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MAX9996ETP+D

Analog Devices

MAX9996ETP+D by Analog Devices

MAX9996ETP+D by Analog Devices is a BICMOS RF Down Converter with 20 terminals, operating at -40 to 85 °C. It offers a min down conversion gain of 7 dB, noise figure of 9.7 dB, and supports RF input frequencies from 1700 to 2200 MHz. Ideal for applications requiring high-performance RF/microwave up/down conversion in surface mount configurations.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,771 parts In-Stock

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Anansix

USA . 1,818 parts In-Stock

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Digiode

USA . 411 parts In-Stock

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Connector Distribution Corp

USA . 60 parts In-Stock

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60

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Right Parts Inc.

USA . 60 parts In-Stock

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60

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MARBEL Systems

Belgium . 58 parts In-Stock

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$1.141

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Texas Native Microelectronics

USA . 740 parts In-Stock

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$1.311

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$1.259

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$1.219

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$1.154

740

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Kenton Components

USA . 200 parts In-Stock

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$1.573

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$1.384

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Qasali Group International

UK . 100 parts In-Stock

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$3.540

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$3.292

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$3.115

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Semicontronic

India . 566 parts In-Stock

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$7.000

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$6.825

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$6.790

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AZTECH Wire

Italy . 426 parts In-Stock

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$8.694

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One Stop Electronics

USA . 1,724 parts In-Stock

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Component Stockers USA

USA . 538 parts In-Stock

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$99.990

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Corphita

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Overview

Elevate your RF/Microwave system with the MAX9996ETP+D by Analog Devices, a top-of-the-line component that offers unparalleled performance and reliability. Designed with precision and expertise, this down converter is perfect for a wide range of applications, providing a minimum conversion gain of 7dB and a maximum noise figure of 9.7dB. Whether you're in the aerospace, defense, or telecommunications industry, this high-quality product will enhance your system's efficiency and accuracy. Trust Analog Devices to deliver cutting-edge technology that exceeds expectations. Upgrade to the MAX9996ETP+D today and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to external environmental factors, making the product suitable for various operating conditions.

Construction: COMPONENT

Component construction typically offers reliability and consistency in performance, ensuring stable operation of the up/down converter.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of power sources and systems.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and integration with other components in the system.

Maximum Operating Temperature: 85 °C

Ability to withstand high operating temperatures ensures reliable performance even in demanding environments.

Minimum Down Conversion Gain: 7 dB

A minimum down conversion gain of 7 dB indicates a strong signal conversion capability, ensuring efficient signal processing and transmission.

Minimum Operating Temperature: -40 °C

Capability to operate at low temperatures makes the product suitable for a wide range of temperature conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and durability to the terminals, ensuring stable connections over time.

LO Tunable: YES

Having a LO tunable feature allows for flexibility in adjusting the oscillator frequency, enabling fine-tuning of the conversion process.

Technology: BICMOS

Utilizing BiCMOS technology offers a balance between high-speed operation and low power consumption, making the product efficient and reliable.

Maximum Supply Current: 240 mA

Operating at a maximum supply current of 240 mA indicates low power consumption, making it energy-efficient and cost-effective.

RF or Microwave Device Type: DOWN CONVERTER

Being a down converter, the product is designed to convert higher frequency RF signals into lower intermediate frequency signals, suitable for further processing.

Minimum RF Input Frequency: 1700 MHz

Capable of processing signals with a minimum input frequency of 1700 MHz, allowing for a wide range of RF signals to be converted.

Characteristic Impedance: 50 ohm

Having a characteristic impedance of 50 ohms ensures compatibility with standard RF systems and components, facilitating seamless integration.

Minimum Intermediate Frequency (IF): 40 MHz

Ability to provide an intermediate frequency as low as 40 MHz allows for efficient signal processing and filtering before further transmission.

Maximum RF Input Frequency: 2200 MHz

Capable of handling signals with a maximum input frequency of 2200 MHz, making it suitable for a wide range of RF applications.

Maximum Noise Figure: 9.7 dB

Having a maximum noise figure of 9.7 dB indicates low noise and interference levels, ensuring clean and clear signal conversion.

Maximum Intermediate Frequency (IF): 350 MHz

Providing an intermediate frequency output of up to 350 MHz allows for flexibility in signal processing and customization according to system requirements.

Mounting Feature: SURFACE MOUNT

Surface mount capability enables easy and secure installation on PCBs, saving space and simplifying the integration process.

Technical Specifications

RF/Microwave Up/Down Converters MAX9996ETP+D attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Analog Devices

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Down Conversion Gain:

7 dB

Maximum Intermediate Frequency (IF):

350 MHz

Minimum Intermediate Frequency (IF):

40 MHz

JESD-609 Code:

e3

LO Tunable:

YES

Mounting Feature:

Maximum Noise Figure:

9.7 dB

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC20,.20SQ,25

Power Supplies (V):

5

Maximum RF Input Frequency:

2200 MHz

Minimum RF Input Frequency:

1700 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

240 mA

Technology:

Terminal Finish:

Matte Tin (Sn) - annealed

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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