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TRF1122IRTMR

Texas Instruments

TRF1122IRTMR by Texas Instruments

TRF1122IRTMR by Texas Instruments is an RF up converter with a frequency range of 2100-2700 MHz and 20 dB min gain. It operates on a 5V power supply, has 32 terminals, and can handle input power of 10 dBm. Ideal for applications requiring high-frequency conversion in RF/microwave systems.

Median Price

$8.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17,427 parts In-Stock

1+ parts

-

100+ parts

$7.680

1k+ parts

$6.870

10k+ parts

$6.460

17,427

-

$7.680

$6.870

$6.460

DigiKey

USA . 17,427 parts In-Stock

1+ parts

-

100+ parts

$8.870

1k+ parts

-

10k+ parts

-

17,427

-

$8.870

-

-

Verical

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$9.600

1k+ parts

$8.588

10k+ parts

$8.075

7,500

-

$9.600

$8.588

$8.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,842 parts In-Stock

1+ parts

$8.104

100+ parts

-

1k+ parts

-

10k+ parts

-

1,842

$8.104

-

-

-

Vyrian

USA . 4,699 parts In-Stock

1+ parts

$8.530

100+ parts

-

1k+ parts

-

10k+ parts

-

4,699

$8.530

-

-

-

DigiKey Marketplace

USA . 17,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,427

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 233 parts In-Stock

1+ parts

$1.797

100+ parts

-

1k+ parts

$2.356

10k+ parts

-

233

$1.797

-

$2.356

-

IDEA Electronic Components Group

UK . 1,313 parts In-Stock

1+ parts

$2.019

100+ parts

-

1k+ parts

$1.817

10k+ parts

-

1,313

$2.019

-

$1.817

-

ChromeModa Solutions

Germany . 758 parts In-Stock

1+ parts

$2.019

100+ parts

$1.656

1k+ parts

-

10k+ parts

-

758

$2.019

$1.656

-

-

Corphita

USA . 3,891 parts In-Stock

1+ parts

$7.677

100+ parts

-

1k+ parts

-

10k+ parts

-

3,891

$7.677

-

-

-

Authorized Procurement Solutions

USA . 404,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

404,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,023

-

-

-

-

DigiPath Technology Company

USA . 587 parts In-Stock

1+ parts

-

100+ parts

$1.820

1k+ parts

-

10k+ parts

-

587

-

$1.820

-

-

Kepictronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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250

-

-

-

-

Overview

Unleash the power of cutting-edge RF technology with the TRF1122IRTMR from Texas Instruments. Crafted with precision and expertise, this RF/Microwave Up/Down Converter is designed to deliver seamless performance in a wide range of applications. With a maximum RF output frequency of 2700 MHz and a minimum RF output frequency of 2100 MHz, this component offers unparalleled quality and reliability. Whether you're looking to amplify signals or enhance communication systems, this converter provides the perfect solution. Elevate your projects with the TRF1122IRTMR and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures reliability and longevity in various operating conditions.

Maximum RF Output Frequency: 2700 MHz

Wide frequency range allows for versatile applications and compatibility with various systems.

Construction: COMPONENT

High-quality components ensure excellent performance and reliability in RF/microwave systems.

Minimum RF Output Frequency: 2100 MHz

Provides flexibility in operating frequencies for different applications and use cases.

Power Supplies (V): 5

Low power consumption makes it energy-efficient and cost-effective to operate.

No. of Terminals: 32

Sufficient terminals for connectivity and integration in complex RF systems.

Minimum Up Conversion Gain: 20 dB

High conversion gain ensures minimal signal loss and high signal quality in up-conversion processes.

Maximum Operating Temperature: 85 °C

Wide temperature range allows for reliable operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to operate in low-temperature environments without compromising performance.

Terminal Finish: Matte Tin (Sn)

Corrosion-resistant finish for long-term reliability and performance.

LO Tunable: YES

Provides flexibility in local oscillator tuning for different RF frequency requirements.

Maximum Supply Current: 185 mA

Efficient power consumption for reliable and cost-effective operation.

RF or Microwave Device Type: UP CONVERTER

Specifically designed for up-conversion processes, ensuring optimal performance in RF systems.

Characteristic Impedance: 50 ohm

Optimal impedance matching for efficient signal transmission and reception.

Minimum Input Power (CW): 10 dBm

Supports input power levels for various applications without the need for external amplification.

Mounting Feature: SURFACE MOUNT

Easy installation and integration in RF systems, saving time and effort during setup.

Technical Specifications

RF/Microwave Up/Down Converters TRF1122IRTMR attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Input Power (CW):

10 dBm

JESD-609 Code:

e3

LO Tunable:

YES

Mounting Feature:

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC32,.2SQ,20

Power Supplies (V):

5

Maximum RF Output Frequency:

2700 MHz

Minimum RF Output Frequency:

2100 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

185 mA

Terminal Finish:

Matte Tin (Sn)

Minimum Up Conversion Gain:

20 dB

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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