Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TFF1017HN/N1,115 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Digiode
Anansix
AZTECH Wire
$12.760
One Stop Electronics
$14.000
Corphita
UNI Independent Distributors
Perfect Parts
The use of plastic/epoxy for the package body offers a lightweight construction, which is advantageous for applications where weight is a critical factor.
Operating at a low power supply requirement of 5V ensures compatibility with various systems and contributes to lower power consumption, making it energy-efficient.
Having 16 terminals provides flexibility in design and integration, allowing for various connection options and enhanced performance in RF/Microwave applications.
The ability to operate at a maximum temperature of 85 °C ensures reliability and durability in high-temperature environments common in RF applications.
With a minimum operating temperature of -40 °C, this product is ideal for extreme environments, ensuring robust performance in diverse conditions.
Surface mount technology allows for compact designs and efficient use of PCB space, facilitating easy integration into advanced electronic systems.
RF/Microwave Up/Down Converters TFF1017HN/N1,115 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from NXP Semiconductors
Mounting Feature:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
Sub-Category:
PCN Obsolescence/ EOL - Mult Devices EOL 30/Nov/2017
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Panjit International
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
SPC TECHNOLOGY/ MULTICOMP
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Starsea Electronics
LM317LMX/NOPB
Texas Instruments
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
MBRS360T3G
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
LM7805CT
LM7805CT by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a dropout voltage of 2V, and offers excellent line/load regulation for various electronic applications.
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Db Lectro
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
HPMX-7113-TR1
Broadcom
DOWN CONVERTER; Maximum Operating Temperature: 85 Cel; Minimum Down Conversion Gain: 10 dB; Minimum Intermediate Frequency (IF): 50 MHz; LO Tunable: NO; Maximum Intermediate Frequency (IF): 400 MHz;
TRF1015DB
TRF1015DB by Texas Instruments is a 20-terminal RF down converter with LO tunability. It operates b/w -40°C to 85°C, offering a min gain of 9 dB and supporting RF input frequencies from 869 MHz to 894 MHz. Ideal for applications requiring surface mount components in the RF/Microwave domain.
HPMX-7201-TR1
UP CONVERTER; Construction: COMPONENT; Terminal Finish: Tin/Lead (Sn/Pb); LO Tunable: YES; JESD-609 Code: e0; Minimum RF Output Frequency: 824 MHz;
UPC2758TB-E3-A
California Eastern Laboratories
DOWN CONVERTER; Minimum Intermediate Frequency (IF): 20 MHz; Maximum Noise Figure: 15 dB; Maximum Intermediate Frequency (IF): 300 MHz; Minimum Down Conversion Gain: 14 dB; LO Tunable: YES;
MAX2673
Maxim Integrated
UP CONVERTER; JESD-609 Code: e0; Minimum Up Conversion Gain: 12 dB; Maximum Intermediate Frequency (IF): 500 MHz; Minimum RF Output Frequency: 40 MHz; Maximum Noise Figure: 8 dB;
MAX2410EEI
UP/DOWN CONVERTER; Maximum Intermediate Frequency (IF): 450 MHz; Maximum Operating Temperature: 85 Cel; Minimum Up Conversion Gain: 8.6 dB; Minimum Input Power (CW): -17 dBm; Minimum Operating Temperature: -40 Cel;
SN761688PW
SN761688PW by Texas Instruments is a RF/Microwave DOWN CONVERTER with 16 terminals, operating at 5V. It offers a min Down Conversion Gain of 21 dB and Max Noise Figure of 10 dB. Ideal for applications requiring surface mount components in temperature range -20 to 85°C.
UPC1687B
Renesas Electronics
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: CERAMIC; Technology: BIPOLAR; Minimum Operating Temperature: -55 Cel;
UPC2722GR-E2
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Terminal Finish: Tin/Lead (Sn/Pb);
MAX9984ETP+TD
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Terminal Finish: MATTE TIN;
Analog Devices' MAX2673 is an RF up converter with a frequency range of 40-2500 MHz and 12 dB gain. It features a noise figure of 8 dB, LO tunability, and IF range of 10-500 MHz. Ideal for applications requiring high-frequency conversion in RF/microwave systems.
HMC265
HMC265 by Analog Devices is an RF/Microwave DOWN CONVERTER with a frequency range of 20-32 GHz. It features a min down conversion gain of -2 dB and LO tunable capability. Ideal for applications requiring high-frequency signal processing in environments with temperatures ranging from -55 to 85°C.
HMC925LC5
Analog Devices' HMC925LC5 is an RF up converter with 5500-8600 MHz output frequency range, 14 dB gain, and LO tunability. Ideal for applications requiring high-frequency conversion in RF/microwave systems, it operates b/w -40 to 85°C with gold over nickel terminal finish.
ADMV1014ACCZ-R7
ADMV1014ACCZ-R7 by Analog Devices is a RF/Microwave DOWN CONVERTER with 32 terminals, LO Tunable, and 50 ohm Impedance. It operates b/w -40 to 85 °C with RF Input Frequency range of 24-44 GHz. Ideal for applications requiring high-performance RF signal conversion in compact form factor.
MAX2682
DOWN CONVERTER; Maximum Intermediate Frequency (IF): 500 MHz; Minimum Down Conversion Gain: 14.7 dB; Maximum RF Input Frequency: 2500 MHz; Minimum Intermediate Frequency (IF): 10 MHz; Terminal Finish: TIN LEAD;
ADMV7410BCEZ
Analog Devices' ADMV7410BCEZ is a RF/Microwave DOWN CONVERTER with LO Tunable feature. It offers 7 dB Min Down Conversion Gain, 1.92 Max VSWR, and 8 dB Max Noise Figure. Ideal for applications requiring RF signal conversion in the frequency range of 71-76 GHz with a characteristic impedance of 100 ohm.
LA7784FN
LA7784FN by Onsemi is a 32-terminal RF/Microwave Up/Down Converter with 5V power supply. It operates b/w -20 °C to 70°C, suitable for surface mount applications in various electronic devices. The package body material is plastic/epoxy, ensuring durability and reliability in diverse environments.
HMC967LP4ETR
Analog Devices' HMC967LP4ETR is a GaAs technology RF down converter with 24 terminals, operating b/w -55 °C to 85°C. It requires a 4.5V power supply and draws a max current of 200mA. Ideal for RF/Microwave applications, it features a surface mount package body made of plastic/epoxy with matte tin terminal finish.
MAX2106CCM
DOWN CONVERTER; Minimum Operating Temperature: 0 Cel; Construction: COMPONENT; Maximum RF Input Frequency: 2175 MHz; Characteristic Impedance: 50 ohm; LO Tunable: NO;
MAX2329EUP
DOWN CONVERTER; JESD-609 Code: e0; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Terminal Finish: TIN LEAD;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TFF1004HN/N1/T3
NXP Semiconductors
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 3.3; Maximum Operating Temperature: 85 Cel;
TFF1012HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 5;
TFF1012HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 5;
TFF1013HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Maximum Operating Temperature: 85 Cel;
TFF1014HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Package Equivalence Code: LCC16,.1X.14,20;
TFF1014HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
TFF1015HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
TFF1015HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; Package Equivalence Code: LCC16,.1X.14,20;
TFF1017HN/N1,135
TFF1018HN/N1,115
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC16,.1X.14,20; Minimum Operating Temperature: -40 Cel;
TFF1018HN/N1,135
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Package Equivalence Code: LCC16,.1X.14,20;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved