Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF1221 by Texas Instruments is an RF up converter with a frequency range of 1700-2450 MHz. It offers LO tunability, 270-400 MHz IF, and 0 dBm max output power. Ideal for applications requiring high-frequency RF conversion in temperatures ranging from -40 to 85°C.
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Having a high maximum RF output frequency allows for compatibility with a wide range of RF devices and applications.
The use of high-quality components ensures reliability and durability, making this product suitable for long-term use in various settings.
The wide frequency range, from 1700 MHz to 2450 MHz, enables flexibility in operation and compatibility with a variety of systems.
The high maximum operating temperature allows for reliable performance even in challenging environmental conditions.
The low minimum operating temperature ensures that the converter can function in a wide range of temperature conditions.
The ability to tune the local oscillator allows for precise frequency control and optimization of performance.
Being an up converter, this device is suitable for applications where the RF signal needs to be converted to a higher frequency.
The low minimum intermediate frequency enables the converter to work effectively with a wide range of IF frequencies.
With a maximum output power of 0 dBm, the converter can provide a strong RF signal for various applications.
The high minimum input power ensures that the converter can handle a strong input signal without distortion.
The high maximum intermediate frequency allows for flexibility in the choice of IF frequencies and compatibility with different systems.
RF/Microwave Up/Down Converters TRF1221 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments
Construction:
Maximum Intermediate Frequency (IF):
Minimum Intermediate Frequency (IF):
Minimum Input Power (CW):
LO Tunable:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Output Power:
Maximum RF Output Frequency:
Minimum RF Output Frequency:
RF or Microwave Device Type:
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sangdest Microelectronics (Nanjing)
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Texas Instruments
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
MAX9986ETP+TD
Maxim Integrated
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; LO Tunable: YES;
HMC709LC5RTR
Analog Devices
Analog Devices' HMC709LC5RTR is a RF/Microwave Up/Down Converter with 32 terminals, operating at -55 to 85°C. Utilizing GaAs technology, it requires a 5V power supply and draws a max current of 150mA. Ideal for surface mount applications in various communication systems.
MAX2701ECM-T
DOWN CONVERTER; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Maximum RF Input Frequency: 2500 MHz; Maximum Voltage Standing Wave Ratio: 1.2; Minimum RF Input Frequency: 2100 MHz;
MAX2329EUP
DOWN CONVERTER; JESD-609 Code: e0; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Terminal Finish: TIN LEAD;
MAX2327EUP-T
DOWN CONVERTER; LO Tunable: YES; Minimum Down Conversion Gain: 7.8 dB; Minimum Intermediate Frequency (IF): 50 MHz; Maximum Intermediate Frequency (IF): 400 MHz; JESD-609 Code: e0;
IAM-82008-STR
Hewlett Packard
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Down Conversion Gain: 13 dB;
DRR1-2311
Broadcom
DOWN CONVERTER; Maximum Noise Figure: 5.5 dB; Construction: COMPONENT; Maximum Intermediate Frequency (IF): 650 MHz; Minimum Down Conversion Gain: 18 dB; Maximum Operating Temperature: 70 Cel;
MAX2104CCM-D
DOWN CONVERTER; Characteristic Impedance: 50 ohm; Minimum RF Input Frequency: 925 MHz; Construction: COMPONENT; LO Tunable: YES; Terminal Finish: Tin/Lead (Sn85Pb15);
MAX2411AEEI-T
UP/DOWN CONVERTER; Maximum RF Output Frequency: 1900 MHz; JESD-609 Code: e0; Minimum Down Conversion Gain: 8.5 dB; Minimum Up Conversion Gain: 6.8 dB; Maximum Voltage Standing Wave Ratio: 2;
MAX2721EUP+
UP CONVERTER; Maximum Voltage Standing Wave Ratio: 2; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm; Maximum RF Output Frequency: 2500 MHz; Maximum Output Power: -2.5 dBm;
MAX2104CCM
DOWN CONVERTER; Maximum RF Input Frequency: 2175 MHz; Characteristic Impedance: 50 ohm; LO Tunable: YES; Construction: COMPONENT; Terminal Finish: Tin/Lead (Sn85Pb15);
ADMV1013ACCZ
The Analog Devices ADMV1013ACCZ is an RF up converter with a frequency range of 24-44 GHz and gain of 13 dB. It operates in temperatures from -40 to 85°C, making it suitable for various RF/microwave applications requiring high performance and wide frequency coverage. With a noise figure of 19 dB and impedance of 50 ohms, this component is ideal for systems demanding low noise and precise signal conversion.
