Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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UPC2758TB-E3-A by Renesas Electronics is a RF/Microwave Up/Down Converter with 6 terminals and a max supply current of 14.8 mA. It operates in temperatures ranging from -40 to 85 °C and is suitable for surface mount applications.
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Vyrian
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QUARKTWIN TECHNOLOGY LTD
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Perfect Parts
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Benley Electronics
Bastille Electronics
The plastic/epoxy package body material of this RF/Microwave Up/Down Converter ensures durability and efficient heat dissipation, making it a reliable choice for long-term use.
Operating on a power supply of 3V, this RF/Microwave Up/Down Converter offers low power consumption, resulting in reduced energy costs and prolonged battery life, making it an economical and environmentally friendly option.
With 6 terminals available, this RF/Microwave Up/Down Converter provides flexibility for easy and efficient connectivity, allowing for seamless integration into various systems.
The ability to operate at a maximum temperature of 85°C ensures the stability and reliability of this RF/Microwave Up/Down Converter even under demanding conditions, making it suitable for a wide range of applications.
With a minimum operating temperature of -40°C, this RF/Microwave Up/Down Converter is designed to withstand extreme cold environments, ensuring its functionality and suitability for diverse operating conditions.
Operating at a maximum supply current of 14.8 mA, this RF/Microwave Up/Down Converter exhibits low power consumption, making it ideal for energy-efficient systems.
Featuring a surface mounting feature, this RF/Microwave Up/Down Converter offers easy and secure installation, enhancing its usability and convenience in various applications.
RF/Microwave Up/Down Converters UPC2758TB-E3-A attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Renesas Electronics
Mounting Feature:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
Sub-Category:
Maximum Supply Current:
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Fairchild Semiconductor
BAV99
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
Taitron Components
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
Micro Commercial Components
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
AAMGP-6551-TR2G
Broadcom
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: METAL; Package Equivalence Code: LCC8,.2SQ,28; Power Supplies (V): 3.5;
HMC1190ALP6NE
Analog Devices
HMC1190ALP6NE by Analog Devices is a RF/Microwave DOWN CONVERTER with 40 terminals, LO Tunable feature, and 3.3V power supply. It operates b/w -40 to 85 °C, has a min down conversion gain of 4.7 dB, and supports RF input frequencies from 700 MHz to 3800 MHz. Ideal for applications requiring high-performance RF signal processing in various electronic systems.
STB5600TR
DOWN CONVERTER; Construction: COMPONENT; LO Tunable: NO; Minimum Down Conversion Gain: 35 dB;
MAX2116UTL+
Maxim Integrated
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 40; Package Body Material: PLASTIC/EPOXY; LO Tunable: YES; Construction: COMPONENT;
MAX2680EUT+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Intermediate Frequency (IF): 500 MHz;
TFF1017HN/N1,115
NXP Semiconductors
TFF1017HN/N1,115 by NXP Semiconductors is an RF/Microwave Up/Down Converter designed for surface mount applications. It operates b/w -40 °C to 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.
MAX2116UTL+T
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 40; Package Body Material: PLASTIC/EPOXY; Minimum RF Input Frequency: 925 MHz; Maximum Supply Current: 265 mA;
MAX2114UGH-D
DOWN CONVERTER; Minimum RF Input Frequency: 925 MHz; Minimum Input Power (CW): -25 dBm; Minimum Operating Temperature: 0 Cel; Terminal Finish: Tin/Lead (Sn/Pb); LO Tunable: YES;
MAX9996ETP+
Analog Devices' MAX9996ETP+ is a BICMOS RF Down Converter with 5V supply, 240mA current, and -40 to 85 °C operating range. It features LO tuning, 7dB min gain, and 9.7dB max noise figure for applications in RF/Microwave systems requiring down conversion from 1700-2200MHz input to 40-350MHz IF signals.
