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TRF1222IRTMRG3

Texas Instruments

TRF1222IRTMRG3 by Texas Instruments

TRF1222IRTMRG3 by Texas Instruments is an RF up converter with freq range 3300-3800 MHz, gain of 22 dB, and power supply of 5V. Ideal for applications requiring high frequency conversion in RF/Microwave systems. Package material is PLASTIC/EPOXY with 32 terminals for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,174 parts In-Stock

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Digiode

USA . 957 parts In-Stock

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957

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Distributors (Availability)

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Parana Technologies

USA . 443 parts In-Stock

1+ parts

$0.978

100+ parts

-

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$1.870

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443

$0.978

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$1.870

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ChromeModa Solutions

Germany . 6,408 parts In-Stock

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$1.099

100+ parts

$0.901

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6,408

$1.099

$0.901

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IDEA Electronic Components Group

UK . 920 parts In-Stock

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$1.099

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$0.989

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920

$1.099

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$0.989

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One Stop Electronics

USA . 1,412 parts In-Stock

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$4.000

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$4.000

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

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$7.000

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$7.000

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Semicontronic

India . 677 parts In-Stock

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$8.000

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$7.800

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$7.760

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677

$8.000

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$7.760

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AZTECH Wire

Italy . 709 parts In-Stock

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$17.365

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$17.365

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Corphita

USA . 2,612 parts In-Stock

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DigiPath Technology Company

USA . 897 parts In-Stock

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$0.991

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$0.991

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Corohmni

South Africa . 72 parts In-Stock

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Overview

Elevate your RF/Microwave system with the TRF1222IRTMRG3 by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers a product that exceeds expectations. This UP CONVERTER offers seamless integration, exceptional performance, and reliable operation in a wide range of applications. With a construction that ensures durability and efficiency, this converter provides a minimum up conversion gain of 22 dB, making it the ideal choice for your RF/Microwave needs. Experience the value and benefits of the TRF1222IRTMRG3 – where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum RF Output Frequency: 3800 MHz

With a high maximum RF output frequency of 3800 MHz, this converter can support various RF communication systems and applications.

Construction: COMPONENT

The component construction of this converter ensures reliability and stability in performance, making it suitable for long-term use.

Minimum RF Output Frequency: 3300 MHz

The low minimum RF output frequency of 3300 MHz enables the converter to cover a wide range of frequencies, increasing its versatility.

Power Supplies (V): 5

Operating at 5V, this converter can be easily powered using common power sources, simplifying integration into existing systems.

No. of Terminals: 32

Having 32 terminals allows for a high degree of connectivity and flexibility in configuring the converter within a system.

Minimum Up Conversion Gain: 22 dB

With a minimum up conversion gain of 22 dB, this converter provides a strong output signal, enhancing overall system performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C means that this converter can withstand extremely cold conditions without performance degradation.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides corrosion resistance and ensures a reliable electrical connection for long-lasting performance.

Maximum Supply Current: 200 mA

Operating at a maximum supply current of 200 mA, this converter helps optimize power consumption and efficiency in the system.

RF or Microwave Device Type: UP CONVERTER

Being an up converter, this device is essential for translating lower-frequency signals to higher frequencies, enabling compatibility with a wide range of RF systems.

Characteristic Impedance: 50 ohm

With a characteristic impedance of 50 ohms, this converter is compatible with standard RF systems and ensures optimal signal transfer.

Minimum Input Power (CW): 10 dBm

The low minimum input power of 10 dBm ensures that the converter can effectively process weak signals, enhancing sensitivity and overall system performance.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies installation and integration into existing systems, making it a convenient choice for various applications.

Technical Specifications

RF/Microwave Up/Down Converters TRF1222IRTMRG3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Input Power (CW):

10 dBm

JESD-609 Code:

e3

LO Tunable:

NO

Mounting Feature:

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC32,.2SQ,20

Power Supplies (V):

5

Maximum RF Output Frequency:

3800 MHz

Minimum RF Output Frequency:

3300 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

200 mA

Terminal Finish:

Matte Tin (Sn)

Minimum Up Conversion Gain:

22 dB

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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