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TRF1115IRGPRG3

Texas Instruments

TRF1115IRGPRG3 by Texas Instruments

TRF1115IRGPRG3 by Texas Instruments is a RF/Microwave DOWN CONVERTER with 16 dB Min. Down Conversion Gain, 2300-2700 MHz RF Input Frequency range, and 400-500 MHz IF. It operates at -40 to 85°C, requires 5V supply, and has a Max. Supply Current of 180 mA. Ideal for applications requiring high-performance RF signal conversion in compact setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,097 parts In-Stock

1+ parts

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7,097

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Digiode

USA . 1,750 parts In-Stock

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1,750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 658 parts In-Stock

1+ parts

$1.362

100+ parts

-

1k+ parts

$2.086

10k+ parts

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658

$1.362

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$2.086

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ChromeModa Solutions

Germany . 1,144 parts In-Stock

1+ parts

$1.530

100+ parts

$1.255

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1,144

$1.530

$1.255

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IDEA Electronic Components Group

UK . 129 parts In-Stock

1+ parts

$1.530

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-

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$1.377

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129

$1.530

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$1.377

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AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$5.701

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273

$5.701

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One Stop Electronics

USA . 1,368 parts In-Stock

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$23.000

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1,368

$23.000

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Semicontronic

India . 216 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

1k+ parts

$24.250

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216

$25.000

$24.375

$24.250

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DigiPath Technology Company

USA . 2,214 parts In-Stock

1+ parts

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$1.379

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2,214

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$1.379

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Corphita

USA . 1,825 parts In-Stock

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1,825

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Corohmni

South Africa . 378 parts In-Stock

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378

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Overview

Unleash the power of cutting-edge RF/Microwave technology with the TRF1115IRGPRG3 by Texas Instruments. Crafted with precision and expertise, this component offers unparalleled performance in up/down conversion applications. From its robust construction to its top-notch quality, every detail is designed to exceed expectations. With a wide range of features including tunable LO, low noise figure, and impressive gain, this product delivers exceptional value and benefits to customers seeking reliability and efficiency in their RF systems. Trust Texas Instruments to elevate your projects to the next level with the TRF1115IRGPRG3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the converter lightweight and durable, ideal for portable applications.

Power Supplies (V): 5

Low power supply requirement of 5V allows for efficient power usage.

No. of Terminals: 20

With 20 terminals, this converter offers versatile connectivity options for various systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance even in harsh environments.

Minimum Down Conversion Gain: 16 dB

Minimum down conversion gain of 16dB ensures strong signal reception and high performance.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides good conductivity and protects against corrosion.

RF or Microwave Device Type: DOWN CONVERTER

Being a down converter, it allows for frequency down-conversion which is essential for many RF applications.

Minimum RF Input Frequency: 2300 MHz

Support for minimum RF input frequency of 2300MHz enables communication over a wide range of frequencies.

Characteristic Impedance: 50 ohm

Impedance matching of 50 ohms ensures optimal signal transfer and performance.

Minimum Intermediate Frequency (IF): 400 MHz

Support for minimum IF frequency of 400MHz allows for signal processing and filtering at lower frequencies.

Maximum Noise Figure: 7 dB

Low maximum noise figure of 7dB ensures minimal signal degradation during conversion.

Minimum Input Power (CW): 5 dBm

Low minimum input power requirement of 5dBm ensures efficient power usage and compatibility with various systems.

Maximum Intermediate Frequency (IF): 500 MHz

Support for maximum IF frequency of 500MHz allows for signal processing and filtering at higher frequencies.

Mounting Feature: SURFACE MOUNT

Surface mounting feature makes installation easy and saves space in the system setup.

Technical Specifications

RF/Microwave Up/Down Converters TRF1115IRGPRG3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Down Conversion Gain:

16 dB

Maximum Intermediate Frequency (IF):

500 MHz

Minimum Intermediate Frequency (IF):

400 MHz

Minimum Input Power (CW):

5 dBm

JESD-609 Code:

e3

LO Tunable:

YES

Mounting Feature:

Maximum Noise Figure:

7 dB

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC20,.16SQ,20

Power Supplies (V):

5

Maximum RF Input Frequency:

2700 MHz

Minimum RF Input Frequency:

2300 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

180 mA

Terminal Finish:

Matte Tin (Sn)

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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