Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;
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RF/Microwave Up/Down Converters UPC2722GR-E3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Renesas Electronics
JESD-609 Code:
Mounting Feature:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
Sub-Category:
Maximum Supply Current:
Technology:
Terminal Finish:
BAV99
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
2N7002
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
Nexperia
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
RC0603JR-070RL
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
UPC8187TB-E3-A
Renesas Electronics
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;
MAX2410EEI+T
Maxim Integrated
UP/DOWN CONVERTER; Minimum Down Conversion Gain: 6.6 dB; Maximum RF Input Frequency: 1900 MHz; Maximum Intermediate Frequency (IF): 450 MHz; Maximum Operating Temperature: 85 Cel; Maximum RF Output Frequency: 1900 MHz;
TFF1014HN/N1,135
TFF1014HN/N1,135 by NXP Semiconductors is an RF/Microwave Up/Down Converter with a 5V power supply and operates b/w -40 °C to 85 °C. It features a surface mount design with 16 terminals, ideal for compact applications in communication systems. This converter enhances signal processing efficiency in various RF applications.
MAX9986ETP+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum RF Input Frequency: 995 MHz;
TA4103F
Toshiba
UP CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Terminal Finish: Tin/Lead (Sn/Pb);
UPC2756TB-E3-A
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Maximum Supply Current: 8 mA;
UPB1005GS-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 30; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Package Equivalence Code: SSOP30,.3;
HMC112
Analog Devices
RF/Microwave Up/Down Converters; Technology: GAAS; Package Equivalence Code: DIE OR CHIP; Power Supplies (V): 5; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -55 Cel;
TRF1222IRTMTG3
TRF1222IRTMTG3 by Texas Instruments is an RF up converter with freq range 3300-3800 MHz, gain of 22 dB, and operates at -40 to 85°C. It has 32 terminals, requires 5V power supply, and supports input power of 10 dBm CW. Ideal for RF/microwave applications requiring surface mount components.
MAX9993ETP+T
DOWN CONVERTER; Minimum RF Input Frequency: 1700 MHz; Minimum Operating Temperature: -40 Cel; Minimum Intermediate Frequency (IF): 50 MHz; Maximum RF Input Frequency: 2200 MHz; Minimum Input Power (CW): 22 dBm;
MAX2324EUP+
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Characteristic Impedance: 50 ohm; Maximum Intermediate Frequency (IF): 400 MHz;
MAX2662EUT-T
Analog Devices' MAX2662EUT-T is an RF up converter with 2500 MHz max output freq. Operating temp range -40 to 85 °C. Ideal for applications requiring IF b/w 10-500 MHz, offering TIN LEAD terminal finish.
UPC2758TB-E3-A
California Eastern Laboratories
DOWN CONVERTER; Minimum Intermediate Frequency (IF): 20 MHz; Maximum Noise Figure: 15 dB; Maximum Intermediate Frequency (IF): 300 MHz; Minimum Down Conversion Gain: 14 dB; LO Tunable: YES;
TRF1216IRGPR
TRF1216IRGPR by Texas Instruments is a RF down converter with 27 dB min gain, LO tunable feature, and 5V power supply. It operates b/w -40 to 85°C and supports RF input frequencies from 3300-3800 MHz. Ideal for applications requiring surface mounting and 50 ohm impedance.
UPC2775GS-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 9;
MAX2680EUT
MAX2680EUT by Maxim Integrated is an RF Down Converter with VSWR of 1.5, LO Tunable feature, and -40 to 85°C operating temperature range. It operates from 400 MHz to 2500 MHz RF input frequency, providing a min gain of 5.7 dB at a 50 ohm impedance. Ideal for applications requiring precise RF to IF conversion in various electronic systems.
TRF1015DB-00
TRF1015DB-00 by Texas Instruments is an RF/Microwave DOWN CONVERTER with 9 dB Min. Down Conversion Gain, LO Tunable feature, and 869-894 MHz RF Input Frequency range. It operates b/w -40 to +85 °C and has a 50 ohm Impedance. Ideal for wireless communication systems requiring frequency conversion.
HMC6505ALC5TR-R5
Analog Devices' HMC6505ALC5TR-R5 is a RF up converter with 5500-8600 MHz output frequency range, 12 dB min gain, and 22 dBm max output power. Ideal for applications requiring high-frequency conversion in RF/microwave systems.
MAX2700ECM
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Maximum Supply Current: 230 mA; Package Equivalence Code: TQFP48,.35SQ;
MAX2329EUP
DOWN CONVERTER; Minimum Operating Temperature: -40 Cel; Terminal Finish: TIN LEAD; LO Tunable: NO; Maximum Operating Temperature: 85 Cel; JESD-609 Code: e0;
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UPC2758TB-E3-A by Renesas Electronics is a RF/Microwave Up/Down Converter with 6 terminals and a max supply current of 14.8 mA. It operates in temperatures ranging from -40 to 85 °C and is suitable for surface mount applications.
UPC2756TB
DOWN CONVERTER; Terminal Finish: Tin/Lead (Sn/Pb); Minimum RF Input Frequency: 100 MHz; LO Tunable: YES; Minimum Intermediate Frequency (IF): 10 MHz; Minimum Down Conversion Gain: 11 dB;
UPC2721GV-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Terminal Finish: Tin/Lead (Sn/Pb);
UPC2731GS
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -20 Cel;
UPC2753GR
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 8.5 mA;
UPC2756TB-A
DOWN CONVERTER; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; Maximum RF Input Frequency: 2000 MHz; Maximum Noise Figure: 16 dB; Maximum Intermediate Frequency (IF): 300 MHz;
UPC2721GR-E2
UPC2734GR
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e0;
UPC2721GV-E1-A
DOWN CONVERTER; Minimum RF Input Frequency: 900 MHz; Maximum RF Input Frequency: 2000 MHz; Minimum Down Conversion Gain: 18 dB; Maximum Noise Figure: 15 dB; JESD-609 Code: e6;
UPC2743GS
UPC2744GS-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 59 mA;
UPC2722GR-E2
UPC2756T
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;
UPC2721GV-A
DOWN CONVERTER; Minimum Down Conversion Gain: 18 dB; Maximum Operating Temperature: 85 Cel; Minimum RF Input Frequency: 900 MHz; Characteristic Impedance: 50 ohm; Minimum Intermediate Frequency (IF): 50 MHz;
UPC2743GS-E1
UPC2722GV-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 5;
UPC2721GR-E1
UPC2721GR-E3
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