Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF1121 by Texas Instruments is an RF up converter with a frequency range of 1500-2100 MHz. It offers LO tunability, 270-400 MHz IF, and 0 dBm max output power. Ideal for applications requiring high-frequency conversion in temperatures ranging from -40 to 85°C.
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High maximum RF output frequency allows for compatibility with a wide range of devices and systems that operate within this frequency range.
Component-based construction ensures modularity and ease of maintenance, making it an ideal choice for customization and troubleshooting.
Wide range of RF output frequencies allows for flexibility in signal processing and compatibility with various RF communication systems.
High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.
Low minimum operating temperature allows for operation in harsh environments with extreme temperature variations.
Tunable local oscillator (LO) provides flexibility in frequency conversion and signal processing, enabling precise tuning and optimization.
Up converter design enables conversion of lower frequency signals to higher frequency signals, expanding the range of compatible devices and systems.
Low minimum intermediate frequency allows for efficient signal processing and filtering, enhancing the overall performance of the converter.
High maximum output power ensures strong signal transmission and compatibility with devices that require high power levels for optimal performance.
High minimum input power handling capability allows for effective amplification and signal conversion without the risk of signal degradation or loss.
Wide range of intermediate frequencies enables versatile signal processing and conversion, making the converter suitable for a variety of RF applications.
RF/Microwave Up/Down Converters TRF1121 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments
Construction:
Maximum Intermediate Frequency (IF):
Minimum Intermediate Frequency (IF):
Minimum Input Power (CW):
LO Tunable:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Output Power:
Maximum RF Output Frequency:
Minimum RF Output Frequency:
RF or Microwave Device Type:
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Microsemi
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
LM2931AZ-5.0G
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
MMBT2907ALT1G
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MAX9996ETP+
Maxim Integrated
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Noise Figure: 9.7 dB;
UPC2722GV-E1
Renesas Electronics
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 5;
MAX2661
UP CONVERTER; JESD-609 Code: e0; Minimum RF Output Frequency: 40 MHz; Maximum Noise Figure: 8 dB; Maximum Intermediate Frequency (IF): 500 MHz; LO Tunable: YES;
UPC1694GR-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 14; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 5;
HMC951ALP4E
Analog Devices
HMC951ALP4E by Analog Devices is a RF/Microwave DOWN CONVERTER with 24 terminals, operating at 5V. It features a min Down Conversion Gain of 10 dB and LO Tunable technology. Ideal for applications requiring RF input frequencies b/w 5600-8600 MHz and intermediate frequencies up to 3500 MHz.
MAX2721EUP+
UP CONVERTER; Maximum Voltage Standing Wave Ratio: 2; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm; Maximum RF Output Frequency: 2500 MHz; Maximum Output Power: -2.5 dBm;
ADMV7320BCEZ
Analog Devices' ADMV7320BCEZ is an RF up converter with a frequency range of 81-86 GHz. It features a VSWR of 1.43, LO tunability, and operates in temperatures from -40 to 85 °C. Ideal for applications requiring high-frequency conversion in RF/microwave systems.
MAX9996ETP+T
Analog Devices' MAX9996ETP+T is a BICMOS RF Down Converter with 5V supply, 20 terminals, and -40 to 85 °C operating range. It offers 7dB min gain, LO tunability, and 9.7dB max noise figure. Ideal for RF applications from 1700-2200MHz requiring surface mount packaging and 50Ω impedance.
MAX2322EUP+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; JESD-609 Code: e3; Minimum RF Input Frequency: 1800 MHz;
MAX2114UGH
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 44; Package Body Material: PLASTIC/EPOXY; Maximum RF Input Frequency: 2175 MHz; Minimum Input Power (CW): -25 dBm;
MAX2673EUA+T
UP CONVERTER; Minimum Up Conversion Gain: 7.8 dB; Maximum Intermediate Frequency (IF): 500 MHz; Minimum Operating Temperature: -40 Cel; JESD-609 Code: e3; Maximum RF Output Frequency: 2500 MHz;
UPC2722GR-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;
TRF1222IRTMR
Texas Instruments
TRF1222IRTMR by Texas Instruments is a RF up converter with freq range 3300-3800 MHz, gain of 22 dB, and power supply of 5V. Ideal for applications requiring high frequency conversion in RF/Microwave systems. Package: PLASTIC/EPOXY, Terminals: 32, Temp Range: -40 to +85 °C.