MAX2682EUT+T
Analog Devices' MAX2682EUT+T is a RF/Microwave DOWN CONVERTER with 1.5 VSWR, 8.7 dB Min Gain, and LO Tunable feature. It operates from -40 to 85°C, consumes 12.7 mA at 3/5V supplies, and supports RF input range of 400-2500 MHz for various communication applications.
HMC6787ALC5A
HMC6787ALC5A by Analog Devices is an RF/Microwave Up Converter with a frequency range of 37-40 GHz. It offers a min gain of 7 dB and operates in temperatures from -40 to 85°C. Ideal for applications requiring up conversion in the 0-4 GHz intermediate frequency range.
TA4107F(TE85L)
Toshiba
DOWN CONVERTER;
HMC710LC5RTR
Analog Devices' HMC710LC5RTR is a RF/Microwave Up/Down Converter with 32 terminals, operating from -55°C to 85°C. Utilizing GaAs technology, it requires a 5V power supply and draws a max current of 108mA. Ideal for surface mount applications in various communication systems.
IAM-82008-TR1
Agilent Technologies
Agilent Technologies' IAM-82008-TR1 is a RF/Microwave Down Converter with 2.5 VSWR, 13 dB min gain, and 10V power supply. It operates from -40 to 85°C, supports RF input frequencies of 50-5000 MHz, and has IF range of 0-2000 MHz. Ideal for surface mount applications in electronic systems requiring high-performance down conversion capabilities.
HMC6146BLC5ATR
Analog Devices' HMC6146BLC5ATR is a RF up converter with 40-44 GHz output frequency range, 7 dB min gain, and GaAs technology. Ideal for applications requiring high-frequency conversion in RF/microwave systems. Features include ceramic package, gold over nickel terminal finish, and LO tunability.
ADSST-GPSRF01BSTZ
ADSST-GPSRF01BSTZ by Analog Devices is a RF down converter with 2 VSWR, -40 to 85 °C operating temp range, and 7 dB min gain. It's used for RF signal conversion from 1570-1580 MHz to IF of 24-25.5 MHz in various applications like communication systems.
CLC5903SM
DOWN CONVERTER; Minimum Operating Temperature: -40 Cel; LO Tunable: NO; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Terminal Finish: TIN LEAD;
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DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TRF1122IRTMR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Maximum RF Output Frequency: 2700 MHz; Power Supplies (V): 5;
TRF1115IRGPTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Maximum Noise Figure: 7 dB;
TRF1112IRGZRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Minimum RF Output Frequency: 1700 MHz;
TRF1121IRGZTG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Maximum Intermediate Frequency (IF): 350 MHz;
TRF1121IRGZ
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
TRF1115IRGPRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Maximum Noise Figure: 7 dB; Maximum Supply Current: 180 mA;
TRF1122IRTMRG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Additional Features: TTL COMPATIBLE; Characteristic Impedance: 50 ohm;
TRF1015DB-00
DOWN CONVERTER; Maximum RF Input Frequency: 894 MHz; Additional Features: LOW NOISE; Maximum Operating Temperature: 85 Cel; Minimum Down Conversion Gain: 9 dB; Minimum RF Input Frequency: 869 MHz;
TRF1121
UP CONVERTER; Maximum Output Power: 0 dBm; LO Tunable: YES; Minimum Operating Temperature: -40 Cel; Maximum Intermediate Frequency (IF): 400 MHz; Minimum RF Output Frequency: 1500 MHz;
TRF1112IRGZT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1121IRGZT
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel;
TRF1121IRGZR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; LO Tunable: YES;
TRF1115IRGPR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 16 dB; Maximum Noise Figure: 7 dB;
TRF1122
UP CONVERTER; Minimum RF Output Frequency: 2100 MHz; Minimum Up Conversion Gain: 20 dB; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;
TRF1112IRGZR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC48,.27SQ,20; Minimum Intermediate Frequency (IF): 400 MHz;
TRF1115IRGPT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Input Power (CW): 5 dBm; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1015DB
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Additional Features: LOW NOISE;
TRF1112
DOWN CONVERTER; LO Tunable: YES; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Maximum Noise Figure: 4.7 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1112IRGZTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Minimum Input Power (CW): 20 dBm;
TRF1121IRGZRG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Construction: COMPONENT; Power Supplies (V): 5;
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