various circuit topologies and increase the adaptability of this device in different applications.
The ability to operate at a maximum temperature of 85 °C indicates robust thermal performance, making it suitable for deployment in high-temperature environments.
With a minimum operating temperature of -40 °C, this product is advantageous for applications in extreme cold environments, ensuring reliable performance in a wide range of conditions.
Surface mount technology allows for a compact design and easy integration into modern circuit boards, promoting efficient space usage and reducing potential solder joint failures.
RF/Microwave Up/Down Converters TFF1013HN/N1,135 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from NXP Semiconductors
Mounting Feature:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
Sub-Category:
PCN Obsolescence/ EOL - Mult Devices EOL 30/Nov/2017
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
BAV99
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
LL4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
MBRA160T3G
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MAX2410E/D
UP/DOWN CONVERTER; Characteristic Impedance: 50 ohm; Maximum RF Input Frequency: 1900 MHz; Minimum Down Conversion Gain: 6.6 dB; JESD-609 Code: e0; Maximum RF Output Frequency: 1900 MHz;
MAX2323EGI-T
DOWN CONVERTER; LO Tunable: YES; Construction: COMPONENT; Minimum Down Conversion Gain: 8.5 dB; Terminal Finish: TIN LEAD; Minimum Intermediate Frequency (IF): 40 MHz;
LTC5577IUF#TRPBF
Analog Devices
LTC5577IUF#TRPBF by Analog Devices is a RF/Microwave Up/Down Converter with 16 terminals, operating at 3.3V. It offers LO tunability, supports RF input frequencies from 300 MHz to 6 GHz, and has a noise figure of 14 dB. Ideal for applications requiring high-performance RF conversion in the temperature range of -40°C to 105°C.
HMC815LC5TR
Analog Devices' HMC815LC5TR is a GaAs RF up converter with 32 terminals, operating from -55 °C to 85°C. It requires a 4.5V power supply and draws a max current of 300mA. Ideal for RF/microwave applications, this surface-mount device offers high performance in communication systems.
UPC2757TB-A
Renesas Electronics
DOWN CONVERTER; Maximum Noise Figure: 16 dB; Minimum Input Power (CW): 15 dBm; JESD-609 Code: e6; Maximum RF Input Frequency: 2000 MHz; Maximum Operating Temperature: 85 Cel;
MAX2323ETI+T
DOWN CONVERTER;
MAX2260EUT-T
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 3/5;
ADMV4420ACPZ-R2
Analog Devices' ADMV4420ACPZ-R2 is a BICMOS RF down converter with 26 dB min gain, LO tunable, and 5 V power supply. It operates from -40 to 85 °C, converts RF input of 16.95-22.05 GHz to IF of 900-2500 MHz, suitable for RF/Microwave applications in surface mount setups.
MAX2721EUP
UP CONVERTER; JESD-609 Code: e0; Maximum Intermediate Frequency (IF): 2500 MHz; Maximum Voltage Standing Wave Ratio: 2; Maximum RF Output Frequency: 2500 MHz; Maximum Operating Temperature: 85 Cel;
TRF1212IRGZRG3
TRF1212IRGZRG3 by Texas Instruments is a RF/Microwave DOWN CONVERTER with 2400-3550 MHz frequency range, 90 dB Down Conversion Gain, and 4.7 dB Max Noise Figure. It is suitable for applications requiring high-performance RF signal conversion in communication systems.
ADMV7320BCEZ
Analog Devices' ADMV7320BCEZ is an RF up converter with a frequency range of 81-86 GHz. It features a VSWR of 1.43, LO tunability, and operates in temperatures from -40 to 85 °C. Ideal for applications requiring high-frequency conversion in RF/microwave systems.
ADMV4630BCPZN
UP CONVERTER;
TRF1121IRGZ
TRF1121IRGZ by Texas Instruments is a 48-terminal RF/Microwave Up/Down Converter with 5V power supply. It operates b/w -40°C to 85°C, suitable for surface mount applications in various electronic devices. The package body material is made of plastic/epoxy, ensuring durability and reliability in diverse environments.
MAX2118UGL
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 40; Package Body Material: CERAMIC; Power Supplies (V): 5; JESD-609 Code: e0;
STA5630
STMicroelectronics
STA5630 by STMicroelectronics is a RF/Microwave Up/Down Converter with 32 terminals. It operates on 1.8V power supply, CMOS technology, and can withstand temperatures from -40 °C to 85°C. Ideal for applications requiring surface mount packaging in plastic/epoxy material with silver terminal finish.
HMC6505ALC5TR
HMC6505ALC5TR by Analog Devices is a RF/Microwave up converter with 5500-8600 MHz frequency range, 12 dB min gain, and 22 dBm max output power. It is ideal for applications requiring high-frequency conversion in communication systems or radar equipment.
MAX2671
Analog Devices' MAX2671 is an RF up converter with 40-2500 MHz output frequency range, 11 dB gain, and 8 dB noise figure. Ideal for applications requiring up conversion from 10 MHz IF to 500 MHz IF, it features tunable LO and TIN LEAD finish.
UPB1007K-E1
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 35 mA;
MAX9986ETP+TD
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; LO Tunable: YES;
ADRF6780ACPZN-R2
Analog Devices' ADRF6780ACPZN-R2 is an RF up converter with a frequency range of 5900-23600 MHz. It offers a min gain of 7 dB and operates in temperatures from -40 to 85°C. Ideal for applications requiring high-frequency conversion in RF/microwave systems.
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TFF1004HN/N1/T3
NXP Semiconductors
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 3.3; Maximum Operating Temperature: 85 Cel;
TFF1012HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 5;
TFF1012HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 5;
TFF1014HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Package Equivalence Code: LCC16,.1X.14,20;
TFF1014HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
TFF1015HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
TFF1015HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Package Equivalence Code: LCC16,.1X.14,20;
TFF1017HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC16,.1X.14,20; Minimum Operating Temperature: -40 Cel;
TFF1017HN/N1,135
TFF1018HN/N1,115
TFF1018HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Package Equivalence Code: LCC16,.1X.14,20;
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