Loading...

TFF1017HN/N1,115

NXP Semiconductors

TFF1017HN/N1,115 by NXP Semiconductors

TFF1017HN/N1,115 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,820

-

-

-

-

Digiode

USA . 1,823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,823

-

-

-

-

Anansix

USA . 1,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,605

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 148 parts In-Stock

1+ parts

$12.760

100+ parts

-

1k+ parts

-

10k+ parts

-

148

$12.760

-

-

-

One Stop Electronics

USA . 899 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

-

899

$14.000

-

-

-

Corphita

USA . 4,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,850

-

-

-

-

UNI Independent Distributors

Spain . 942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

942

-

-

-

-

Perfect Parts

USA . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Overview

Elevate your RF and microwave applications with the TFF1017HN/N1,115 from NXP Semiconductors. Renowned for their innovation and reliability, NXP ensures this high-performance converter delivers exceptional quality and efficiency for various uses, from telecommunications to industrial systems. With a robust temperature range and user-friendly surface mount design, it empowers engineers to achieve superior results while minimizing complexity. Experience unmatched value and seamless integration that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers a lightweight construction, which is advantageous for applications where weight is a critical factor.

Power Supplies (V): 5

Operating at a low power supply requirement of 5V ensures compatibility with various systems and contributes to lower power consumption, making it energy-efficient.

No. of Terminals: 16

Having 16 terminals provides flexibility in design and integration, allowing for various connection options and enhanced performance in RF/Microwave applications.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures reliability and durability in high-temperature environments common in RF applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for extreme environments, ensuring robust performance in diverse conditions.

Mounting Feature: SURFACE MOUNT

Surface mount technology allows for compact designs and efficient use of PCB space, facilitating easy integration into advanced electronic systems.

Technical Specifications

RF/Microwave Up/Down Converters TFF1017HN/N1,115 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC16,.1X.14,20

Power Supplies (V):

5

Sub-Category:

RF/Microwave Up/Down Converters

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11