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SN761688PW

Texas Instruments

SN761688PW by Texas Instruments

SN761688PW by Texas Instruments is a RF/Microwave DOWN CONVERTER with 16 terminals, operating at 5V. It offers a min Down Conversion Gain of 21 dB and Max Noise Figure of 10 dB. Ideal for applications requiring surface mount components in temperature range -20 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,132 parts In-Stock

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5,132

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Digiode

USA . 4,256 parts In-Stock

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4,256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,064 parts In-Stock

1+ parts

$2.086

100+ parts

-

1k+ parts

$2.604

10k+ parts

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2,064

$2.086

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$2.604

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DigiPath Technology Company

USA . 794 parts In-Stock

1+ parts

$2.297

100+ parts

$2.113

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-

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794

$2.297

$2.113

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ChromeModa Solutions

Germany . 3,520 parts In-Stock

1+ parts

$2.344

100+ parts

$1.922

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-

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3,520

$2.344

$1.922

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IDEA Electronic Components Group

UK . 2,327 parts In-Stock

1+ parts

$2.344

100+ parts

-

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$2.110

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2,327

$2.344

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$2.110

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One Stop Electronics

USA . 466 parts In-Stock

1+ parts

$6.000

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466

$6.000

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Ampacity Inc.

Singapore . 991 parts In-Stock

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$7.000

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991

$7.000

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AZTECH Wire

Italy . 831 parts In-Stock

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$17.117

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831

$17.117

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Semicontronic

India . 1,257 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

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1,257

$27.000

$26.325

$26.190

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QUARKTWIN TECHNOLOGY LTD

USA . 27,797 parts In-Stock

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27,797

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Corphita

USA . 2,298 parts In-Stock

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2,298

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Corohmni

South Africa . 205 parts In-Stock

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205

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Overview

Elevate your RF/Microwave projects with the SN761688PW by Texas Instruments. Crafted with precision and expertise, this high-quality down converter offers exceptional performance and reliability. From its durable construction to its superior power supplies, this component is designed to exceed expectations. Whether you're working on communication systems or radar applications, this versatile device delivers unmatched value and efficiency. Trust Texas Instruments to provide you with the tools you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the converter easy to handle and transport.

Construction: COMPONENT

Component construction allows for easy integration into existing systems and enables efficient maintenance.

Power Supplies (V): 5

The low power supply requirement of 5V ensures energy efficiency and compatibility with a wide range of power sources.

No. of Terminals: 16

The large number of terminals provides flexibility for connectivity options and allows for multiple input and output configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this converter can withstand harsh environmental conditions and maintain performance.

Minimum Down Conversion Gain: 21 dB

The high minimum down conversion gain of 21 dB ensures strong signal conversion and minimal signal loss during operation.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C allows for reliable performance even in cold environments.

RF or Microwave Device Type: DOWN CONVERTER

This converter is specifically designed for down conversion applications, ensuring optimized performance for signal processing.

Maximum Noise Figure: 10 dB

The low maximum noise figure of 10 dB results in clear signal output with minimal interference, providing high-quality converted signals.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for easy and secure installation of the converter onto circuit boards or other surfaces.

Technical Specifications

RF/Microwave Up/Down Converters SN761688PW attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments

Specs

Construction:

COMPONENT

Minimum Down Conversion Gain:

21 dB

LO Tunable:

NO

Mounting Feature:

Maximum Noise Figure:

10 dB

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

Package Equivalence Code:

TSSOP16,.25

Power Supplies (V):

5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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