TFF1012HN/N1,115
TFF1012HN/N1,115 by NXP Semiconductors is an RF/Microwave up/down converter designed for surface mount applications. It operates b/w -40 °C to 85 °C and requires a 5V power supply with 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.
MAX2406EEP+T
DOWN CONVERTER; Terminal Finish: MATTE TIN; Minimum Operating Temperature: -40 Cel; Minimum Input Power (CW): -10 dBm; Maximum RF Input Frequency: 1900 MHz; JESD-609 Code: e3;
HMC7912LP5ETR
Analog Devices' HMC7912LP5ETR is a RF up converter with 21-24 GHz output frequency range, 10 dB min gain, and 4 dBm max output power. Ideal for applications requiring high-frequency conversion in RF/microwave systems.
MAX19997AETX+TD
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Operating Temperature: 85 Cel;
MAX2116UTL
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 40; Package Body Material: CERAMIC; LO Tunable: YES; Terminal Finish: Tin/Lead (Sn85Pb15);
ADMV4630BCPZN-RL7
UP CONVERTER;
TRF1221IRGZTG3
Texas Instruments
TRF1221IRGZTG3 by Texas Instruments is an RF up converter with a frequency range of 1700-3600 MHz. It operates at temperatures from -40 to 85°C, with a max output power of 0 dBm. Ideal for applications requiring high-frequency conversion in wireless communication systems.
UPC2731GS
Renesas Electronics
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -20 Cel;
UPC8104GR-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;
MAX2661EUT+T
UP CONVERTER; Minimum Intermediate Frequency (IF): 40 MHz; Minimum RF Output Frequency: 400 MHz; Minimum Operating Temperature: -40 Cel; Maximum Noise Figure: 11.8 dB; Maximum Voltage Standing Wave Ratio: 2.2;
MRFIC1502
DOWN CONVERTER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 48; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum RF Input Frequency: 1575 MHz;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
UPC2758TB-E3-A
California Eastern Laboratories
DOWN CONVERTER; Minimum Intermediate Frequency (IF): 20 MHz; Maximum Noise Figure: 15 dB; Maximum Intermediate Frequency (IF): 300 MHz; Minimum Down Conversion Gain: 14 dB; LO Tunable: YES;
UPC2756TB
DOWN CONVERTER; Terminal Finish: Tin/Lead (Sn/Pb); Minimum RF Input Frequency: 100 MHz; LO Tunable: YES; Minimum Intermediate Frequency (IF): 10 MHz; Minimum Down Conversion Gain: 11 dB;
UPC2721GV-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Terminal Finish: Tin/Lead (Sn/Pb);
UPC2753GR
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 8.5 mA;
UPC2722GR-E3
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;
UPC2756TB-A
DOWN CONVERTER; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; Maximum RF Input Frequency: 2000 MHz; Maximum Noise Figure: 16 dB; Maximum Intermediate Frequency (IF): 300 MHz;
UPC2721GR-E2
UPC2734GR
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e0;
UPC2721GV-E1-A
DOWN CONVERTER; Minimum RF Input Frequency: 900 MHz; Maximum RF Input Frequency: 2000 MHz; Minimum Down Conversion Gain: 18 dB; Maximum Noise Figure: 15 dB; JESD-609 Code: e6;
UPC2743GS
UPC2744GS-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 59 mA;
UPC2722GR-E2
UPC2756T
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;
UPC2721GV-A
DOWN CONVERTER; Minimum Down Conversion Gain: 18 dB; Maximum Operating Temperature: 85 Cel; Minimum RF Input Frequency: 900 MHz; Characteristic Impedance: 50 ohm; Minimum Intermediate Frequency (IF): 50 MHz;
UPC2743GS-E1
UPC2722GV-E1
RF/Microwave Up/Down Converters; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 5;
UPC2721GR-E1
UPC2721GR-E3
Supply Digital Components
$106.00
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12,000 In-Stock
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