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TRF1212IRGZRG3

Texas Instruments

TRF1212IRGZRG3 by Texas Instruments

TRF1212IRGZRG3 by Texas Instruments is a RF/Microwave DOWN CONVERTER with 2400-3550 MHz frequency range, 90 dB Down Conversion Gain, and 4.7 dB Max Noise Figure. It is suitable for applications requiring high-performance RF signal conversion in communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,172 parts In-Stock

1+ parts

-

100+ parts

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8,172

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Digiode

USA . 4,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,171

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 841 parts In-Stock

1+ parts

$1.495

100+ parts

-

1k+ parts

$2.166

10k+ parts

-

841

$1.495

-

$2.166

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DigiPath Technology Company

USA . 2,006 parts In-Stock

1+ parts

$1.646

100+ parts

$1.515

1k+ parts

-

10k+ parts

-

2,006

$1.646

$1.515

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ChromeModa Solutions

Germany . 4,029 parts In-Stock

1+ parts

$1.680

100+ parts

$1.378

1k+ parts

-

10k+ parts

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4,029

$1.680

$1.378

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IDEA Electronic Components Group

UK . 108 parts In-Stock

1+ parts

$1.680

100+ parts

-

1k+ parts

$1.512

10k+ parts

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108

$1.680

-

$1.512

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One Stop Electronics

USA . 488 parts In-Stock

1+ parts

$14.000

100+ parts

-

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488

$14.000

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AZTECH Wire

Italy . 726 parts In-Stock

1+ parts

$15.562

100+ parts

-

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726

$15.562

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Ampacity Inc.

Singapore . 1,037 parts In-Stock

1+ parts

$32.000

100+ parts

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1,037

$32.000

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Semicontronic

India . 916 parts In-Stock

1+ parts

$37.000

100+ parts

$36.075

1k+ parts

$35.890

10k+ parts

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916

$37.000

$36.075

$35.890

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Corphita

USA . 4,734 parts In-Stock

1+ parts

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100+ parts

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4,734

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Corohmni

South Africa . 80 parts In-Stock

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80

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Overview

Enhance your RF/Microwave systems with the TRF1212IRGZRG3 by Texas Instruments, a top-quality down converter that offers unparalleled performance and reliability. Designed with precision and expertise, this component is ideal for a wide range of applications, providing seamless integration and superior functionality. With its advanced features and innovative technology, customers can expect exceptional value, enhanced efficiency, and unmatched results. Trust Texas Instruments to deliver excellence in every product, and elevate your projects to new heights with the TRF1212IRGZRG3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, making the product reliable for long-term use.

Maximum RF Output Frequency: 3550 MHz

High frequency output allows for versatile use in a wide range of RF applications.

Minimum RF Output Frequency: 2400 MHz

Low minimum output frequency ensures compatibility with a variety of RF systems and devices.

Power Supplies: 5 V

Operates on a common voltage, making it easy to integrate into existing systems without additional power source requirements.

No. of Terminals: 48

Provides ample connectivity options for various input and output connections, enhancing versatility and compatibility.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for use in demanding environments.

Minimum Down Conversion Gain: 90 dB

High conversion gain ensures strong signal output with minimal loss, optimizing performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: Matte Tin (Sn)

Provides reliable terminal connections and prevents corrosion, ensuring long-term performance.

LO Tunable: YES

Allows for fine-tuning of the local oscillator frequency, enabling precise control and adjustment.

RF or Microwave Device Type: DOWN CONVERTER

Specifically designed for down conversion applications, ensuring optimized performance for signal processing.

Characteristic Impedance: 50 ohm

Matches standard impedance requirements, ensuring compatibility with a wide range of RF systems and devices.

Minimum Intermediate Frequency (IF): 400 MHz

Provides flexibility in signal processing and compatibility with various IF requirements.

Maximum Noise Figure: 4.7 dB

Low noise figure ensures clean and clear signal output, minimizing interference.

Minimum Input Power (CW): 20 dBm

Can handle high input power levels without distortion, ensuring reliable performance under demanding conditions.

Maximum Intermediate Frequency (IF): 500 MHz

Supports a wide range of IF frequencies, ensuring versatility in signal processing and compatibility.

Mounting Feature: SURFACE MOUNT

Easy to mount on circuit boards, simplifying installation and integration into systems.

Technical Specifications

RF/Microwave Up/Down Converters TRF1212IRGZRG3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Down Conversion Gain:

90 dB

Maximum Intermediate Frequency (IF):

500 MHz

Minimum Intermediate Frequency (IF):

400 MHz

Minimum Input Power (CW):

20 dBm

JESD-609 Code:

e3

LO Tunable:

YES

Mounting Feature:

Maximum Noise Figure:

4.7 dB

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC48,.27SQ,20

Power Supplies (V):

5

Maximum RF Output Frequency:

3550 MHz

Minimum RF Output Frequency:

2400 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Terminal Finish:

Matte Tin (Sn)

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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