HMC815LC5
HMC815LC5 by Analog Devices is an RF up converter with a frequency range of 21-27 GHz and gain of 7 dB. It operates in temperatures from -55°C to 85°C, making it suitable for various RF/microwave applications requiring high-frequency conversion. The device features LO tunability, gold over nickel terminal finish, and impedance of 50 ohms.
UPC2757TB
DOWN CONVERTER; Maximum Intermediate Frequency (IF): 300 MHz; Minimum RF Input Frequency: 100 MHz; Maximum Operating Temperature: 85 Cel; Maximum Noise Figure: 16 dB; Characteristic Impedance: 50 ohm;
TRF1121IRGZRG3
TRF1121IRGZRG3 by Texas Instruments is an RF up converter with a frequency range of 1500-2500 MHz. It operates on a 5V power supply, has 48 terminals, and can handle temperatures from -40 to 85°C. This component is ideal for applications requiring high-frequency conversion in RF/microwave systems.
MC44S803EP
UP/DOWN CONVERTER;
MAX2324EUP+T
DOWN CONVERTER; Terminal Finish: Matte Tin (Sn); Maximum Noise Figure: 11.5 dB; Minimum Operating Temperature: -40 Cel; Minimum Down Conversion Gain: 11.3 dB; LO Tunable: YES;
MAX2683EUE
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum RF Input Frequency: 3800 MHz; Construction: COMPONENT;
UPC1686B
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: CERAMIC; Technology: BIPOLAR; JESD-609 Code: e0;
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DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TRF1122IRTMR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Maximum RF Output Frequency: 2700 MHz; Power Supplies (V): 5;
TRF1115IRGPTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Maximum Noise Figure: 7 dB;
TRF1112IRGZRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Minimum RF Output Frequency: 1700 MHz;
TRF1121IRGZTG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Maximum Intermediate Frequency (IF): 350 MHz;
TRF1121IRGZ
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
TRF1115IRGPRG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Maximum Noise Figure: 7 dB; Maximum Supply Current: 180 mA;
TRF1122IRTMRG3
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Additional Features: TTL COMPATIBLE; Characteristic Impedance: 50 ohm;
TRF1015DB-00
DOWN CONVERTER; Maximum RF Input Frequency: 894 MHz; Additional Features: LOW NOISE; Maximum Operating Temperature: 85 Cel; Minimum Down Conversion Gain: 9 dB; Minimum RF Input Frequency: 869 MHz;
TRF1112IRGZT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1121IRGZT
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel;
TRF1121IRGZR
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; LO Tunable: YES;
TRF1115IRGPR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 16 dB; Maximum Noise Figure: 7 dB;
TRF1122
UP CONVERTER; Minimum RF Output Frequency: 2100 MHz; Minimum Up Conversion Gain: 20 dB; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;
TRF1112IRGZR
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC48,.27SQ,20; Minimum Intermediate Frequency (IF): 400 MHz;
TRF1115IRGPT
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Input Power (CW): 5 dBm; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1015DB
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Additional Features: LOW NOISE;
TRF1112
DOWN CONVERTER; LO Tunable: YES; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Maximum Noise Figure: 4.7 dB; Maximum Intermediate Frequency (IF): 500 MHz;
TRF1112IRGZTG3
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Minimum Down Conversion Gain: 90 dB; Minimum Input Power (CW): 20 dBm;
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Construction: COMPONENT; Power Supplies (V): 5;
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