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HMC869LC5

Analog Devices

HMC869LC5 by Analog Devices

Analog Devices' HMC869LC5 is a RF/Microwave DOWN CONVERTER with 12000-16000 MHz frequency range, 10 dB min gain, and LO tunable feature. It operates at -40 to 85 °C, requires 3.5V power supply, and has 32 terminals for surface mount applications in various communication systems.

Median Price

$40.763

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 10 parts In-Stock

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$40.296

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$40.296

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$40.296

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$40.296

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$40.296

$40.296

$40.296

$40.296

Arrow

USA . 10 parts In-Stock

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$41.230

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$41.230

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Digiode

USA . 500 parts In-Stock

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$38.281

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500

$38.281

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Vyrian

USA . 3,176 parts In-Stock

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Cogito LLC

Ukraine . 23 parts In-Stock

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NexGen Digital

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Distributors (Availability)

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Parana Technologies

USA . 772 parts In-Stock

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$2.007

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$1.866

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$2.007

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IDEA Electronic Components Group

UK . 2,045 parts In-Stock

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$2.158

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$2.050

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$2.158

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DigiPath Technology Company

USA . 1,333 parts In-Stock

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$3.366

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$3.232

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Semicontronic

India . 10 parts In-Stock

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$34.250

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$33.394

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$33.222

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Corphita

USA . 996 parts In-Stock

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$36.266

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$36.266

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance with the HMC869LC5 by Analog Devices. Designed for RF/Microwave Up/Down Converters, this component boasts a wide frequency range and superior construction. With a maximum RF output frequency of 16 GHz and a minimum down conversion gain of 10 dB, this product delivers optimal results. The innovative technology and meticulous craftsmanship of Analog Devices ensure reliability and precision in every application. Elevate your projects with the HMC869LC5 and experience the unmatched value it brings to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high mechanical strength, ensuring durability and reliable performance.

Maximum RF Output Frequency: 16000 MHz

High maximum RF output frequency allows for versatile and wideband communication capabilities.

Construction: COMPONENT

Component construction enables easy integration into existing RF systems.

Minimum RF Output Frequency: 12000 MHz

Low minimum RF output frequency ensures compatibility with a wide range of RF applications.

Power Supplies (V): 3,5

Low power supply voltage requirement helps in reducing power consumption and operating costs.

No. of Terminals: 32

Large number of terminals offer flexibility in connectivity and signal routing.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability even in harsh environmental conditions.

Minimum Down Conversion Gain: 10 dB

Minimum down conversion gain ensures signal quality and clarity in the conversion process.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments.

Terminal Finish: GOLD OVER NICKEL

Gold over nickel terminal finish provides excellent corrosion resistance and ensures long-term reliability.

LO Tunable: YES

LO tunable feature allows for fine-tuning of local oscillator frequency, enabling precise control and optimization of performance.

Technology: GAAS

GaAs technology offers high-reliability performance in RF applications and ensures efficient signal processing.

Maximum Supply Current: 120 mA

Low maximum supply current requirement minimizes power consumption and heat dissipation.

RF or Microwave Device Type: DOWN CONVERTER

Specifically designed as a down converter for converting high-frequency RF signals to intermediate frequencies, making it suitable for various RF system designs.

Characteristic Impedance: 50 ohm

Standard 50 ohm characteristic impedance ensures compatibility with a wide range of RF components and systems.

Minimum Intermediate Frequency (IF): 0 MHz

Low minimum intermediate frequency allows for flexibility in signal processing and compatibility with different system requirements.

Maximum Intermediate Frequency (IF): 3500 MHz

High maximum intermediate frequency capability enables versatile signal processing and frequency conversion capabilities.

Mounting Feature: SURFACE MOUNT

Surface mounting feature offers easy and convenient installation in compact RF system designs.

Technical Specifications

RF/Microwave Up/Down Converters HMC869LC5 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Analog Devices

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Down Conversion Gain:

10 dB

Maximum Intermediate Frequency (IF):

3500 MHz

Minimum Intermediate Frequency (IF):

0 MHz

JESD-609 Code:

e4

LO Tunable:

YES

Mounting Feature:

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC32,.2SQ,20

Power Supplies (V):

3,5

Maximum RF Output Frequency:

16000 MHz

Minimum RF Output Frequency:

12000 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

120 mA

Technology:

Terminal Finish:

GOLD OVER NICKEL

Trade Compliance

HMC869LC5 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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