Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Terminal Finish: Tin/Lead (Sn/Pb);
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RF/Microwave Up/Down Converters UPC2721GR-E1 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Renesas Electronics
JESD-609 Code:
Mounting Feature:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
Sub-Category:
Maximum Supply Current:
Technology:
Terminal Finish:
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
Shenzhen Yixinsemi Electronics
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDV303N
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
BAV99
Kingwell Technonlogy
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
LM2931AZ-5.0G
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
HMC951LP4E
Analog Devices
HMC951LP4E by Analog Devices is a RF/Microwave DOWN CONVERTER with 10 dB Min Down Conversion Gain, 5600-8600 MHz RF Input Frequency range, and 50 ohm Characteristic Impedance. It operates b/w -55 to 85 °C and has LO Tunable feature. Ideal for applications requiring high-performance RF signal conversion in various electronic systems.
TRF1212IRGZT
Texas Instruments
TRF1212IRGZT by Texas Instruments is a RF down converter with freq range 2400-3550 MHz, gain of 90 dB, and noise figure of 4.7 dB. It's ideal for applications requiring high performance in wireless communication systems.
HMC7911LP5E
Analog Devices' HMC7911LP5E is a RF up converter with 17-20 GHz output frequency range, 13.5 dB min gain, and LO tunability. Ideal for applications requiring high-frequency conversion in RF/microwave systems, it operates b/w -40 °C to 85°C with a 5V power supply and surface mounting feature.
PMB2332
Infineon Technologies
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Intermediate Frequency (IF): 3000 MHz;
GC1012B-PQ
GC1012B-PQ by Texas Instruments is a CMOS RF down converter with LO tunable feature. It operates at 3.3V, has 120 terminals, and supports surface mounting. With a temperature range of -40 to 85°C, it uses Nickel/Palladium/Gold finish for applications in RF/Microwave systems.
TRF1216IRGPR
TRF1216IRGPR by Texas Instruments is a RF down converter with 27 dB min gain, LO tunable feature, and 5V power supply. It operates b/w -40 to 85°C and supports RF input frequencies from 3300-3800 MHz. Ideal for applications requiring surface mounting and 50 ohm impedance.
MAX2700ECM
Maxim Integrated
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Supply Current: 230 mA; Package Equivalence Code: TQFP48,.35SQ;
MAX9994ETP
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Supply Current: 235 mA;
HMC6789BLC5ATR-R5
Analog Devices' HMC6789BLC5ATR-R5 is a GAAS technology RF down converter with 10 dB min. gain, operating from -40 to 85 °C. It features LO tunability, 37-44 GHz RF input range, and 0-4 GHz IF output. Ideal for RF/microwave applications requiring high-performance surface mount components.
UPC2756TB-E3
Renesas Electronics
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Package Equivalence Code: TSSOP6,.08;
TFF1018HN/N1,135
NXP Semiconductors
TFF1018HN/N1,135 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in diverse environments.
TRF1222IRTMRG3
TRF1222IRTMRG3 by Texas Instruments is an RF up converter with freq range 3300-3800 MHz, gain of 22 dB, and power supply of 5V. Ideal for applications requiring high frequency conversion in RF/Microwave systems. Package material is PLASTIC/EPOXY with 32 terminals for surface mounting.
935263708518
UP/DOWN CONVERTER; Maximum RF Input Frequency: 2500 MHz; Minimum RF Input Frequency: 2400 MHz; Maximum Intermediate Frequency (IF): 400 MHz; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel;
MAX2700ECM-TD
DOWN CONVERTER; Terminal Finish: Tin/Lead (Sn/Pb); Characteristic Impedance: 50 ohm; Minimum RF Input Frequency: 1800 MHz; Construction: COMPONENT; LO Tunable: YES;
ADMV1010AEZ-R7
Analog Devices' ADMV1010AEZ-R7 is a GAAS technology RF down converter with 11 dB min. gain, 2.6 dB max. noise figure, and LO tunability. Ideal for RF applications requiring 12600-15400 MHz input freq., it operates at -40 to 85 °C with 4V supply and consumes up to 100 mA current in a ceramic package for surface mounting.
MAX9986ETP+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum RF Input Frequency: 995 MHz;
HMC8119-SX
Analog Devices' HMC8119-SX is an RF/Microwave UP CONVERTER with a frequency range of 81-86 GHz. It features LO tunability, operates b/w -55°C to 85°C, and has a characteristic impedance of 50 ohm. Ideal for applications requiring high-frequency conversion in components construction.
MAX2411AEEI+T
UP/DOWN CONVERTER; Maximum RF Input Frequency: 1900 MHz; Terminal Finish: MATTE TIN; Minimum Operating Temperature: -40 Cel; Maximum RF Output Frequency: 1900 MHz; Maximum Operating Temperature: 85 Cel;
MAX2700ECM-T
DOWN CONVERTER; Minimum RF Input Frequency: 1800 MHz; Maximum Voltage Standing Wave Ratio: 1.7; Maximum RF Input Frequency: 2100 MHz; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm;
MAX2327EUP+
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; LO Tunable: YES; Maximum Supply Current: 19.5 mA;
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UPC2758TB-E3-A
California Eastern Laboratories
DOWN CONVERTER; Minimum Intermediate Frequency (IF): 20 MHz; Maximum Noise Figure: 15 dB; Maximum Intermediate Frequency (IF): 300 MHz; Minimum Down Conversion Gain: 14 dB; LO Tunable: YES;
UPC2758TB-E3-A by Renesas Electronics is a RF/Microwave Up/Down Converter with 6 terminals and a max supply current of 14.8 mA. It operates in temperatures ranging from -40 to 85 °C and is suitable for surface mount applications.
UPC2756TB
DOWN CONVERTER; Terminal Finish: Tin/Lead (Sn/Pb); Minimum RF Input Frequency: 100 MHz; LO Tunable: YES; Minimum Intermediate Frequency (IF): 10 MHz; Minimum Down Conversion Gain: 11 dB;
UPC2721GV-E1
UPC2731GS
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -20 Cel;
UPC2753GR
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 8.5 mA;
UPC2722GR-E3
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;
UPC2756TB-A
DOWN CONVERTER; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; Maximum RF Input Frequency: 2000 MHz; Maximum Noise Figure: 16 dB; Maximum Intermediate Frequency (IF): 300 MHz;
UPC2721GR-E2
UPC2734GR
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e0;
UPC2721GV-E1-A
DOWN CONVERTER; Minimum RF Input Frequency: 900 MHz; Maximum RF Input Frequency: 2000 MHz; Minimum Down Conversion Gain: 18 dB; Maximum Noise Figure: 15 dB; JESD-609 Code: e6;
UPC2743GS
UPC2744GS-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 59 mA;
UPC2722GR-E2
UPC2756T
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;
UPC2721GV-A
DOWN CONVERTER; Minimum Down Conversion Gain: 18 dB; Maximum Operating Temperature: 85 Cel; Minimum RF Input Frequency: 900 MHz; Characteristic Impedance: 50 ohm; Minimum Intermediate Frequency (IF): 50 MHz;
UPC2743GS-E1
UPC2722GV-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 5;
UPC2721GR-E3
Supply Digital Components
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12,000 In-Stock
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